초록 ▼

A hermetic interconnect for medical devices is disclosed. In one embodiment, the interconnect includes platinum leads co-fired between alumina substrates to form a monolithic composite that is subsequently bonded into a titanium alloy flange. Both methodology for forming these interconnects as well

A hermetic interconnect for medical devices is disclosed. In one embodiment, the interconnect includes platinum leads co-fired between alumina substrates to form a monolithic composite that is subsequently bonded into a titanium alloy flange. Both methodology for forming these interconnects as well as specific geometries and compositions are disclosed. Interconnects formed in this fashion enable significant reductions in overall size of the interconnect relative to the number of feedthrough leads as well as substantial improvements in robustness versus currently available technology.

대표청구항 ▼

1. An implantable biocompatible hermetic feedthrough comprising: a first ceramic insulative biocompatible layer having at least one bonding surface;a second ceramic insulative biocompatible layer bonded to the first insulative layer at the bonding surface; andone or more biocompatible metal conducto

1. An implantable biocompatible hermetic feedthrough comprising: a first ceramic insulative biocompatible layer having at least one bonding surface;a second ceramic insulative biocompatible layer bonded to the first insulative layer at the bonding surface; andone or more biocompatible metal conductors compacted between the first and second insulative ceramic layers along at least a portion of the bonding surface, said bonding surface having a planar portion and the conductors disposed parallel to the planar portion such that the one or more conductors extend along the bonding surface wherein the one or more conductors and first and second insulative layers form a co-fired monolithic ceramic-to-metal composite structure after being fired together with the first and second insulative layers hermetically bonded at the bonding surface such that the one or more biocompatible conductors are exposed at both ends of the co-fired monolithic ceramic-to-metal composite structure. 2. The feedthrough of claim 1 wherein the conductor is formed of material selected from the group consisting of platinum, palladium, gold, niobium, tantalum, and alloys of any of the foregoing. 3. The feedthrough of claim 1 wherein at least one of the first or second insulative layers is formed of material selected from the group consisting of alumina, titania, zirconia, and alloys containing any of the foregoing. 4. The feedthrough of claim 1, wherein there are more than one conductors electrically isolated from each other by the insulative layers and having center-to-center spacing as low as 0.0005 inches. 5. A method of forming an implantable biocompatible hermetic feedthrough comprising: providing a first ceramic insulative biocompatible layer with at least one bonding surface;providing a second ceramic insulative biocompatible layer;disposing one or more biocompatible metal conductors between the first and second ceramic insulative layers along at least a portion of the bonding surface and parallel to a planar portion of the bonding surface;compressing the ceramic insulative biocompatible layers to facilitate alignment and bonding of the ceramic insulative layers around the biocompatible conductors;hermetically bonding the first and second ceramic insulative layer at the bonding surface;machining the feedthrough from the bonded insulative layers such that the one or more conductors are exposed at opposite ends of the feedthrough; andfiring the bonded first and second layers, before or after machining the feedthrough, to form a co-fired monolithic ceramic-to-metal structure. 6. The method of claim 5 wherein disposing further comprises depositing conductive material into at least one void defined by at least one insulative layer. 7. The method of claim 6 further comprising forming each of the first and second layers of insulative material as a slurry and then drying the slurry. 8. The method of claim 5 further comprising forming the one or more conductors from material selected from the group consisting of platinum, palladium, gold, niobium, tantalum, and alloys of any of the foregoing. 9. The method of claim 5 further comprising forming at least one of the first or second insulative layers from material selected from the group consisting of alumina, titania, zirconia, and alloys containing any of the foregoing. 10. The method of claim 5 further comprising defining an external surface of the freedthrough at at least one of the first and second insulative layers and forming each of the first and second insulative layers of different chemical composition than the other. 11. The feedthrough of claim 1 wherein the conductor is in the form of ink, foil, or wire. 12. The feedthrough of claim 1 wherein the conductor is vapor-deposited onto at least one of the first and second insulative layers. 13. The feedthrough of claim 1 further comprising a co-fired body comprising the bonded insulative layers mounted in a structure such that portions of the conductors lying between said bonded insulative layers extend through the structure whereby first terminal portions and second terminal portions of the conductors are exposed on different sides of the structure. 14. The feedthrough of claim 13 wherein the structure is a flange for mounting the feedthrough in a further structure. 15. The feedthrough of claim 13 wherein the terminal portions are exposed ends of the conductors. 16. The feedthrough of claim 13 wherein the conductors extend over an exposed surface of at least one of said bonded layers of insulative material to form the terminal portions. 17. The method of claim 5, wherein machining further comprises machining the bonded insulative layers to form a plurality of individually separated feedthroughs. 18. The method of claim 5, wherein machining further comprises machining the bonded insulative layers perpendicular to the planar portion to form a plurality of individually separated feedthroughs. 19. The method of claim 5, wherein bonding comprises applying pressure to the first and second insulative layers. 20. The method of claim 6, wherein disposes further comprises depositing with a pattern between the first and second insulative layers. 21. The method of claim 5, further comprising forming at least one of the first and second insulative layers as a tape. 22. The method of claim 5, further comprising alternatively layering ceramic powder and conductor, wherein said ceramic powder forms the first and second insulative layers. 23. The method of claim 6, wherein disposing further comprises forming the one or more conductors from ink, foil, or wire or powder or vapor deposited onto at least one of the first and second insulative layers. 24. The method of claim 23, wherein the one or more conductors are formed of foil and further comprising folding the foil over the ends of the feedthrough. 25. The method of claim 5, further comprising stacking multiple layers of conductors sandwiched between the first and second insulative layers. 26. The feedthrough of claim 1, further comprising a multilayer stack of conductors sandwiched between the first and second insulative layers. 27. The feedthrough of claim 1, wherein there are more than one conductors electrically isolated from each other by the insulative layers and having center-to-center spacing of as small as 0.0005 inches. 28. A feedthrough formed by the method of claim 17. 29. A feedthrough formed by the method of claim 18.