초록 ▼

A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt

A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors.

대표청구항 ▼

1. A circuit comprising a transition line conductor composition-comprising a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium , the circuit having at least a first elec

1. A circuit comprising a transition line conductor composition-comprising a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium , the circuit having at least a first electrical connection and a second electrical connection, said first electrical connection being to a gold line conductor or a gold via and said second electrical connection to a silver line conductor or a silver via, wherein the transition line conductor contacts the first electrical connection at only one interface and the second electrical connection at only one interface, wherein interface of the first and second electrical connection are different, wherein the transition line conductor is not positioned perpendicular across a via. 2. The composition of claim 1, further comprising (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. 3. A circuit comprising the transition via of claim 1 having at least a first electrical connection and a second electrical connection, said first electrical connection being to a gold line conductor and said second electrical connection to a silver line conductor. 4. A multi-layer transition via comprising at least a first layer and a second layer in electrical contact with each other, wherein said first layer comprises (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium, and the second layer comprises(a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium, and wherein said first layer and said second layer are different, and wherein the wt % of gold in the inorganic component of said first layer is greater than the wt % of gold in the inorganic component of said second layer. 5. The multi-layer transition via of claim 4 wherein either or both of the first and second layers further comprises (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. 6. A circuit comprising the multi-layer transition via of claim 4 or claim 5 having at least a first electrical connection and a second electrical connection, said first electrical connection being between the first layer and a gold conductor and said second electrical connection being between the second layer and a silver conductor.