Methods and moulds for use in fabricating side-ported microneedles
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B23P-025/00
B28B-001/48
B29C-033/00
B23P-017/00
출원번호
US-0592559
(2004-03-12)
등록번호
US-8671544
(2014-03-18)
국제출원번호
PCT/SG2004/000055
(2004-03-12)
§371/§102 date
20100210
(20100210)
국제공개번호
WO2005/087305
(2005-09-22)
발명자
/ 주소
Xu, Yuan
Chen, Meí Ma
Li, Zhongli
Lim, Chee Yen
Tan, Pei Ying Joyce
출원인 / 주소
Agency for Science, Technology and Research
대리인 / 주소
Quarles & Brady LLP
인용정보
피인용 횟수 :
1인용 특허 :
20
초록▼
A microneedle mold and a method of manufacturing a microneedle mold are provided for use in fabricating microneedles. The method includes providing a microneedle mold base with recesses therein, the recesses corresponding to the microneedles to be fabricated and extending from a first surface of the
A microneedle mold and a method of manufacturing a microneedle mold are provided for use in fabricating microneedles. The method includes providing a microneedle mold base with recesses therein, the recesses corresponding to the microneedles to be fabricated and extending from a first surface of the microneedle mold base; and forming side-port forming holes in the microneedle mold base, the side-port forming holes extend in side surfaces of the recesses within the microneedle mold base at side-port forming positions of the recesses.
대표청구항▼
1. A method of manufacturing a microneedle mould for use in fabricating microneedles, comprising: providing a microneedle mould base with recesses therein, the recesses corresponding to the microneedles to be fabricated and extending from a first surface of the microneedle mould base;forming side-po
1. A method of manufacturing a microneedle mould for use in fabricating microneedles, comprising: providing a microneedle mould base with recesses therein, the recesses corresponding to the microneedles to be fabricated and extending from a first surface of the microneedle mould base;forming side-port forming holes in the microneedle mould base, the side-port forming holes extend in side surfaces of the recesses within the microneedle mould base at side-port forming positions of the recesses; andproviding a seed layer on the first surface of the microneedle mould base and in the recesses,wherein forming the side-port forming holes comprises: providing the side surfaces of the recesses with discontinuities at the side-port forming positions of the recesses; anddepositing the seed layer after providing the side-port forming discontinuities, with the seed layer failing to deposit substantially on the side-port forming discontinuities. 2. A method according to claim 1, wherein the side-port forming holes extend in the sides of the recesses without extending to the tops or bottoms of the recesses. 3. A method according to claim 1, wherein the side-port forming holes extend in only one side surface of the individual recesses. 4. A method according to claim 3, wherein individual recesses are intercepted by the side-port forming holes at only one point. 5. A method according to claim 1, wherein the side-port forming holes extend in opposing side surfaces of the individual recesses. 6. A method according to claim 1, wherein the side-port forming holes extend in adjacent side surfaces of the individual recesses. 7. A method according to claim 1, wherein providing the side surfaces of the recesses with discontinuities comprises forming portions of the side surfaces of the recesses that are generally orthogonal to the first surface of the mould base. 8. A method according to claim 7, wherein the generally orthogonal portions of the side surfaces of the recesses are formed with the recesses. 9. A method according to claim 1, wherein providing the side surfaces of the recesses with discontinuities comprises forming side-port forming channels in the mould base intercepting the recesses. 10. A method according to claim 9, wherein the side-port forming channels extend from one edge surface of the microneedle mould base to an opposing edge surface of the microneedle mould base, generally parallel to the first surface of the microneedle mould base. 11. A method according to claim 9, wherein the side-port forming channels extend between adjacent recesses. 12. A method according to claim 9, wherein: the microneedle mould base comprises a plurality of overlaid mould base sheets; and further comprising:forming the side-port forming holes in the mould base, comprising: separating the plurality of mould base sheets;forming side-port forming channels in at least one of the opposing surfaces of at least one of the mould base sheets; andoverlaying the plurality of mould base sheets to reconstruct the microneedle mould base. 13. A method according to claim 12, wherein the side-port forming channels in at least one of the opposing surfaces are formed as grooves in the at least one of the opposing surfaces. 14. A method according to claim 12, wherein the microneedle mould base further comprises a separation layer between the or each two adjacent overlaid mould base sheets. 15. A method according to claim 14, further comprising removing the one or more separation layers prior to overlaying the plurality of mould base sheets to reconstruct the microneedle mould base. 16. A method according to claim 1, wherein the side-port forming holes are formed where side-port forming channels in the mould base intercept the recesses in the mould base. 17. A method according to claim 1, wherein the recesses are through-holes extending from the first surface of the microneedle mould base to an opposing second external surface. 18. A method according to claim 1, wherein providing a microneedle mould base comprises moulding the microneedle mould base on a master mould having a master mould base surface with a plurality of master mould needles protruding therefrom, the master mould needles corresponding to the recesses in the microneedle mould base. 19. A method according to claim 18, wherein the microneedle mould base is moulded on the master mould by hot pressing. 20. A method according to claim 18, further comprising providing the master mould. 21. A method according to claim 20, wherein providing the master mould comprises wire cutting the master mould from a master mould block. 22. A microneedle mould fabricated according to the method of claim 1. 23. A microneedle mould comprising a microneedle mould base with a plurality of recesses extending from a first surface thereof and a plurality of side-port forming holes in the microneedle mould base, the side-port forming holes extending in side surfaces of the recesses within the microneedle mould base at side-port forming positions of the recesses, wherein the side surfaces of the recesses are provided with discontinuities at the side-port forming positions of the recesses, anda seed layer is deposited on the first surface of the microneedle mould base and in the recesses, with the seeding layer failing to deposit substantially on the side-port forming discontinuities. 24. A microneedle mould according to claim 23, wherein the side-port forming holes comprise the interception of side-port forming channels in the mould base and recesses in the mould base. 25. A microneedle mould according to claim 23, wherein the discontinuities in the side surfaces of the recesses extend substantially orthogonally to the first surface of the microneedle mould base. 26. A microneedle mould according to claim 23, wherein the discontinuities comprise gaps in the seed layer. 27. A method of fabricating microneedles, comprising: providing a microneedle mould fabricated according to a method of manufacturing a microneedle mould for use in fabricating microneedles, the method of manufacturing a microneedle mould comprising: providing a microneedle mould base with recesses therein, the recesses corresponding to the microneedles to be fabricated and extending from a first surface of the microneedle mould base; andforming side-port forming holes in the microneedle mould base, the side-port forming holes extend in side surfaces of the recesses within the microneedle mould base at side-port forming positions of the recesses;forming a microneedle layer onto a first surface of the microneedle mould and within the recesses of the microneedle mould, with gaps in the layers on the side-port forming holes; andremoving the microneedle layer from the microneedle mould, the portions of the microneedle layer corresponding to the side-port forming holes comprising microneedle side-ports. 28. A method according to claim 27, wherein the microneedle layer within the recesses is hollow, to form hollow microneedles, the hollow of the microneedles and the microneedle side-ports being in fluid communication. 29. A method according to claim 27, further comprising splitting the microneedle layer into a plurality of microneedle portions, each microneedle portion having one or more microneedles thereon. 30. A method according to claim 27, wherein forming the microneedle layer comprises electroplating, PVD, CVD, thermo-evaporation or electroless plating the microneedle layer onto the first surface of the microneedle mould and into the recesses. 31. A method according to claim 27, wherein removing the microneedle layer from the microneedle mould comprises peeling the microneedle layer off from the microneedle mould. 32. A method according to claim 27, wherein removing the microneedle layer from the microneedle mould comprises dissolving the microneedle mould. 33. One or more microneedles manufactured according to the method of claim 27.
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