Implantable biomedical devices on bioresorbable substrates
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
A61B-005/04
A61N-001/05
출원번호
US-0892001
(2010-09-28)
등록번호
US-8666471
(2014-03-04)
발명자
/ 주소
Rogers, John A.
Kim, Dae-Hyeong
Omenetto, Fiorenzo
Kaplan, David L.
Litt, Brian
Viventi, Jonathan
Huang, Yonggang
Amsden, Jason
출원인 / 주소
The Board of Trustees of the University of Illinois
대리인 / 주소
Lathrop & Gage LLP
인용정보
피인용 횟수 :
54인용 특허 :
175
초록▼
Provided herein are implantable biomedical devices, methods of administering implantable biomedical devices, methods of making implantable biomedical devices, and methods of using implantable biomedical devices to actuate a target tissue or sense a parameter associated with the target tissue in a bi
Provided herein are implantable biomedical devices, methods of administering implantable biomedical devices, methods of making implantable biomedical devices, and methods of using implantable biomedical devices to actuate a target tissue or sense a parameter associated with the target tissue in a biological environment. Each implantable biomedical device comprises a bioresorbable substrate, an electronic device having a plurality of inorganic semiconductor components supported by the bioresorbable substrate, and a barrier layer encapsulating at least a portion of the inorganic semiconductor components. Upon contact with a biological environment the bioresorbable substrate is at least partially resorbed, thereby establishing conformal contact between the implantable biomedical device and the target tissue in the biological environment.
대표청구항▼
1. An implantable biomedical device for actuating a target tissue or sensing a parameter associated with the target tissue in a biological environment, said device comprising: a bioresorbable substrate;an electronic device comprising a plurality of inorganic semiconductor components supported by sai
1. An implantable biomedical device for actuating a target tissue or sensing a parameter associated with the target tissue in a biological environment, said device comprising: a bioresorbable substrate;an electronic device comprising a plurality of inorganic semiconductor components supported by said bioresorbable substrate, wherein at least one of said inorganic semiconductor components has at least one physical dimension less than or equal to 100 microns; anda barrier layer encapsulating at least a portion of said inorganic semiconductor components,wherein upon contact with said biological environment said bioresorbable substrate is at least partially resorbed, thereby establishing conformal contact between said implantable biomedical device and said target tissue in said biological environment. 2. The device of claim 1 further comprising a biocompatible layer provided on said bioresorbable substrate, wherein the biocompatible layer is positioned between the electronic device and the bioresorbable substrate. 3. The device of claim 1, wherein said bioresorbable substrate is configured to be completely resorbed upon contact with said biological environment. 4. The device of claim 1, wherein said bioresorbable substrate is configured not to be completely resorbed upon contact with said biological environment. 5. The device of claim 1, wherein resorption of said bioresorbable substrate establishes physical contact or electrical contact between said electronic device and said target tissue. 6. The device of claim 1, wherein resorption of said bioresorbable substrate provides the electronic device in optical communication with said target tissue. 7. The device of claim 1, wherein said bioresorbable substrate comprises a biopolymer, a synthetic polymer, a protein, a polysaccharide, silk or any combination of these. 8. The device of claim 1, wherein said bioresorbable substrate comprises a poly(glycerol-sebacate) (PGS), polydioxanone, poly(lactic-co-glycolic acid) (PLGA), polylactic acid (PLA), collagen, chitosan, fibroin, silkworm fibroin, modified silkworm fibroin, spider silk, insect silk, recombinant silk, or any combination of these. 9. The device of claim 1, wherein said bioresorbable substrate has a thickness selected from the range of 100 nanometers to 10000 μm. 10. The device of claim 1, wherein said bioresorbable substrate has a Young's modulus selected from the range of 0.5 MPa and 10 GPa. 11. The device of claim 1, wherein said bioresorbable substrate has a net bending stiffness selected from the range of 0.1×104 GPa μm4 and 1×109 GPa μm4. 12. The device of claim 1, wherein the bioresorbable substrate has a degree of crystallinity selected from the range of 0 to 55%. 13. The device of claim 1, wherein said implantable biomedical device has a neutral mechanical plane and at least a portion of said plurality of inorganic semiconductor components is positioned proximate to said neutral mechanical plane. 14. The device of claim 1, wherein at least one of said inorganic semiconductor components is a flexible semiconductor structure or a stretchable semiconductor structure. 15. The device of claim 1, wherein at least one of said inorganic semiconductor components is a nanoribbon, a nanomembrane, a nanowire, a transistor channel, a diode, a p-n junction, a photodiode, a light emitting diode, a laser or a combination of these. 16. The device of claim 1, wherein at least one of said inorganic semiconductor components of the electronic device has a thickness less than or equal to 10 microns. 17. The device of claim 1, wherein at least one of said inorganic semiconductor components of the electronic device has a thickness selected from the range of 50 nanometers to 10 microns. 18. The device of claim 1, wherein at least one of said inorganic semiconductor components of the electronic device has a Young's modulus selected from the range of 0.5 MPa to 10 GPa. 19. The device of claim 1, wherein at least one of said inorganic semiconductor components of the electronic device has a net bending stiffness less than or equal to 1×108 GPa μm4. 20. The device of claim 1, wherein at least one of said inorganic semiconductor components comprises a single crystal inorganic semiconductor material. 21. The device of claim 1, wherein said electronic device comprises a plurality of island and bridge structures, wherein said island structures comprise one or more of said inorganic semiconductor components of said electronic device, and wherein said bridge structures comprise one or more flexible electrical interconnects. 22. The device of claim 1, wherein said barrier layer comprises material selected from the group consisting of a polymer, an organic polymer, SU-8, an insulator, a polyimide, a dielectric, an inorganic dielectric, Si3N4, and any combination of these. 23. The device of claim 1, wherein said barrier layer has a thickness selected from the range of 1 μm to 100 μm. 24. The device of claim 1, wherein said bioresorbable substrate, said electronic device, and said barrier layer provide a net bending stiffness of the implantable biomedical device of less than 1×109 GPa μm4. 25. The device of claim 1, wherein said barrier layer has a mesh structure. 26. A method for administering an implantable biomedical device, said method comprising: providing the implantable biomedical device comprising:a bioresorbable substrate;an electronic device comprising a plurality of inorganic semiconductor components supported by said bioresorbable substrate, wherein at least one of said inorganic semiconductor components has at least one physical dimension less than or equal to 100 microns; anda barrier layer encapsulating at least a portion of said inorganic semiconductor components;contacting said implantable biomedical device with a target tissue in a biological environment; andat least partially resorbing said bioresorbable substrate in said biological environment, thereby establishing conformal contact between said implantable biomedical device and said target tissue in said biological environment. 27. The method of claim 26, wherein the Young's modulus of said implantable biomedical device decreases by at least 50% upon resorption of the bioresorbable substrate. 28. The method of claim 26, wherein the net bending stiffness of said implantable biomedical device decreases by at least 50% upon resorption of the bioresorbable substrate. 29. The method of claim 26, wherein said biological environment is an in-vivo biological environment. 30. The method of claim 26, wherein said target tissue in said biological environment comprises heart tissue, brain tissue, muscle tissue, epithelial tissue, nerve tissue, or vascular tissue. 31. A method of actuating a target tissue or sensing a parameter associated with the target tissue in a biological environment, said method comprising: providing an implantable biomedical device comprising:a bioresorbable substrate;an electronic device comprising a plurality of inorganic semiconductor components supported by said bioresorbable substrate, wherein at least one of said inorganic semiconductor components has at least one physical dimension less than or equal to 100 microns; anda barrier layer encapsulating at least a portion of said inorganic semiconductor components;contacting said implantable biomedical device with the target tissue in a biological environment;at least partially resorbing said bioresorbable substrate in said biological environment, thereby establishing conformal contact between said implantable biomedical device and said target tissue in said biological environment; andactuating the target tissue or sensing the parameter associated with the target tissue that is in conformal contact with the implantable biomedical device. 32. The method of claim 31, wherein resorption of said bioresorbable substrate establishes physical contact or electrical contact between said electronic device and said target tissue. 33. The method of claim 31, further comprising the step of sensing the parameter associated with the target tissue that is in conformal contact with the implantable biomedical device, wherein said step of sensing the parameter associated with the target tissue that is in conformal contact with the implantable biomedical device comprises measuring voltage at a surface of the target tissue, measuring electromagnetic radiation at a surface of the target tissue or measuring a current at a surface of the target tissue. 34. The method of claim 31, further comprising the step of actuating the target tissue that is in conformal contact with the implantable biomedical device, wherein said step of actuating the target tissue that is in conformal contact with the implantable biomedical device comprises generating a voltage at a surface of the target tissue, generating electromagnetic radiation at a surface of the target tissue or generating a current at a surface of the target tissue. 35. An implantable biomedical device for actuating a target tissue or sensing a parameter associated with the target tissue in a biological environment, said device comprising: an electrode array comprising a plurality of individually addressable inorganic semiconductor components, wherein each inorganic semiconductor component has at least one physical dimension less than or equal to 100 microns;a barrier layer having a mesh structure, wherein said barrier layer at least partially supports said electrode array; anda bioresorbable substrate supporting said electrode array, said barrier layer or both of said electrode array and said barrier layer;wherein upon contact with said biological environment said bioresorbable substrate is at least partially resorbed, thereby establishing conformal contact between said electrode array and said target tissue in said biological environment. 36. The device of claim 35, wherein said inorganic semiconductor components of said electrode array are physically separated from each other. 37. The device of claim 35, wherein said barrier layer is in physical contact with at least a portion of said inorganic semiconductor components of said electrode array or wherein said bioresorbable substrate is in physical contact with at least a portion of said electrode array or in physical contact with at least a portion of said barrier layer. 38. The device of claim 35, wherein each of said inorganic semiconductor components of said array is in electrical contact with at least one electronic interconnect. 39. The device of claim 35, wherein said bioresorbable substrate comprises a poly(glycerol-sebacate) (PGS), polydioxanone, poly(lactic-co-glycolic acid) (PLGA), polylactic acid (PLA), collagen, chitosan, fibroin, or any combination of these. 40. The device of claim 35, wherein said bioresorbable substrate comprises a silkworm fibroin, spider silk, insect silk, recombinant silk, or any combination of these. 41. The device of claim 35, wherein said bioresorbable substrate has a thickness selected from the range of 100 nanometers to 10000 μm. 42. The device of claim 35, wherein resorption of said bioresorbable substrate establishes physical contact or electrical contact between said electrode array and said target tissue. 43. The device of claim 35, wherein said mesh structure is a perforated mesh structure or a tentacle mesh structure. 44. The device of claim 35, wherein said electrode array comprises 10 to 1000 inorganic semiconductor components. 45. The device of claim 35, wherein each of said inorganic semiconductor components has a thickness selected over the range of 100 nanometers to 10 microns. 46. The device of claim 35, wherein said inorganic semiconductor components further comprise a bioinert metal or a biocompatible metal. 47. The device of claim 35, wherein said barrier layer has a thickness selected from the range of 1 μm to 100 μm. 48. A method for actuating a target tissue or sensing a parameter associated with the target tissue in a biological environment, the method comprising: providing an implantable biomedical device comprising:an electrode array comprising a plurality of individually addressable inorganic semiconductor components, wherein each inorganic semiconductor component has at least one physical dimension less than or equal to 100 microns;a barrier layer having a mesh structure, wherein said barrier layer at least partially supports said electrode array; anda bioresorbable substrate supporting said electrode array, said barrier layer or both of said electrode array and said barrier layer;contacting said implantable biomedical device with the target tissue in a biological environment; wherein upon contact with said biological environment said bioresorbable substrate is at least partially resorbed, thereby establishing conformal contact between said electrode array and said target tissue in said biological environment; andactuating the target tissue or sensing the parameter associated with the target tissue that is in conformal contact with the implantable biomedical device. 49. The method of claim 48, wherein said biological environment is an in-vivo biological environment. 50. The method of claim 48, wherein resorption of said bioresorbable substrate establishes physical contact or electrical contact between said implantable biomedical device and said target tissue. 51. The method of claim 48, further comprising the step of sensing the parameter associated with the target tissue that is in conformal contact with the implantable biomedical device, wherein said step of sensing the parameter associated with the target tissue that is in conformal contact with the implantable biomedical device comprises measuring voltage at a surface of the target tissue, measuring electromagnetic radiation at a surface of the target tissue or measuring a current at a surface of the target tissue. 52. The method of claim 48, further comprising the step of actuating the target tissue that is in conformal contact with the implantable biomedical device, wherein said step of actuating the target tissue that is in conformal contact with the implantable biomedical device comprises generating a voltage at a surface of the target tissue, generating electromagnetic radiation at a surface of the target tissue or generating a current at a surface of the target tissue.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (175)
Akiyama, Masahiko, Active matrix substrate and method of manufacturing the same.
Mickelsen Reid A. (Bellevue WA) Chen Wen S. (Seattle WA), Apparatus for forming thin-film heterojunction solar cells employing materials selected from the class of I-III-VI2.
Amundson,Karl R.; Chen,Yu; Denis,Kevin L.; Drzaic,Paul S.; Kazlas,Peter T.; Ritenour,Andrew P., Backplanes for display applications, and components for use therein.
Branham Barry H. (Ballwin MO) Cox James L. (Ladue MO) Boineau John P. (Ladue MO) Schuessler Richard B. (Ballwin MO), Computerized three-dimensional cardiac mapping with interactive visual displays.
Epstein, Arthur J.; Feinberg, Stephen E.; Hansford, Derek J.; Yang, Yanyin, Electrical stimulation of cell and tissue growth with two-and three-dimensionally patterned electrodes.
Abramson, Justin; Amundson, Karl R.; Danner, Guy M.; Duthaler, Gregg M.; Gates, Holly G.; Honeyman, Charles H.; Knaian, Ara N.; Morrison, Ian D.; O'Neil, Steven J.; Paolini, Jr., Richard J.; Pullen, , Electro-optic displays, and methods for driving same.
Credelle, Thomas Lloyd; Gengel, Glenn; Stewart, Roger Green; Joseph, William Hill, Electronic devices with small functional elements supported on a carrier.
James Gregory Bentsen ; Rolf Werner Biernath, Film based addressable programmable electronic matrix articles and methods of manufacturing and using the same.
Gazdik Charles E. (Endicott NY) McBride Donald G. (Binghamton NY) Seraphim Donald P. (Vestal NY) Toole Patrick A. (Westport CT), Full panel electronic packaging structure and method of making same.
Tachibana,Takeshi; Hayashi,Kazushi; Inoue,Kenichi; Yokota,Yoshihiro; Kobashi,Koji; Kawakami,Nobuyuki; Kobori,Takashi, Heat spreader and semiconductor device and package using the same.
Greenberg, Robert J.; Talbot, Neil Hamilton; Neysmith, Jordan Matthew; Ok, Jerry; Jiang, Honggang, Implantable microelectronic device and method of manufacture.
Bassous Ernest (Riverdale NY) Kuhn Lawrence (Ossining NY) Taub Howard H. (Mount Kisco NY), Jet nozzle structure for electrohydrodynamic droplet formation and ink jet printing system therewith.
Chan Kevin Kok ; D'Emic Christopher Peter ; Jones Erin Catherine ; Solomon Paul Michael ; Tiwari Sandip, Method for making bonded metal back-plane substrates.
Cann Gordon L. (Laguna Beach) Shephard ; Jr. Cecil B. (Laguna Beach) McKevitt Frank X. (Anaheim Hills CA), Method for plasma deposition on apertured substrates.
Mech,Brian V.; Greenberg,Robert J.; DelMain,Gregory J., Method of forming an implantable electronic device chip level hermetic and biocompatible electronics package using SOI wafers.
Gresser Joseph D. (Brookline MA) Trantolo Debra J. (Princeton MA) Wise Donald L. (Belmont MA) Wnek Gary E. (Latham NY), Method of making biopolymer-based nonlinear optical materials.
Smith, John Stephen; Hadley, Mark A.; Craig, Gordon S. W.; Nealey, Paul F., Methods and apparatuses for improved flow in performing fluidic self assembly.
John Stephen Smith ; Mark A. Hadley ; Gordon S. W. Craig ; Frank Lowe, Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings.
Bakhit Gabriel G. (Huntington Beach CA) Pillai Vincent A. (Irvine CA) Averkiou George (Upland CA) Trask Philip A. (Laguna Hills CA), Methods of forming two-sided HDMI interconnect structures.
William A. Clark ; Mark A. Lemkin ; Thor N. Juneau ; Allen W. Roessig, Microfabricated structures with trench-isolation using bonded-substrates and cavities.
Kang Sung-gyu,KRX ; Lee Ki Bang,KRX ; Choi Jae-joon,KRX ; Jeong Hee-moon,KRX, Multilayered wafer with thick sacrificial layer using porous silicon or porous silicon oxide and fabrication method thereof.
Scher, Erik; Buretea, Mihai A.; Chow, Calvin; Empedocles, Stephen; Meisel, Andreas; Parce, J. Wallace, Nanostructure and nanocomposite based compositions and photovoltaic devices.
Kolpe Vasant V. (Mendota Heights MN) Williams Paul M. (St. Paul MN), Noble metal-polymer composites and flexible thin-film conductors prepared therefrom.
Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao, Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp.
Gregg Duthaler ; Karl R. Amundson ; Paul S. Drzaic ; Peter T. Kazlas ; Jianna Wang, Preferred methods for producing electrical circuit elements used to control an electronic display.
Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao; Ko, Heung Cho; Mack, Shawn, Printable semiconductor structures and related methods of making and assembling.
Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao; Ko, Heung Cho; Mack, Shawn, Printable semiconductor structures and related methods of making and assembling.
Hara Kazukuni,JPX ; Tokura Norihito,JPX ; Miyajima Takeshi,JPX ; Fuma Hiroo,JPX ; Kano Hiroyuki,JPX, Process for producing a semiconductor device having a single thermal oxidizing step.
Rogers, John A.; Nuzzo, Ralph G.; Meitl, Matthew; Ko, Heung Cho; Yoon, Jongseung; Menard, Etienne; Baca, Alfred J., Release strategies for making transferable semiconductor structures, devices and device components.
Cole ; Jr. Herbert S. (Burnt Hills NY) Sitnik-Nieters Theresa A. (Scotia NY) Wojnarowski Robert J. (Ballston Lake NY) Lupinski John H. (Vienna VA), Reworkable high density interconnect structure incorporating a release layer.
Chen, Shiuh-Hui Steven; Garza, Raymond; Ross, Carl; Turalski, Stefan, Semiconductor wafer having a thin die and tethers and methods of making the same.
Salerno Jack P. ; Zavracky Paul M. ; Spitzer Mark B. ; Dingle Brenda, Single crystal silicon arrayed devices with optical shield between transistor and substrate.
Rogers, John A.; Khang, Dahl-Young; Sun, Yugang; Menard, Etienne, Stretchable form of single crystal silicon for high performance electronics on rubber substrates.
Chang Mike F. ; Owyang King ; Hshieh Fwu-Iuan ; Ho Yueh-Se ; Dun Jowei ; Fusser Hans-Jurgen,DEX ; Zachai Reinhard,DEX, Surface mount and flip chip technology with diamond film passivation for total integated circuit isolation.
Beyer Klaus D. (Poughkeepsie NY) Hsieh Chang-Ming (Fishkill NY) Hsu Louis L. (Fishkill NY) Kotecki David E. (Hopewell Junction NY) Yuan Tsoring-Dih (Hopewell Junction NY), Thermal dissipation of integrated circuits using diamond paths.
Ikemizu,Dai; Kataoka,Emiko; Suzuki,Takatugu; Yoshida,Kazuya; Yamashita,Hiroyuki, Thermal transfer recording material and thermal transfer recording method.
Suzuki,Taro; Fukui,Daisuke; Fujita,Masahiro, Thermally transferable image protective sheet, method for protective layer formation, and record produced by said method.
Parker John L. (Lane Cove AUX) Treaba Claudiu G. (Wollstonecraft AUX), Use of bioresorbable polymers in cochlear implants and other implantable devices.
Hadley, Mark A.; Chiang, Ann; Craig, Gordon S. W.; Jacobsen, Jeffrey Jay; Smith, John Stephen; Tu, Jay; Stewart, Roger Green, Web fabrication of devices.
Jeffrey Jay Jacobsen ; Glenn Wilhelm Gengel ; Mark A. Hadley ; Gordon S. W. Craig ; John Stephen Smith, Web process interconnect in electronic assemblies.
Kaplan, David L.; Omenetto, Fiorenzo; Lawrence, Brian; Cronin-Golomb, Mark; Georgakoudi, Irene, Biopolymer sensor and method of manufacturing the same.
Stetson, Jr., John B.; Simon, Sarah; Swett, Jacob L., Hemodialysis and hemofiltration membranes based upon a two-dimensional membrane material and methods employing same.
Rogers, John A.; Lee, Chi Hwan; Yin, Lan; Huang, Xian; Leal, Cecilia Maria das Neves Barbosa; Harburg, Daniel Vincent, Materials, electronic systems and modes for active and passive transience.
Heise, Scott E.; Bedworth, Peter V.; Swett, Jacob L.; Sinton, Steven W., Method for treating graphene sheets for large-scale transfer using free-float method.
Rogers, John A.; Nuzzo, Ralph; Kim, Hoon-sik; Brueckner, Eric; Park, Sang Il; Kim, Rak Hwan, Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays.
Rogers, John A.; Wilson, William L.; Jin, Sung Hun; Dunham, Simon N.; Xie, Xu; Islam, Ahmad; Du, Frank; Huang, Yonggang; Song, Jizhou, Purification of carbon nanotubes via selective heating.
Rogers, John A.; Nuzzo, Ralph G.; Meitl, Matthew; Ko, Heung Cho; Yoon, Jongseung; Menard, Etienne; Baca, Alfred J., Release strategies for making transferable semiconductor structures, devices and device components.
Rogers, John A.; Fan, Jonathan; Yeo, Woon-Hong; Su, Yewang; Huang, Yonggang; Zhang, Yihui, Self-similar and fractal design for stretchable electronics.
Rogers, John A.; Fan, Jonathan; Yeo, Woon-Hong; Su, Yewang; Huang, Yonggang; Zhang, Yihui, Self-similar and fractal design for stretchable electronics.
Sinton, Steven W.; Bedworth, Peter V.; Moloney, Padraig; Swett, Jacob L., Separation membranes formed from perforated graphene and methods for use thereof.
Rogers, John A.; Khang, Dahl-Young; Sun, Yugang; Menard, Etienne, Stretchable form of single crystal silicon for high performance electronics on rubber substrates.
Rogers, John A.; Khang, Dahl-Young; Sun, Yugang; Menard, Etienne, Stretchable form of single crystal silicon for high performance electronics on rubber substrates.
Rogers, John A.; Khang, Dahl-Young; Sun, Yugang; Menard, Etienne, Stretchable form of single crystal silicon for high performance electronics on rubber substrates.
Mountcastle, Paul D.; Foulke, Svetlana M.; Stetson, Jr., John B., Syringe for obtaining nano-sized materials for selective assays and related methods of use.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.