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Method and apparatus for cooling a circuit component 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0383647 (2006-05-16)
등록번호 US-8665595 (2014-03-04)
발명자 / 주소
  • Wyatt, William Gerald
  • Schwartz, Gary J.
출원인 / 주소
  • OL Security Limited Liability Company
인용정보 피인용 횟수 : 1  인용 특허 : 38

초록

An apparatus includes a thermally conductive section with a side facing approximately parallel to an axis and adapted to be thermally coupled to a circuit component, and includes a fluid supply section which directs a fluid flow along the axis toward an opposite side of the thermally conductive sect

대표청구항

1. An apparatus comprising: a thermally conductive section having a side which faces in a direction approximately parallel to an axis, and which is adapted to be thermally coupled to a circuit component; anda fluid supply section disposed on a side of said thermally conductive section opposite from

이 특허에 인용된 특허 (38)

  1. Lemont Andrew I. ; Radziunas Jeffrey, Active heat sink structure with flow augmenting rings and method for removing heat.
  2. Ogawa, Takaya; Inagaki, Satoru; Ikuma, Yoshiyuki, Antenna apparatus for performing wireless communication or broadcasting by selecting one of two types of linearly polarized waves.
  3. Lin Mike (No. 56 ; Lane 55 Dong-Rong Rd. ; Sei-Rong Village Da-Lei Hsiang ; Tai-Chung Hsien TWX), CPU heat dissipating device.
  4. Kamekawa Yutaka,JPX ; Nakayama Kiyoshi,JPX ; Nakamura Satoshi,JPX, Cooling radiator.
  5. Watanabe, Michinori; Ogawara, Toshiki; Iijima, Masayuki; Maruyama, Haruhisa, Electronic component cooling apparatus.
  6. Morosas Christopher G. (Sutton MA), Fan driven heat sink.
  7. Herbert Edward, Fan with heat sink using stamped heat sink fins.
  8. Byung Ha Kang KR; Seo Young Kim KR; Jin Wook Pack KR, Foam metal heat sink.
  9. Wotring Blaine C., Folded fin heat sink and a heat exchanger employing the heat sink.
  10. Jackie Lin TW, Heat dissipating device adapted to be applied to a flip chip device.
  11. Wang, Jack; Cheng, Cheng-Hua; Lin, Michael; Ma, Charles, Heat dissipating fin.
  12. Jean Amigo (No. 18 ; Alley 5 ; Lane 19 ; Nu-Chung Rd. I-Lan City TWX), Heat dissipation device for an integrated circuit.
  13. Ming-Chen Lin TW, Heat dissipation device with ribbed fin plates.
  14. Luo, Chin-Kuang, Heat dissipator.
  15. Batchelder John Samuel, Heat exchange apparatus.
  16. Okochi Takaki,JPX ; Yamaguchi Hiroo,JPX ; Hayashi Takayuki,JPX ; Kafuku Kazuaki,JPX, Heat generating element cooling unit with louvers.
  17. Chen,Chun Chi; Zhang,Jianjun, Heat sink.
  18. Hoshino Izumi,JPX ; Matsushima Hideo,JPX, Heat sink apparatus for an electronic component.
  19. Wang Michael (Taipei Hsien TWX), Heat sink assembly for a central processing unit of a computer.
  20. Chun-Chi Chen TW, Heat sink assembly with dual fans.
  21. Dean Ronald P., Heat sink device having radial heat and airflow paths.
  22. Katsui Tadashi (Kawasaki JPX) Nakata Katsuhiko (Kawasaki JPX) Koga Takeshi (Kawasaki JPX) Matsumura Tadanobu (Kawasaki JPX) Tanaka Yoshimi (Kawasaki JPX) Sugimoto Yasuaki (Kawasaki JPX) Kitahara Taka, Heat sink for cooling a heat producing element and application.
  23. Feng Ku Wang TW, Heat sink modular structure inside an electronic product.
  24. Ashiwake Noriyuki (Tsuchiura JPX) Daikoku Takahiro (Ushiku JPX) Hatsuda Toshio (Ibaraki JPX) Zushi Shizuo (Hadano NY JPX) Kobayashi Satomi (Rye NY), Heat sinks and semiconductor cooling device using the heat sinks.
  25. Gary Lynn Eesley ; Donald T. Morelli ; Mohinder Singh Bhatti, High performance heat exchange assembly.
  26. Lapinski John R. (St. Charles MO) Grote Michael G. (St. Louis MO), Isothermal multi-passage cooler.
  27. Arai Masatsugu (Ibaraki JPX) Kohno Akiomi (Ibaraki JPX) Hatada Toshio (Tsuchiura JPX) Kondo Yoshihiro (Hadano JPX) Komatsu Toshihiro (Ibaraki JPX) Otsuka Kanji (Higashiyamoto JPX) Shirai Yuji (Kodair, LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted.
  28. Wyatt, William Gerald; Schwartz, Gary J., Method and apparatus for cooling a portable computer.
  29. Wyatt, William Gerald; Gilstrap, Jeffrey A.; Schwartz, Gary J., Method and apparatus for removing heat from a plate.
  30. DiStefano, Eric; Seshan, Krishna, Mobile computer having a housing with openings for cooling.
  31. Widmayer Robert B. (Harvard IL), Pneumatically coupled heat sink assembly.
  32. Ohashi Shigeo (Tsuchiura JPX) Nakajima Tadakatsu (Ibaraki-ken JPX) Kondo Yoshihiro (Ibaraki-ken JPX) Honma Mitsuru (Ibaraki-ken JPX) Onishi Kenji (Hadano JPX) Tsuzaki Hiroshi (Owariasahi JPX) Matsush, Portable computer with fan moving air from a first space created between a keyboard and a first circuit board and a seco.
  33. Ohgami Keizo,JPX ; Shibasaki Kazuya,JPX ; Itoh Hironori,JPX, Portable electronic apparatus having the heat radiation device for circuit module.
  34. Gabuzda Paul G. (Laguna Beach CA), Reduced-stress heat sink device.
  35. Gabuzda Paul G. (Laguna Beach CA), Segmented heat sink device.
  36. Gabuzda Paul G. (Laguna Beach CA) Terrell Sanford V. (Laguna Hills CA), Staggered radial-fin heat sink device for integrated circuit package.
  37. Nakamura Hiroshi (Tokyo JPX) Tomioka Kentaro (Sagamihara JPX) Ninomiya Kiyoumi (Tokyo JPX) Ogawa Hideki (Tokyo JPX) Nakajima Yuji (Tokyo JPX), Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and po.
  38. Fargo Chou TW, Structure of computer CPU heat dissipation module.

이 특허를 인용한 특허 (1)

  1. Wang, Cliff, Ceiling fan.
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