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Carbon nanotube material is used in an integrated circuit substrate. According to an example embodiment, an integrated circuit arrangement (100) includes a substrate (110) with a carbon nanotube structure (120) therein. The carbon nanotube structure is arranged in one or more of a variety of manners

Carbon nanotube material is used in an integrated circuit substrate. According to an example embodiment, an integrated circuit arrangement (100) includes a substrate (110) with a carbon nanotube structure (120) therein. The carbon nanotube structure is arranged in one or more of a variety of manners to provide structural support and/or thermal conductivity. In some instances, the carbon nanotube structure is arranged to provide substantially all structural support for an integrated circuit arrangement. In other instances, the carbon nanotube structure is arranged to dissipate heat throughout the substrate. In still other instances, the carbon nanotube structure is arranged to remove heat from selected portions of the carbon nanotube substrate.

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1. An integrated circuit chip arrangement comprising: a substrate having a thickness and extending laterally perpendicular to the thickness, the substrate having a topmost surface and a bottom surface, the bottom surface having a conductive pad;a first circuit disposed on the topmost surface of the

1. An integrated circuit chip arrangement comprising: a substrate having a thickness and extending laterally perpendicular to the thickness, the substrate having a topmost surface and a bottom surface, the bottom surface having a conductive pad;a first circuit disposed on the topmost surface of the substrate;a support layer of carbon nanotube material in the substrate and below the topmost surface, the support layer configured and arranged to structurally support the substrate and the first circuit, the carbon nanotube material embedded in an epoxy resin, wherein the support layer includes a top portion having a first set of carbon nanotubes elongated in a first direction, a bottom portion having a second set of carbon nanotubes elongated in the first direction, and a middle portion extending from the top portion to the bottom portion and having a third set of carbon nanotubes elongated in a second direction that is substantially perpendicular to the first direction, wherein the first set of carbon nanotubes are disposed closer to the topmost surface of the substrate and arranged for supporting the first circuit than the second and third sets of carbon nanotubes, wherein at least one carbon nanotube from the third set of carbon nanotubes physically contacts at least one carbon nanotube from the first set of carbon nanotubes and wherein the at least one carbon nanotube from the third set of carbon nanotubes physically contacts at least one carbon nanotube from the second set of carbon nanotubes. 2. The arrangement of claim 1, wherein the support layer includes a carbon nanotube matrix. 3. The arrangement of claim 2, wherein the carbon nanotube matrix includes a multitude of carbon nanotubes extending laterally across substantially all of the substrate. 4. The arrangement of claim 1, wherein the support layer is configured and arranged to disperse heat across the substrate. 5. The arrangement of claim 1, wherein the support layer extends laterally across substantially the entire substrate. 6. The arrangement of claim 1, wherein the support layer of carbon nanotube material is configured and arranged for dispersing heat in the substrate. 7. The arrangement of claim 6, wherein the support layer is configured and arranged to remove heat from a second circuit in the substrate. 8. The arrangement of claim 6, wherein the support layer is configured and arranged to remove heat from the first circuit that is coupled to the substrate. 9. The arrangement of claim 1, wherein the support layer is electrically insulated from a second circuit in the substrate. 10. The arrangement of claim 1, further comprising: at least one through via extending along an axis from the top surface of the substrate to the bottom surface of the substrate such that the through via extends through at least a portion of the support layer, the at least one through via physically contacting the conductive pad along the axis on the bottom surface; andinsulative material configured and arranged for electrically insulating carbon nanotubes in the support layer from the at least one through via. 11. The arrangement of claim 1, wherein the first set of carbon nanotubes is arranged to direct heat away from selected portions of the topmost surface of the substrate to the third set of carbon nanotubes. 12. The arrangement of claim 11, wherein the second set of carbon nanotubes have a generally tubular structure with a length greater than a width and wherein the second set of carbon nanotubes is arranged to direct heat away from the selected portions of the bottom surface of the substrate to the third set of carbon nanotubes. 13. The arrangement of claim 1, wherein the third set of carbon nanotubes includes a plurality of carbon nanotubes having a generally tubular structure with a length greater than width, and wherein the third set of carbon nanotubes is arranged such that the length of the carbon nanotube provide substantial support to the structure in compression. 14. The arrangement of claim 1, further comprising a heat sink thermally coupled to the support layer of carbon nanotube material and arranged with the carbon nanotube material to remove heat from the substrate. 15. A circuit arrangement comprising: a substrate having a thickness and extending laterally perpendicular to the thickness;a topmost surface of the substrate having conductive pads, configured and arranged for coupling to integrated circuit chips;a lower surface of the substrate having conductive pads, configured and arranged for coupling to external circuits;a conductive interconnect system having a through via extending along substantially the same axis from the topmost surface of the substrate to the lower surface of the substrate such that the through via physically contacts the conductive pads on the lower surface and physically contacts the conductive pads on the topmost surface such that the conductive pads on the lower surface are coupled with the conductive pads on the topmost surface, the through via configured and arranged for passing signals between the conductive pads on the lower surface and the conductive pads on the topmost surface;a carbon nanotube layer in the substrate, vertically between the topmost and lower surfaces, and extending laterally across at least a portion of the substrate, the carbon nanotube layer including carbon nanotubes configured and arranged for at least one of: structurally supporting the substrate and conducting heat in the substrate, wherein the carbon nanotube layer includes an upper portion having a first set of carbon nanotubes elongated in a first direction, a lower portion having a second set of carbon nanotubes elongated in the first direction, and a middle portion extending from the upper portion to the lower portion and having a third set of carbon nanotubes elongated in a second direction that is substantially perpendicular to the first direction, wherein the first set of carbon nanotubes are disposed closer to the topmost surface of the substrate having conductive pads than the second and third sets of carbon nanotubes and wherein the first set of carbon nanotubes are disposed over the second and third sets of carbon nanotubes, wherein at least one carbon nanotube from the third set of carbon nanotubes physically contacts at least one carbon nanotube from the first set of carbon nanotubes;wherein the through via extends through the carbon nanotube layer and is electrically insulated from the carbon nanotubes,wherein a portion of the through via extending along the axis physically contacts at least one of the conductive pads on the topmost surface. 16. The arrangement of claim 15, wherein the carbon nanotubes are configured and arranged for conducting heat away from a selected portion of the substrate. 17. The arrangement of claim 16, wherein the carbon nanotubes are configured and arranged for conducting heat away from the through via extending through the carbon nanotube layer. 18. The arrangement of claim 15, wherein the carbon nanotube layer includes, at a location which the through via extends through, insulative material configured and arranged to electrically insulate the carbon nanotubes from the through via. 19. The arrangement of claim 15, wherein the carbon nanotube layer is configured and arranged to provide substantial structural support for the substrate. 20. The arrangement of claim 15, wherein the carbon nanotube layer comprises substantially the entire substrate and wherein the conductive interconnect system is in the carbon nanotube layer. 21. The arrangement of claim 15, wherein the at least one carbon nanotube from the third set of carbon nanotubes physically contacts at least one carbon nanotube from the second set of carbon nanotubes. 22. A method for manufacturing an integrated circuit substrate for transferring heat, the method comprising: providing a substrate having a topmost surface that includes conductive pads configured and arranged for coupling to integrated circuit chips and a lower surface having conductive pads configured and arranged for coupling to external circuits;creating a through via extending along a straight line from the topmost surface of the substrate to the lower surface of the substrate such that the through via physically contacts the conductive pads along the straight line on the lower surface and physically contacts the conductive pads along the straight line on the topmost surface, the through via configured and arranged for passing signals between the conductive pads on the lower surface and the conductive pads on the topmost surface; andcharacterizing heat-generating components of the integrated circuit substrate; andarranging carbon nanotube structures in the substrate to create a carbon nanotube layer that transfers heat away from the heat-generating components, wherein the through via extends through the carbon nanotube layer, wherein the carbon nanotube layer is non-electrically conductive, wherein the carbon nanotube layer includes an upper portion having a first set of carbon nanotubes elongated in a first direction, a lower portion having a second set of carbon nanotubes elongated in the first direction, and a middle portion extending from the upper portion to the lower portion and having a third set of carbon nanotubes elongated in a second direction that is substantially perpendicular to the first direction, wherein the first set of carbon nanotubes are disposed closer to the topmost surface of the substrate that includes conductive pads than the second and third sets of carbon nanotubes, wherein at least one carbon nanotube from the third set of carbon nanotubes physically contacts at least one carbon nanotube from the first set of carbon nanotubes and wherein the at least one carbon nanotube from the third set of carbon nanotubes physically contacts at least one carbon nanotube from the second set of carbon nanotubes. 23. The method of claim 22, wherein arranging carbon nanotube structures in the substrate to transfer heat away from the heat-generating components includes arranging a first end of a carbon nanotube structure immediately adjacent a heat-generating component and arranging a second end of the carbon nanotube structure in a location amenable to the removal of heat from the substrate. 24. The method of claim 23, further comprising arranging carbon nanotubes, having a length substantially greater than width, in the carbon nanotube layer in a direction generally parallel to the direction between the first and second ends to facilitate heat transfer along the length of the carbon nanotubes.