초록 ▼

Disclosed embodiments concern solution deposition of at least a first inorganic compound on a substrate, typically for production of electronic devices, such as solution deposition of metal salts, including halides, carbonyls, acetates, sulfates, phosphates, carbonates, and mixtures thereof. Solutio

Disclosed embodiments concern solution deposition of at least a first inorganic compound on a substrate, typically for production of electronic devices, such as solution deposition of metal salts, including halides, carbonyls, acetates, sulfates, phosphates, carbonates, and mixtures thereof. Solutions may be deposited using any suitable process, particularly inkjet printing or spin coating. The method can involve depositing only a first solution, depositing a first solution plural times, or deposition of plural different solutions. Furthermore, the method may involve simultaneous or serial deposition of two or more solutions. The method may further comprise post deposition processing the deposited material, such as thermal annealing, oxidation processes, reduction processes, exchange reactions, and combinations thereof. Electronic devices that can be made by the method also are described, including transistors, circuits, capacitors, photovoltaics, photodetectors, such as a UV detector, gas sensors, batteries, X-ray imagers, light emitting diodes, solid electrolytes, computer readable media, and combinations thereof.

대표청구항 ▼

1. A method for making a semiconducting thin film by solution deposition, and not suspension deposition, of inorganic compounds, comprising: providing a first solution consisting of at least a first metal halide and an aprotic solvent capable of dissolving the metal halide;depositing the solution on

1. A method for making a semiconducting thin film by solution deposition, and not suspension deposition, of inorganic compounds, comprising: providing a first solution consisting of at least a first metal halide and an aprotic solvent capable of dissolving the metal halide;depositing the solution onto a substrate in a predetermined pattern using a digital fabrication technique;evaporating the solvent, or allowing the solvent to evaporate, under ambient conditions to form a continuous thin film of a precursor material comprising an inorganic compound comprising the metal halide and having a thickness of at least 5 nanometers to 300 nanometers;exposing the precursor material to water; andannealing in the presence of oxygen or an oxygen-containing reactive species after exposing the precursor material to water, thereby forming an amorphous semiconducting thin film comprising a metal oxide suitable as a channel layer for thin film transistors with a field effect mobility value higher than 1 cm2/V·s. 2. The method according to claim 1 where the metal is a Group Ia, IIa, IIIa, IVa, Va, Ib, IIb, IIIb, IVb, Vb, VIIb, VIIb, or VIIIb metal, or mixtures thereof. 3. The method according to claim 2 where the inorganic compound is a binary compound. 4. The method according to claim 1 where the inorganic compound includes antimony (Sb), bismuth (Bi), cadmium (Cd), calcium (Ca), magnesium (Mg), barium (Ba), strontium (Sr), copper (Cu), gallium (Ga), gold (Au), titanium (Ti), zirconium (Zr), hafnium (Hf), indium (In), aluminum (Al), iron (Fe), ruthenium (Ru), lead (Pb), manganese (Mn), rhenium (Re), chromium (Cr), molybdenum (Mo), tungsten (W), nickel (Ni), silicon (Si), silver (Ag), thallium (Tl), germanium (Ge), tin (Sn), vanadium (V), niobium (Nb), tantalum (Ta), scandium (Sc), lanthanum (La), yttrium (Y), zinc (Zn), cobalt (Co), rhodium (Rh), lithium (Li), sodium (Na), potassium (K), rubidium (Rb), cesium (Cs), boron (B), mercury (Hg), palladium (Pd), platinum (Pt), iridium (Ir), osmium (Os), technetium (Tc), cerium (Ce), beryllium (Be), europium (Eu), terbium (Tb), gadolinium (Gd), holmium (Ho), erbium (Er), thulium (Tm), or lutetium (Lu). 5. The method according to claim 1 where the inorganic compound is SbCl3, SbBr3, SbI3, SbF3, SbCl5, SbBr5, SbI5, SbF5, BiCl3, BiBr3, BiI3, BiF3, CdCl2, CdBr2, CdI2, CdF2, CaF2, CaBr2, CaCl2, CaI2, MgCl2, MgBr2, MgI2, MgF2, BaCl2, BaBr2, BaI2, BaF2, CuCl, CuBr, CuI, CuF, CuCl2, CuBr2, CuI2, CuF2, GaCl, Gal, GaBr, GaF, GaCl3, GaBr3, GaI3, GaF3, AuCl, AuCl3, Au4Cl8, AuBr, AuBr3, Aul, AuI3, AuF3, AuF5, TiCl2, TiBr2, TiI2, TiF2, TiCl3, TiBr3, TiI3, TiF3, TiCl4, TiBr4, TiI4, TiF4, ZrC2, ZrBr2, ZrI2, ZrF2, ZrCl3, ZrBr3, ZrI3, ZrF3, ZrCl4, ZrBr4, ZrI4, ZrF4, HfCl4, HfBr4, HfI4, HfF4, InCl, InBr, InI, InF, InCl2, InBr2, InI2, InF2, InCl3, InCBr3, InI3, InF3, AlCl3, AlBr3, AlI3, AlF3, TlCl, TlBr, TlI, FeI2, FeI3, FeCl2, FeCl3, FeBr2, FeBr3, FeF2, FeF3, RuCl2, RuBr2, RuI2, RuF2, RuCl3, RuBr3, RuI3, RuF3, PbCl, PbBr, PbI, PbF, MnCl2, MnBr2, MnF2, MnI2, ReCl2, ReBr2, ReI2, ReF2, ReCl4, ReBr4, ReI4, ReI4, CrCl3, CrBr3, CrI3, CrF3, MoCl4, MoBr4, MoI4, MoCl2, MoBr2, MoI2, MoF2, MoCl3, MoBr3, MoI3, MoF3, MoCl4, MoBr4, MoI4, MoF4, MoCl5, MoCl6, WCl6, WBr6, WI6, WF6, AgI, AgBr, AgCl, TlCl, TlBr, TlI, TlF, SiCl2, SiCl4, SiBr2, SiBr4, SiI2, SiI4, SiF2, SiF4, GeCl2, GeCl4, GeBr2, GeBr4, GeI2, GeI4, GeF2, GeF4, SnCl2, SnCl4, SnBr2, SnBr4, SnI2, SnI4, SnF2, SnF4, VCl2, VBr2, VI2, VF2, VCl3, VBr3, VI3, VF3, VCl4, VBr4, VI4, VF4, NbCl3, NbBr3, NbI3, NbF3, NbCl5, NbBr5, NbI5, NbF5, TaCl3, TaBr3, TaI3, TaF3, TaCl4, TaBr4, TaI4, TaF4, TaCl5, TaBr5, TaI5, TaF5, ScCl3, ScBr3, ScI3, ScF3, SrCl2, SrBr2, SrI2, LaCl3, LaBr4, LaI3, LaF3, YCl3, YBr3, YI3, YF3, ZnCl2, ZnBr2, ZnI2, ZnF2, NiCl3, NiBr3, NiI3, NiF3, CoCl2, CoBr2, CoI2, CoF2, CoCl3 CoBr3, CoI3, CoF3, RhCl3 RhBr3, RhI3, RhF3, LiCl, LiBr, LiI, LiF, NaCl, NaBr, NaI, NaF, KCl, KBr, KI, KF, RbCl, RbBr, RbI, RbF, CsCl, CsBr, CsI, CsF, BCl3, BBr3, BI3, BF3, HgCl2, HgBr2, HgI3, HgF3, PdCl2, PdBr2, PdI2, PdF2, PdF4, PtCl3, PtCl4, PtBr3, PtBr2, PtBr4, PtI2, PtI3, PtI4, PtF4, PtF6, IrCl2, IrBr2, IrI2, IrF2, IrCl3, IrBr3, IrI3, IrF3, IrCl4, IrBr4, IrI4, IrF4, OSCl3, OSCl4, OSCl5, OSBr3, OSBr4, OsI, OSI2, OsI3, OSF4, OSF5, OSF6, OSF7, OSF8, TcF5, TcF6, TcCl4, TcCl6, TcBr4, CeCl2, CeBr2, CeI2, CeF2, CeCl3, CeBr3, CeI3, CeF3, BeF2, BeCl2, BeBr2, BeI2, EuCl2, EuBr2, EuI2, EuF2, EuCl3, EuBr3, EuI3, EuF3, TbF2, TbF3, TbCl3, TbBr3, TbI3, GdCl2, GdCl3, GdBr2, GdI2, GdF2, HoCl3, HoBr3, HoI3, HoF3, ErCl3, ErBr3, ErI3, ErF3, ThCl4, ThBr4, ThI2, ThI3, ThI4, ThF4, TmCl2, TmBr2, TmI2, TmF2, TmCl3, TmBr3, TmI3, TmF3, LuCl3, LuBr3, LuI3, LuF3, CuAgI2, CuCdI2, CuBiI4, CuPbI3, CuSnI5, SbSI or a combination thereof. 6. The method according to claim 1 where the inorganic compound is a ternary or higher order mixed-metal compound. 7. The method according to claim 6 where the inorganic compound has a formula Ma1Mb2Yc where Y is a halide, a+b is sufficient to provide metal atoms equal to a negative charge associated with any one or more Y groups, and c is sufficient to provide anionic groups equal to a positive charge associated with the metal atoms. 8. The method according to claim 6 where the inorganic compound has a formula Ma1Mb2Mc3Yd where Y is a halide, a+b+c is sufficient to provide metal atoms equal to a negative charge associated with any one or more Y groups, and d is sufficient to provide anionic groups equal to a positive charge associated with the metal atoms. 9. The method according to claim 1 where the inorganic compound comprises copper-cadmium, copper-silver, zinc-indium, zinc-tin, or indium-tin. 10. The method according to claim 1 where the inorganic compound is a metal halide having a formula MaXb where M is a metal, X is a halide, a is 1, 2 or 3, and b provides halide anions sufficient to equal a positive charge on the metal. 11. The method according to claim 10 where the halide is chloride or iodide. 12. The method according to claim 1 where annealing the film precursor in the presence of oxygen or an oxygen-containing reactive species comprises oxidizing or substituting the metal halide to form a metal oxide. 13. The method according to claim 12 where the metal oxide is ZnO—In2O3 (ZIO), ZnO, In2O3, SnO2, In2O3—SnO2 (ITO), ZnO—SnO2 (ZTO), and In2O3—ZnO—SnO2 (IZTO), Ga2O3, ZnO—Ga2O3 (ZGO), Al2O3, B2O3, GeO2, PbO, In2O3—GeO2, SnO2—GeO2, SiO2, CdO, CdO—SnO2, CuO, CuO—Al2O3, MgO, MgO—In2O3, CaO, CaO—Al2O3, BaO, AgO, Ag2O, ScO, CuO—ScO, SrO, CoO, Fe2O3, Fe3O4, ZnO—Fe3O4, Cr2O3, ZnO—Cr2O3, NiO, RuO2, ReO2, ReO3, RhO, MoO2, MnO, WO, V2O3, Nb2O3, Ta2O5, TiO2, BaO—TiO2, ZrO2, ZrO2—SiO2, HfO2, HfO2—SiO2, Y2O3, La2O3, PbO, TlO, SrO, SrO2, TcO2, Tc2O7, BeO, TbO2, Tb2O3, Sb2O3, Sb2O3—SnO2, Sb2O5, Bi2O3, or combinations thereof. 14. The method according to claim 1 where depositing the solution on a substrate produces a first layer, and the method further comprises solution depositing at least a second layer on the first layer. 15. The method according to claim 14 where the first layer and the second layer comprise the same inorganic compound. 16. The method according to claim 14 where the first layer and the second layer comprise different inorganic compounds. 17. The method according to claim 1 where the solvent is a nitrile. 18. The method according to claim 1 where the inorganic compound forms a layer on the substrate having a thickness of from about 5 to about 250 nanometers. 19. The method according to claim 1 where the inorganic compound forms a layer on the substrate having a thickness of from about 10 nanometers to about 200 nanometers. 20. The method according to claim 1 where the solution is deposited by inkjet printing. 21. The method according to claim 1 further comprising: obtaining a concentration versus a deposited layer thickness curve;providing the first solution with a concentration of the first inorganic material selected to provide a desired layer thickness; anddepositing the first solution to provide the desired layer thickness. 22. The method according to claim 1 comprising air annealing at 600° C. for one hour. 23. The method according to claim 1 where the thin film is a porous thin film. 24. The method according to claim 23 where the thin film has plural different porous structures. 25. The method according to claim 23 further comprising adjusting pore size of the thin film. 26. The method according to claim 25 where adjusting pore size comprises selecting a processing temperature, a temperature heating rate, or both. 27. The method according to claim 23 where the thin film is a metal oxide selected from ZnO—In2O3 (ZIO), ZnO, In2O3, SnO2, In2O3—SnO2 (ITO), ZnO—SnO2 (ZTO), and In2O3—ZnO—SnO2 (IZTO), Ga2O3, ZnO—Ga2O3 (ZGO), Al2O3, B2O3, GeO2, PbO, In2O3—GeO2, SnO2—GeO2, SiO2, CdO, CdO—SnO2, CuO, CuO—Al2O3, MgO, MgO—In2O3, CaO, CaO—Al2O3, SrO, SrO2, TcO2, Tc2O7, BeO, TbO2, Tb2O3, BaO, AgO, Ag2O, ScO, CuO—ScO, SrO, CoO, Fe2O3, Fe3O4, ZnO—Fe3O4, Cr2O3, ZnO—Cr2O3, NiO, RuO2, ReO2, ReO3, RhO, MoO2, MnO, WO, V2O3, Nb2O3, Ta2O5, TiO2, BaO—TiO2, ZrO2, ZrO2—SiO2, HfO2, HfO2—SiO2, Y2O3, La2O3, PbO, TiO, Sb2O3, Sb2O3—SnO2, Sb2O5, Bi2O3, and combinations thereof. 28. A method for making a semiconductor material by solution deposition, and not suspension deposition, of inorganic compounds, comprising: providing a first solution consisting of an aprotic solvent and at least a first inorganic material selected from a Group Ia, IIa, IIIa, IVa, Va, Ib, IIb, IIIb, IVb, Vb, VIb, VIIb, or VIIIb metal halide, metal carbonyl, metal carbonyl halide, metal acetate, metal sulfate, metal phosphate, or mixtures thereof;depositing the solution onto a substrate using a digital fabrication process;evaporating solvent, or allowing solvent to evaporate, under ambient condition to provide a layer comprising the first inorganic material, the layer having a thickness of from greater than 0 nanometers to 300 nanometers;exposing the layer to water; andannealing in the presence of oxygen or an oxygen-containing reactive species after exposing the precursor material to water, thereby forming an amorphous semiconducting thin film comprising a metal oxide suitable as a channel layer for thin film transistors with a field effect mobility value higher than 1 cm2/V·s. 29. A method for making a semiconductor material by solution deposition, and not suspension deposition, of inorganic compounds, comprising: providing a second solution consisting of an aprotic solvent and at least a first metal halide, wherein the metal is selected from a group Ia, IIa, IIIa, IVa, Va, Ib, IIb, IIIb, IVb, Vb, VIb, VIIb, or VIIIb metal, or mixtures thereof;depositing the first and second solutions on a substrate using a process selected from inkjet printing, spin coating, gravure, micro-pen, nano-fountain pen, dip-pen, screen printing, spray coating, slide coating, slot coating, curtain coating, dip coating, and combinations thereof;evaporating solvents, or allowing solvents to evaporate, under ambient conditions to provide a layer comprising the first inorganic material, the layer having a thickness of from greater than 0 nanometers to 300 nanometers;exposing the layer to water; andannealing the layer in the presence of oxygen or an oxygen-containing reactive species after exposing the precursor material to water, thereby forming an amorphous semiconducting thin film comprising a metal oxide suitable as a channel layer for thin film transistors with a field effect mobility value higher than 1 cm2/V·s. 30. A method for making an amorphous semiconductor material layer by solution deposition, and not suspension deposition, of an inorganic compound, comprising: providing a first solution consisting of an aprotic solvent and at least a first inorganic material selected from a Group Ia, IIa, IIIa, IVa, Va, Ib, IIb, IIIb, IVb, Vb, VIIb, VIIb, or VIIIb metal halide, metal carbonyl, metal carbonyl halide, metal acetate, metal sulfate, metal phosphate, or mixtures thereof;optionally providing a second solution consisting of an aprotic solvent and at least a first inorganic material selected from a Group Ia, IIa, IIIa, IVa, Va, Ib, IIb, IIIb, IVb, Vb, VIIb, VIIb, or VIIIb metal halide, metal carbonyl, metal carbonyl halide, metal acetate, metal sulfate, metal phosphate, or mixtures thereof;depositing at least the first, and optionally the second, solution onto a substrate using digital fabrication techniques;evaporating solvents, or allowing solvents to evaporate, under ambient conditions to provide at least a first layer comprising an inorganic compound or compounds comprising the first inorganic material, the layer having a thickness of from greater than 0 nanometers to 300 nanometers; andexposing the at least first layer to water; andannealing the at least first layer in the presence of oxygen or an oxygen-containing reactive species after exposing the inorganic compound or compounds comprising the first inorganic material to water, thereby forming an amorphous semiconducting thin film comprising a metal oxide suitable as a channel layer for thin film transistors with a field effect mobility value higher than 1 cm2/V·s. 31. A method for making a semiconducting thin film by solution deposition, and not suspension deposition, comprising: providing a solution consisting of an inorganic material selected from a metal halide or a combination of metal halides and an aprotic solvent capable of dissolving the metal halide or combination of metal halides;depositing the solution onto a substrate using a digital fabrication technique;evaporating the solvent, or allowing the solvent to evaporate, under ambient conditions to form a continuous thin film precursor comprising the inorganic material and having a thickness of at least 5 nanometers to 300 nanometers;exposing the precursor material to water; andannealing in the presence of oxygen or an oxygen-containing reactive species after exposing the precursor material to water, thereby forming an amorphous semiconducting thin film comprising a metal oxide suitable as a channel layer for thin film transistors with a field effect mobility value higher than 1 cm2/V·s. 32. A method for making an amorphous semiconductor material layer by solution deposition, and not suspension deposition, of an inorganic compound, comprising: providing a first solution consisting of an aprotic solvent and at least a first inorganic compound selected from a Group Ia, IIa, IIIa, IVa, Va, Ib, IIb, IIIb, IVb, Vb, VIIb, VIIb, or VIIIb metal halide, metal carbonyl, metal carbonyl halide, metal acetate, metal sulfate, metal phosphate, or mixtures thereof; andoptionally providing a second solution consisting of an aprotic solvent and at least a first inorganic compound comprising selected from a Group Ia, IIa, IIIa, IVa, Va, Ib, IIb, IIIb, IVb, Vb, VIIb, VIIb, or VIIIb metal halide, metal carbonyl, metal carbonyl halide, metal acetate, metal sulfate, metal phosphate, or mixtures thereof;depositing at least the first, and optionally the second, solution onto a substrate using digital fabrication techniques;evaporating solvents, or allowing solvents to evaporate, under ambient conditions to provide at least a first layer comprising the first inorganic compound, the layer having a thickness of from greater than 0 nanometers to 300 nanometers; andexposing the at least first layer to water; andannealing the at least first layer in the presence of oxygen or an oxygen-containing reactive species after exposing the inorganic compound or compounds comprising the first inorganic material to water, thereby forming an amorphous semiconducting thin film comprising a metal oxide suitable as a channel layer for thin film transistors with a field effect mobility value higher than 1 cm2/V·s.