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A heating/cooling device for a microfluidic apparatus having a thermal insulating substrate. The device includes heating/cooling chamber for heating and/or cooling a sample disposed in the chamber; a waste heat channel for carrying away waste heat and/or waste cooling; and at least one Peltier junct

A heating/cooling device for a microfluidic apparatus having a thermal insulating substrate. The device includes heating/cooling chamber for heating and/or cooling a sample disposed in the chamber; a waste heat channel for carrying away waste heat and/or waste cooling; and at least one Peltier junction having first and second opposing faces, the first face thereof facing towards said heating/cooling chamber and being in thermal communication therewith for providing either heat or cooling to the chamber in response to a flow of electrical current through the at least one Peltier junction, the second face thereof facing towards said waste heat channel and being in thermal communication therewith for either receiving heat from or dumping heat to the channel in response to a flow of electrical current through the Peltier junction.

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1. A microfluidic apparatus comprising a thermally insulating substrate and a heating/cooling device, wherein a contact surface of the thermally insulating substrate contacts at least partially the heating/cooling device, the heating/cooling device including: a heating/cooling chamber for heating an

1. A microfluidic apparatus comprising a thermally insulating substrate and a heating/cooling device, wherein a contact surface of the thermally insulating substrate contacts at least partially the heating/cooling device, the heating/cooling device including: a heating/cooling chamber for heating and/or cooling a sample disposed in said chamber;a waste heat channel for carrying away waste heat and/or supplying thermal energy, the waste heat channel being fluidically disconnected from the heating/cooling chamber; andat least one Peltier junction having first and second opposing faces, the first face thereof facing towards said heating/cooling chamber and being in thermal communication therewith for providing either heat or cooling to said chamber in response to a flow of electrical current through said at least one Peltier junction, the second face thereof facing towards said waste heat channel and being in thermal communication therewith for either receiving heat from or dumping heat to said channel in response to a flow of electrical current through said at least one Peltier junction, wherein said at least one Peltier junction is thus configured to transfer heat between said heating/cooling chamber and said waste heat channel,wherein the heating/cooling chamber, the waste heat channel, the at least one Peltier junction and the thermally insulating substrate are configured to form a multilevel arrangement inside the microfluidic apparatus, a first level being composed of the thermally insulating substrate supporting a second level, the second level comprising the heating/cooling chamber, the waste heat channel, and the at least one Peltier junction, wherein the heating/cooling chamber, the waste channel and the at least one Peltier junction are arranged side by side within the second level along said contact surface, wherein the thermally insulating substrate is fluidically disconnected from the heating/cooling chamber and the waste heat channel. 2. The heating/cooling device for a microfluidic apparatus of claim 1 wherein the at least one Peltier junction comprises at least two Peltier junctions connected in series with a common bus bar connected between a first face of two of said at least two Peltier junctions, the common bus bar being formed from a metallic material and disposed to face said chamber for conducting thermal energy between said two of said at least two Peltier junctions and said chamber. 3. The heating/cooling device for a microfluidic apparatus of claim 2 wherein the at least one Peltier further comprises at least two additional Peltier junctions connected in series with an additional common bus bar connected between a first face of two of said at least two additional Peltier junctions, the additional common bus bar being formed from a metallic material and disposed to face said chamber to conduct thermal energy between said at least two additional Peltier junctions and said chamber. 4. The heating/cooling device for a microfluidic apparatus of claim 2 wherein the at least one Peltier further comprises at least two additional Peltier junctions connected in series and wherein said common bus bar coupled to a first face of two of said at least two additional Peltier junctions. 5. The heating/cooling device for a microfluidic apparatus of claim 4 wherein said chamber is formed from glass. 6. The heating/cooling device for a microfluidic apparatus of claim 5 wherein said chamber is a glass vessel. 7. The heating/cooling device for a microfluidic apparatus of claim 4 wherein said chamber is formed at least partially from polydimethylsiloxane having a fluid impervious coating thereon on surfaces of the polydimethylsiloxane facing said chamber. 8. The heating/cooling device for a microfluidic apparatus of claim 1 wherein said chamber is formed at least partially from polydimethylsiloxane having a fluid impervious coating thereon on surfaces of the polydimethylsiloxane facing said chamber. 9. The heating/cooling device for a microfluidic apparatus of claim 1 wherein said chamber is formed from an elongate glass tube. 10. The heating/cooling device for a microfluidic apparatus of claim 2 wherein said chamber is formed from an elongate glass tube. 11. The heating/cooling device for a microfluidic apparatus of claim 10, wherein said common bus bar at least partially surrounds an outer circumference of said elongate glass tube. 12. The heating/cooling device for a microfluidic apparatus of claim 11 wherein said elongate glass tube has a circular cross section. 13. The microfluidic apparatus of claim 1, further comprising an overlaying layer disposed on the heating/cooling device, wherein the overlaying layer is fluidically disconnected from the heating/cooling chamber. 14. The microfluidic apparatus of claim 1, wherein: the waste heat channel is configured for carrying away waste heat when the at least one Peltier junction is configured to cool the sample disposed in the heating/cooling chamber, andthe waste heat channel is configured for carrying away waste cooling when the at least one Peltier junction is configured to heat the sample disposed in the heating/cooling chamber. 15. The microfluidic apparatus of claim 1, wherein the waste heat channel comprises a layer of liquid impervious material along exposed interior surfaces of the waste heat channel. 16. The microfluidic apparatus of claim 1, wherein the thermally insulating substrate comprises a layer of polydimethylsiloxane material. 17. The microfluidic apparatus of claim 1, wherein the heating/cooling device is disposed on the thermally insulating substrate.