초록 ▼

A piezoelectric sensing device is described for measuring material thickness of targets such as pipes, tubes, and other conduits that carry fluids. The piezoelectric sensing device includes a piezoelectric element mounted to a flexible circuit with glass reinforced polyimide C-stage cover layers sur

A piezoelectric sensing device is described for measuring material thickness of targets such as pipes, tubes, and other conduits that carry fluids. The piezoelectric sensing device includes a piezoelectric element mounted to a flexible circuit with glass reinforced polyimide C-stage cover layers surrounding a pure polyimide C-stage core.

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1. A piezoelectric sensing device comprising: a plurality of piezoelectric elements; anda flexible circuit comprising a pure polyimide C-stage core between a first copper layer on a first side of the pure polyimide C-stage core and a second copper layer on a second side pure polyimide C-stage core o

1. A piezoelectric sensing device comprising: a plurality of piezoelectric elements; anda flexible circuit comprising a pure polyimide C-stage core between a first copper layer on a first side of the pure polyimide C-stage core and a second copper layer on a second side pure polyimide C-stage core opposite the first side, a first glass reinforced polyimide C-stage cover layer formed over the first copper layer, and a second glass reinforced polyimide C-stage cover layer formed over the second copper layer,wherein the plurality of piezoelectric elements are mounted to the flexible circuit in a plurality of windows formed in the first glass reinforced polyimide C-stage cover layer to receive the plurality of piezoelectric elements. 2. The piezoelectric sensing device of claim 1, wherein the plurality of piezoelectric elements are ceramic piezoelectric transducers. 3. The piezoelectric sensing device of claim 1, wherein the first copper layer comprises a first plurality of conductors and the second copper layer comprises a second plurality of conductors. 4. The piezoelectric sensing device of claim 3, further comprising a first plating layer on the first plurality of conductors. 5. The piezoelectric sensing device of claim 4, wherein the first plating layer comprises electrolysis nickel over immersion gold. 6. The piezoelectric sensing device of claim 4, wherein the first plating layer is applied only on the portion of the first plurality of conductors exposed by the plurality of windows. 7. The piezoelectric sensing device of claim 1, wherein the plurality of windows expose ground electrodes and hot electrodes. 8. The piezoelectric sensing device of claim 7, wherein the plurality of piezoelectric elements are soldered to the ground electrodes and the hot electrodes. 9. The piezoelectric sensing device of claim 3, further comprising a plurality of plated vias extending through the pure polyimide C-stage core to connect one or more of the first plurality of conductors to one or more of the second plurality of conductors. 10. The piezoelectric sensing device of claim 3, further comprising a connector on a first end of the flexible circuit, wherein the connector is coupled to the first plurality of conductors and the second plurality of conductors. 11. The piezoelectric sensing device of claim 1, wherein the first glass reinforced polyimide C-stage cover layer and the second glass reinforced polyimide C-stage cover layer comprises woven fibreglass. 12. A piezoelectric sensing device comprising: a plurality of ceramic piezoelectric transducers; anda flexible circuit comprising a pure polyimide C-stage core between a first plurality of conductors on a first side of the pure polyimide C-stage core and a second plurality of conductors on a second side pure polyimide C-stage core opposite the first side, a first glass reinforced polyimide C-stage cover layer formed over the first plurality of conductors, and a second glass reinforced polyimide C-stage cover layer formed over the second plurality of conductors,wherein the plurality of piezoelectric elements are mounted to the flexible circuit in a plurality of windows formed in the first glass reinforced polyimide C-stage cover layer to receive the plurality of ceramic piezoelectric transducers, andwherein the windows expose ground electrodes and hot electrodes to which the plurality of ceramic piezoelectric transducers are soldered. 13. The piezoelectric sensing device of claim 12, further comprising a first plating layer on the first plurality of conductors. 14. The piezoelectric sensing device of claim 13, wherein the first plating layer comprises electrolysis nickel over immersion gold. 15. The piezoelectric sensing device of claim 13, wherein the first plating layer is applied only on the portion of the first plurality of conductors exposed by the plurality of windows. 16. The piezoelectric sensing device of claim 12, further comprising a plurality of plated vias extending through the pure polyimide C-stage core to connect one or more of the first plurality of conductors to one or more of the second plurality of conductors. 17. The piezoelectric sensing device of claim 12, further comprising a connector on a first end of the flexible circuit, wherein the connector is coupled to the first plurality of conductors and the second plurality of conductors. 18. The piezoelectric sensing device of claim 12, wherein the first glass reinforced polyimide C-stage cover layer and the second glass reinforced polyimide C-stage cover layer comprises woven fibreglass.