초록

In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

대표청구항 ▼

1. An electronic device comprising: an inorganic light-emitting diode (LED) having first and second spaced-apart contacts; anda substrate that is at least one of (i) pliant in response to force and resilient or (ii) permanently deformable in response to force, the substrate having first and second c

1. An electronic device comprising: an inorganic light-emitting diode (LED) having first and second spaced-apart contacts; anda substrate that is at least one of (i) pliant in response to force and resilient or (ii) permanently deformable in response to force, the substrate having first and second conductive traces on a first surface thereof, the first and second conductive traces being separated on the substrate by a gap therebetween; anddisposed on the substrate, control circuitry electrically connected to the LED,wherein the first and second contacts are adhered to and in electrical contact with, respectively, the first and second conductive traces with a pressure-activated adhesive material without electrically bridging the traces or the contacts. 2. The device of claim 1, wherein the substrate comprises a local flexing or a local deformation for maintaining electrical contact between the contacts and traces during operation of the LED. 3. The device of claim 1, wherein the control circuitry is disposed on the first surface of the substrate. 4. The device of claim 1, wherein the substrate is (i) pliant in response to force and resilient but not (ii) permanently deformable in response to force. 5. The device of claim 1, wherein the substrate is (i) permanently deformable in response to force but not (ii) pliant in response to force and resilient. 6. The device of claim 1, wherein the adhesive material comprises an anisotropic conductive adhesive (ACA) electrically connecting the first contact only to the first trace and the second contact only to the second trace. 7. The device of claim 6, wherein a portion of the ACA is disposed in the gap and substantially isolates the first contact from the second contact. 8. The device of claim 1, wherein the substrate comprises a localized deformation between the first and second traces, whereby a distance between the first contact and the substrate is substantially equal to a distance between the second contact and the substrate. 9. The device of claim 1, wherein the LED comprises a semiconductor material comprising at least one of GaN, AlN, InN, or an alloy or mixture thereof. 10. The device of claim 1, wherein the LED comprises a phosphor material. 11. The device of claim 1, wherein the LED emits white light having a color temperature in the range of 2000K to 7000K. 12. The device of claim 1, further comprising a rigid frame on which the substrate is mounted. 13. The device of claim 1, wherein the LED is a packaged LED. 14. The device of claim 1, wherein the LED is a bare LED die. 15. The device of claim 1, wherein the first and second conductive traces comprise a conductive ink. 16. The device of claim 1, wherein the first and second conductive traces comprise at least one of silver, gold, aluminum, chromium, copper, or carbon. 17. The device of claim 1, wherein the substrate comprises at least one of polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polyethersulfone, polyester, polyimide, polyethylene, or paper. 18. The device of claim 1, wherein the gap between the first and second traces ranges between approximately 25 μm and approximately 1000 μm. 19. The device of claim 1, wherein there is no heat sink in thermal communication with the LED. 20. The device of claim 1, wherein the adhesive material comprises a substantially isotropic adhesive electrically connecting the first contact only to the first trace and the second contact only to the second trace, and further comprising a non-conductive adhesive material disposed in the gap. 21. The device of claim 1, wherein a reflectivity of the substrate for a wavelength emitted by the LED is greater than 80%. 22. The device of claim 1, wherein a transmittance of the substrate for a wavelength emitted by the LED is greater than 80%. 23. The device of claim 1, further comprising, disposed over the LED, a reflective surface for reflecting light toward the substrate. 24. The device of claim 1, wherein a junction temperature of the LED does not exceed 100° C. during operation. 25. The device of claim 1, wherein (i) the LED comprises a p-n junction and (ii) a thermal resistance from the p-n junction to ambient through the substrate is at least 500° C./W. 26. The device of claim 1, wherein the substrate is (i) pliant in response to force and resilient and (ii) permanently deformable in response to force. 27. The device of claim 1, further comprising: a plurality of additional inorganic LEDs each having first and second spaced-apart contacts, the inorganic LED and the additional inorganic LEDs being arranged in a two-dimensional array on the substrate,wherein a heat density generated by the two-dimensional array during operation is less than approximately 0.01 W/cm2. 28. The device of claim 27, wherein a pitch of the LEDs in the two-dimensional array is in the range of about 3 mm to about 30 mm. 29. The device of claim 1, further comprising a power supply electrically connected to the LED. 30. The device of claim 1, further comprising an optical element arranged to transmit light emitted by the LED. 31. The device of claim 1, further comprising third and fourth conductive traces on a second surface of the substrate opposite the first surface, the third and fourth conductive traces being separated on the substrate by a gap therebetween, a second inorganic LED having third and fourth spaced-apart contacts;wherein the third and fourth contacts are adhered to and in electrical contact with, respectively, the third and fourth conductive traces with a pressure-activated adhesive material without electrically bridging the third and fourth traces or the third and fourth contacts. 32. The device of claim 1, further comprising: a plurality of additional inorganic LEDs disposed on the substrate; anda housing (i) in which the substrate is at least partially disposed, (ii) in which the control circuitry is disposed, and (iii) configured to transmit light emitted from the LED and the plurality of additional LEDs. 33. The device of claim 1, wherein the control circuitry is configured to control dimming of the LED.