초록 ▼

Methods and apparatus for forming a multi-layered metal structure that includes an anodized surface are disclosed. According to one aspect, a housing arrangement can include a stainless steel layer and at least a first layer. The first layer can have a first bonding surface and a first exterior surf

Methods and apparatus for forming a multi-layered metal structure that includes an anodized surface are disclosed. According to one aspect, a housing arrangement can include a stainless steel layer and at least a first layer. The first layer can have a first bonding surface and a first exterior surface. The first bonding surface can be substantially bonded in direct contact with the stainless steel layer, and the first exterior surface can be an exterior of the housing arrangement. The first exterior surface is an anodized surface. In one embodiment, the first layer can be formed from an anodizable material such as aluminum, titanium, niobium, or tantalum.

대표청구항 ▼

1. A method of forming a housing for an electronic device, comprising: forming a multi-layered metal sandwich structure by bonding an exterior laminate layer to a first surface of a stainless steel layer and an interior laminate layer to a second surface of the stainless steel layer, wherein the ext

1. A method of forming a housing for an electronic device, comprising: forming a multi-layered metal sandwich structure by bonding an exterior laminate layer to a first surface of a stainless steel layer and an interior laminate layer to a second surface of the stainless steel layer, wherein the exterior and interior laminate layers are formed from an anodizable material;masking a third surface of the stainless steel layer and a portion of the exterior and interior laminate layers using a mask, wherein the third surface of the stainless steel layer is not bonded to either the exterior or interior laminate layers, wherein the mask is configured to prevent exposure of the third surface from a subsequent anodizing process;anodizing un-masked portions of the exterior and interior laminate layers by exposing the multi-layered metal sandwich structure to an anodizing process, wherein the masked third surface of the stainless steel layer and the masked portion of the exterior and interior laminate layers are not anodized during the anodizing process;removing the mask from the third surface of the stainless steel layer and the exterior and interior laminate layers; andassembling an electronic component within the housing forming the electronic device. 2. The method of claim 1, wherein the removing includes cutting away at least the third surface of the stainless steel layer and a portion of the exterior and interior laminate layers. 3. The method of claim 1, further comprising: draw-forming the multi-layered metal sandwich structure to form a cavity for housing internal components of the electronic device. 4. The method of claim 3, wherein the interior laminate layer is formed on an interior surface of the cavity and the exterior laminate layer is formed on an exterior surface of the housing. 5. The method of claim 1, wherein bonding the exterior and interior laminate layers to the first and second surfaces of the stainless steel layer includes cladding the exterior and interior laminate layers to the first and second surfaces of the stainless steel layer, respectively. 6. The method of claim 1, wherein the exterior and interior laminate layers are formed from a group including aluminum, titanium, niobium and tantalum. 7. The method of claim 1, further comprising: creating an attachment surface by removing a portion of the interior laminate layer, wherein the attachment surface is configured to accept an attachment structure. 8. The method of claim 7, wherein the removing comprises chemically etching a portion of the interior laminate layer to expose a portion of underlying stainless steel. 9. The method of claim 1, further comprising: overmolding a plastic structure on the interior laminate layer, wherein the plastic structure includes a bonding surface that allows at least one internal component to be attached. 10. A method of forming a housing for an electronic device, comprising: cladding a metal layer to a first surface of a stainless steel sheet, the metal layer comprised of a different metal than the stainless steel sheet, wherein the metal layer comprises an anodizable material;applying a mask on a sacrificial surface of the stainless steel sheet that is not clad to the metal layer, wherein the mask is configured to prevent exposure of the sacrificial surface of stainless steel from a subsequent anodizing process;forming a multi-layered structure by anodizing the metal layer, wherein the masked sacrificial surface of stainless steel is not anodized;removing the mask by cutting the multi-layered structure cutting away the mask and the sacrificial surface of stainless steel; andassembling an electronic component within the housing forming the electronic device. 11. The method of claim 10, wherein the metal layer is formed on an external surface of the housing. 12. The method of claim 10, wherein the metal layer comprises at least one selected from a group including aluminum, titanium, niobium and tantalum. 13. The method of claim 10, wherein the mask partially overlaps and covers a portion of the metal layer, wherein during the anodizing the portion of the metal layer is not anodized. 14. The method of claim 13, wherein cutting the multi-layered structure involves cutting away the portion of metal layer. 15. The method of claim 10, further comprising: cladding a second metal layer to a second surface of the stainless steel sheet. 16. The method of claim 15, further comprising: anodizing the second metal layer to form a second anodized layer to form the multi-layered structure. 17. The method of claim 10, further comprising: prior to the anodizing, draw-forming the clad metal layer and stainless steel sheet to form a cavity of the housing. 18. The method of claim 10, further comprising: chemically treating a predetermined portion of the metal layer to create an attachment surface configured to accept an attachment structure; andattaching an attachment structure to the attachment surface. 19. The method of claim 18, wherein the attachment structure is a molded structure.