초록 ▼

Sputtering targets are described that comprise: a) a target surface component comprising a target material; b) a core backing component having a coupling surface, a back surface and at least one open area, wherein the coupling surface is coupled to at least part of the target surface component; and

Sputtering targets are described that comprise: a) a target surface component comprising a target material; b) a core backing component having a coupling surface, a back surface and at least one open area, wherein the coupling surface is coupled to at least part of the target surface component; and wherein at least part of the target surface component fits into at least one open area of the core backing component. In some embodiments, the target surface component, the core backing component or a combination thereof have at least one surface area feature coupled to or located in the back surface of the core backing component, the target surface component or a combination thereof, wherein the surface area feature increases the cooling effectiveness of the target surface component. Methods of forming a sputtering target are also described that comprises: a) providing a target surface component comprising a surface material; b) providing a core backing component having a coupling surface, a back surface and at least one open area; c) coupling the coupling surface to at least part of the target surface component, wherein at least part of the target surface component fits into the at least one open area of the core backing component.

대표청구항 ▼

1. A sputtering target, comprising: a front target surface;a back target surface opposite the front target surface;a target surface component comprising a target material; anda core backing component having a coupling surface, a back surface, a thickness and at least one opening or open area through

1. A sputtering target, comprising: a front target surface;a back target surface opposite the front target surface;a target surface component comprising a target material; anda core backing component having a coupling surface, a back surface, a thickness and at least one opening or open area through the thickness of the core backing component,wherein at least a portion of the target surface component is disposed within the at least one opening or open area of the core backing component such that the back surface of the core backing component and a portion of the target surface component form the back target surface of the sputtering target, andwherein the coupling surface of the core backing component is coupled to the target surface component at a plurality of localized, discrete welds, andwherein at least a portion of the target surface component is coplanar with the back surface of the core backing component, andwherein the target surface component is continuous at the front target surface in a direction transverse to a longitudinal axis extending through the front target surface and the back target surface. 2. The sputtering target of claim 1, wherein the core backing component comprises a core material. 3. The sputtering target of claim 1, wherein the target material comprises aluminum, copper, titanium, tantalum, cobalt, tungsten, chalcogenides, nickel, ruthenium combinations and alloys thereof. 4. The sputtering target of claim 2, wherein the core material comprises aluminum, copper, chromium, steel, titanium, combinations and alloys thereof. 5. The sputtering target of claim 1, and further comprising at least one additional material positioned between the target surface component and the coupling surface of the core backing component. 6. The sputtering target of claim 5, wherein the at least one additional material is selected from the group consisting of solders, conductive polymers, conductive pastes, adhesives, metals and alloys. 7. The sputtering target of claim 1, wherein the welds are produced by E-beam welding, diffusion welding, LASER welding or a combination thereof. 8. The sputtering target of claim 1, wherein at least one weld includes a filler material or brazing material. 9. The sputtering target of claim 1, wherein at least one weld is reinforced by a mechanical reinforcement. 10. The sputtering target of claim 9, wherein the mechanical reinforcement comprises a wedge design, a locking pin, an interlocking design or a combination thereof. 11. The sputtering target of claim 1, further comprising at least one surface area feature coupled to or located in the back surface of the core backing component, the target surface component or a combination thereof, wherein the surface area feature increases the cooling effectiveness of the target surface component. 12. The sputtering target of claim 11, wherein the at least one surface area feature comprises channels, grooves, bumps, dimples, indentations or a combination thereof. 13. The sputtering target of claim 1, wherein the target material comprises aluminum, copper or a combination thereof. 14. The sputtering target of claim 1, wherein the core backing component is annular and wherein the at least one opening or open area is annular and comprises a first diameter at a first location and a second diameter at a second location, and wherein the first diameter and the second diameter are different. 15. The sputtering target of claim 1, wherein the back target surface of the sputtering target is configured to be in direct contact with a coolant. 16. The sputtering target of claim 1, wherein a first weld is located at a first radial position from the longitudinal axis and a second weld is located at a second radial position from the longitudinal axis, and wherein the first radial position and the second radial position are different. 17. The sputtering target of claim 1, wherein at least one weld of the plurality of welds couples the target surface component and the core backing component at an interface that is perpendicular to the back target surface. 18. A method of forming sputtering target, the method comprising: positioning at least part of a target surface component within at least one opening or open area of a core backing component so that part of the target surface component and the core backing component form a back surface of the sputtering target and are coplanar along at least a portion of the back surface of the sputtering target; andcoupling the target surface component to the core backing component at a plurality of discrete, localized welds,wherein the sputtering target includes a front surface opposite the back surface and the target surface component is continuous at the front surface of the sputtering target in a direction transverse to a longitudinal axis extending through the front surface and the back surface of the sputtering target. 19. The method of claim 18 wherein the coupling step includes localized heating. 20. A sputtering target, comprising: a front target surface;a back target surface opposite the front target surface;a target surface component comprising a target material and having a thickness defined between the front target surface and the back target surface; anda core backing component having a coupling surface, a back surface, a thickness and at least one opening or open area through the core backing component thickness,wherein at least a portion of the target surface component is disposed within the at least one opening or open area of the core backing component such that the back surface of the core backing component and a portion of the target surface component form the back target surface of the sputtering target, andwherein the coupling surface of the core backing component is coupled to the target surface component at a plurality of localized, discrete welds, andwherein at least a portion of the target surface component is coplanar with the back surface of the core backing component, andwherein a maximum thickness of the target surface component is greater than a maximum thickness of the core backing component.