A sandwich of impact resistant material comprising: a first tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the nano-particles is present in the first tile and the first tile comprises a hardness value; a second tile comprising a plurality of nano-particl
A sandwich of impact resistant material comprising: a first tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the nano-particles is present in the first tile and the first tile comprises a hardness value; a second tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the nano-particles is present in the second tile and the second tile comprises a hardness value; and a third tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the nano-particles is present in the third tile and the third tile comprises a hardness value, wherein the second tile is coupled in between the first tile and the third tile, and the second tile comprises a hardness value greater than the first tile and the second tile.
대표청구항▼
1. A method of making a sandwich of impact resistant material, the method comprising: providing a first tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the nano-particles is present in the first tile and the first tile comprises a hardness value;providing
1. A method of making a sandwich of impact resistant material, the method comprising: providing a first tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the nano-particles is present in the first tile and the first tile comprises a hardness value;providing a second tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the nano-particles is present in the second tile and the second tile comprises a hardness value;providing a third tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the nano-particles is present in the third tile and the third tile comprises a hardness value; andcoupling the second tile in between the first tile and the third tile,wherein the second tile comprises a hardness value greater than the first tile and third tile. 2. The method of claim 1, wherein: the hardness value of the first tile is between 1000 and 1500 HV;the hardness value of the second tile is between 2500 and 3500 HV; andthe hardness value of the third tile is between 1000 and 1500 HV. 3. The method of claim 1, wherein the nano-particles that form first tile and the third tile comprise silicon nitride nano-particles. 4. The method of claim 1, wherein the nano-particles that form the second tile comprise tungsten carbide nano-particles, tantalum carbide nano-particles, or titanium carbide nano-particles. 5. The method of claim 1, wherein the nano-particles of the first tile, the second tile, and the third tile comprise an average grain size of 1 to 10 nanometers. 6. The method of claim 1, wherein the nano-particles of the first tile, the second tile, and the third tile comprise an average grain size of 10 to 50 nanometers. 7. The method of claim 1, wherein the nano-particles of the first tile, the second tile, and the third tile comprise an average grain size of 50 to 100 nanometers. 8. The method of claim 1, wherein the nano-particles of the first tile, the second tile, and the third tile comprise an average grain size of 100 to 250 nanometers. 9. The method of claim 1, wherein the nano-particles of the first tile, the second tile, and the third tile comprise an average grain size of 250 to 500 nanometers. 10. The method of claim 1, wherein the second tile is coupled between the first tile and the third tile via adhesive layers. 11. The method of claim 1, wherein coupling the second tile in between the first tile and the third tile comprises performing a spark plasma sintering process on the nano-particles of the first tile, the second tile, and the third tile. 12. The method of claim 1, further comprising a ductile backing layer coupled to the third tile on a side opposite the second tile. 13. The method of claim 12, wherein the ductile backing layer comprises an adhesive layer. 14. The method of claim 12, wherein the ductile backing layer comprises: a layer of polyethylene fibers; andan adhesive material.
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