|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||361/701; 361/679.53; 361/699; 165/104.33; 165/168; 165/178; 312/236|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 3 인용 특허 : 20|
A method is provided which includes providing a heat exchanger door that includes a door assembly spanning at least a portion of the air inlet or outlet side of an electronics rack. The door assembly includes an airflow opening which facilitates air ingress or egress of airflow through the electronics rack. The door assembly further includes an air-to-coolant heat exchanger and a structural support. The heat exchanger is disposed so that airflow through the airflow opening passes across the heat exchanger. The heat exchanger includes a heat exchanger cor...
1. A method comprising: providing a heat exchanger door configured to hingedly couple to an electronics rack along a hinge axis and reside at one of an air inlet side or an air outlet side of the electronics rack, and wherein the heat exchanger door comprises:a door assembly sized and configured to span at least a portion of the air inlet side or the air outlet side of the electronics rack, the door assembly comprising an airflow opening, the airflow opening facilitating the ingress or egress of airflow through the electronics rack with the heat exchange...