Structural configuration of a heat exchanger door for an electronics rack
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-007/20
G06F-001/20
출원번호
US-0443084
(2012-04-10)
등록번호
US-8693198
(2014-04-08)
발명자
/ 주소
Eckberg, Eric A.
Mahaney, Jr., Howard V.
Megarity, William M.
Schmidt, Roger R.
Shah, Tejas
Shurson, Scott A.
출원인 / 주소
International Business Machines Corporation
대리인 / 주소
Jung, Esq., Dennis
인용정보
피인용 횟수 :
6인용 특허 :
20
초록▼
A heat exchanger door is provided which includes a door assembly spanning at least a portion of the air inlet or outlet side of an electronics rack. The door assembly includes an airflow opening which facilitates air ingress or egress of airflow through the electronics rack. The door assembly furthe
A heat exchanger door is provided which includes a door assembly spanning at least a portion of the air inlet or outlet side of an electronics rack. The door assembly includes an airflow opening which facilitates air ingress or egress of airflow through the electronics rack. The door assembly further includes an air-to-coolant heat exchanger and a structural support. The heat exchanger is disposed so that airflow through the airflow opening passes across the heat exchanger. The heat exchanger includes a heat exchanger core and a heat exchanger casing coupled to the core. The core includes at least one coolant-carrying channel which loops through the casing. The structural support is attached to the heat exchanger casing to define with the casing a tubular door support structure. The looping of the coolant-carrying channel(s) through the heat exchanger casing resides within the tubular door support structure.
대표청구항▼
1. An apparatus comprising: a heat exchanger door configured to hingedly couple to an electronics rack along a hinge axis and reside at one of an air inlet side or an air outlet side of the electronics rack, wherein the heat exchanger door comprises: a door assembly sized and configured to span at l
1. An apparatus comprising: a heat exchanger door configured to hingedly couple to an electronics rack along a hinge axis and reside at one of an air inlet side or an air outlet side of the electronics rack, wherein the heat exchanger door comprises: a door assembly sized and configured to span at least a portion of the air inlet side or the air outlet side of the electronics rack, the door assembly comprising an airflow opening, the airflow opening facilitating the ingress or egress of airflow through the electronics rack with the heat exchanger door coupled thereto, the door assembly comprising: an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger to extract heat from the airflow passing thereacross, and comprising a heat exchanger core and a heat exchanger casing coupled to the heat exchanger core, the heat exchanger core comprising: at least one coolant-carrying channel which loops through the heat exchanger casing; anda vertically-extending casing portion; anda structural support attached to the heat exchanger casing, the structural support comprises a vertically-extending structural support attached to the vertically-extending casing portion, the vertically-extending structural support attached to the vertically-extending heat exchanger casing defining a tubular door support structure, wherein the at least one coolant-carrying channel loops through the heat exchanger casing within the tubular door support structure defined by the structural support and the heat exchanger casing,wherein the hinge axis passes through the tubular door support structure of the heat exchanger door. 2. The apparatus of claim 1, wherein the tubular door support structure defined by the vertically-extending structural support attached to the vertically-extending casing portion is an elongate tubular beam. 3. The apparatus of claim 2, wherein the elongate tubular beam is rectangular-shaped in transverse cross-section. 4. The apparatus of claim 1, wherein the tubular door support structure is disposed adjacent to a hinge edge of the heat exchanger door, the hinge edge being a region of the heat exchanger door configured to hingedly couple to the electronics rack. 5. The apparatus of claim 1, further comprising an upper support bracket and a lower support bracket, the upper support bracket and the lower support bracket being disposed within the tubular door support structure at upper and lower portions, respectively, of the tubular door support structure, and being coupled to the structural support and to the heat exchanger casing to enhance structural rigidity to the door assembly. 6. The apparatus of claim 1, wherein the at least one coolant-carrying channel of the heat exchanger core comprises a plurality of coolant-carrying channels defined by a plurality of tubes, the plurality of tubes including a plurality of tube bends residing within the tubular door support structure. 7. The apparatus of claim 1, wherein the door assembly farther comprises a coolant inlet manifold and a coolant outlet manifold coupled to facilitate flow of coolant through the air-to-coolant heat exchanger, the coolant inlet manifold and the coolant outlet manifold being disposed at an opposite side of the heat exchanger core from the tubular door support structure defined by the heat exchanger casing and the structural support attached thereto. 8. An assembly comprising: an electronics rack, the electronics rack comprising an air inlet side and an air outlet side; anda heat exchanger door hingedly coupled to the electronics rack along a hinge axis at one of the air inlet side or the air outlet side thereof, the heat exchanger door comprising: a door assembly sized and configured to span at least a portion of the air inlet side or the air outlet side of the electronics rack, the door assembly comprising an airflow opening, the airflow opening facilitating the ingress or egress of airflow through the electronics rack, the door assembly further comprising: an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger to extract heat from the airflow passing thereacross, and comprising a heat exchanger core and a heat exchanger casing coupled to the heat exchanger core, the heat exchanger core comprising: at least one coolant-carrying channel which loops through the heat exchanger casing; anda vertically-extending casing portion; anda structural support attached to the heat exchanger casing, the structural support comprises a vertically-extending structural support attached to the vertically-extending casing portion, the vertically-extending structural support attached to the vertically-extending heat exchanger casing defining a tubular door support structure, wherein the at least one coolant-carrying channel loops through the heat exchanger casing within the tubular door support structure defined by the structural support and the heat exchanger casing,wherein the hinge axis passes through the tubular door support structure of the heat exchanger door. 9. The assembly of claim 8, wherein the tubular door support structure defined by the vertically-extending structural support attached to the vertically-extending casing portion is an elongate tubular beam. 10. The assembly of claim 9, wherein the elongate tubular beam is rectangular-shaped in transverse cross-section. 11. The assembly of claim 8, wherein the tubular door support structure is disposed adjacent to a hinge edge of the heat exchanger door, the hinge edge being a region of the heat exchanger door hingedly coupled to the electronics rack. 12. The assembly of claim 8, further comprising an upper support bracket and a lower support bracket, the upper support bracket and the lower support bracket being disposed within the tubular door support structure at upper and lower portions, respectively, of the tubular door support structure, and being coupled to the structural support and to the heat exchanger casing to enhance structural rigidity to the door assembly. 13. The assembly of claim 8, wherein the at least one coolant-carrying channel of the heat exchanger core comprises a plurality of coolant-carrying channels defined by a plurality of tubes, the plurality of tubes including a plurality of tube bends residing within the tubular door support structure. 14. The assembly of claim 8, wherein the door assembly further comprises a coolant inlet manifold and a coolant outlet manifold coupled to facilitate flow of coolant through the air-to-coolant heat exchanger, the coolant inlet manifold and the coolant outlet manifold being disposed at an opposite side of the heat exchanger core from the tubular door support structure defined by the heat exchanger casing and the structural support attached thereto.
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이 특허에 인용된 특허 (20)
Chu,Richard C.; Ellsworth, Jr.,Michael J.; Porter,Donald W.; Schmidt,Roger R.; Simons,Robert E., Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack.
Chu, Richard C.; Ellsworth, Jr., Michael J.; Porter, Donald W.; Schmidt, Roger R.; Simons, Robert E., Apparatus for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack.
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Chu, Richard C.; Ellsworth, Jr., Michael J.; Furey, Edward; Schmidt, Roger R.; Simons, Robert E., Method and apparatus for combined air and liquid cooling of stacked electronics components.
Chu, Richard C.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Method and system for cooling electronics racks using pre-cooled air.
Bard, Seth E.; Boyes, Jr., Robert N.; Muenkel, Gerard F.; Nobile, Matthew A., Noise-reducing attachment apparatus for heat exchanger door of an electronics rack of a data center.
Porter, Donald W.; Schmidt, Roger R.; Takayoshi, Jyunji; Tsukamoto, Takeshi; Yamada, Yasuharu, Vapor-compression heat exchange system with evaporator coil mounted to outlet door of an electronics rack.
Bard, Seth E.; Bosco, Frank E.; Goth, Gary F.; Kostenko, William P.; McIntosh, Steven C.; Mullady, Robert K.; Torok, John G.; VanDeventer, Allan C.; Wei, Xiaojin, Changeable, airflow venting cover assembly for an electronics rack.
Eckberg, Eric A.; Mahaney, Jr., Howard V.; Megarity, William M.; Schmidt, Roger R.; Shah, Tejas; Shurson, Scott A., Heat exchanger door for an electronics rack.
Eckberg, Eric A.; Mahaney, Jr., Howard V.; Megarity, William M.; Schmidt, Roger R.; Shah, Tejas; Shurson, Scott A., Heat exchanger door for an electronics rack.
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