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Peeling method and method of manufacturing semiconductor device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-051/50
  • H01L-029/786
출원번호 US-0466212 (2012-05-08)
등록번호 US-8674364 (2014-03-18)
우선권정보 JP-2001-251870 (2001-08-22)
발명자 / 주소
  • Takayama, Toru
  • Maruyama, Junya
  • Yamazaki, Shunpei
출원인 / 주소
  • Semiconductor Energy Laboratory Co., Ltd.
대리인 / 주소
    Fish & Richardson P.C.
인용정보 피인용 횟수 : 4  인용 특허 : 148

초록

There is provided a peeling method capable of preventing a damage to a layer to be peeled. Thus, not only a layer to be peeled having a small area but also a layer to be peeled having a large area can be peeled over the entire surface at a high yield. Processing for partially reducing contact proper

대표청구항

1. A display device comprising: a film comprising an organic material;a first insulating film on and in contact with the film;a thin film transistor over the first insulating film;a second insulating film over the thin film transistor;a pixel electrode over the second insulating film, the pixel elec

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  1. Hatano, Kaoru; Seo, Satoshi; Nagata, Takaaki; Okano, Tatsuya, Display device including light-emitting layer.
  2. Hatano, Kaoru; Nagata, Takaaki; Sugisawa, Nozomu; Okano, Tatsuya; Chida, Akihiro; Inoue, Tatsunori, Light-emitting device, flexible light-emitting device, electronic device, and method for manufacturing light-emitting device and flexible-light emitting device.
  3. Ito, Minato; Yokoyama, Kohei, Light-emitting device, module, and electronic device.
  4. Maruyama, Junya; Takayama, Toru; Goto, Yuugo, Semiconductor device and method of manufacturing the same.
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