IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
|
| 국제특허분류(IPC7판) |
|
| 출원번호 |
US-0519932
(2010-10-08)
|
| 등록번호 |
US-8708683
(2014-04-29)
|
| 국제출원번호 |
PCT/US2010/051889
(2010-10-08)
|
| §371/§102 date |
20120629
(20120629)
|
| 국제공개번호 |
WO2011/081694
(2011-07-07)
|
|
발명자
/ 주소 |
- Belzile, Manon Danielle
- Blais, Paul R.
- Esser, Brian
- Dezon-Gaillard, Patrice Fabien
- Jenko, Edward Joseph
- Knapp, John
|
| 출원인 / 주소 |
- Husky Injection Molding Systems Ltd.
|
| 인용정보 |
피인용 횟수 :
0 인용 특허 :
36 |
초록
▼
A mold-tool system for use with a molding-system platen structure, the mold-tool system a frame assembly being connectable with the molding-system platen structure (107); and a set of shooting-pot assemblies being supported by the frame assembly, wherein control of each shooting-pot assembly of the
A mold-tool system for use with a molding-system platen structure, the mold-tool system a frame assembly being connectable with the molding-system platen structure (107); and a set of shooting-pot assemblies being supported by the frame assembly, wherein control of each shooting-pot assembly of the set of shooting-pot assemblies is independent.
대표청구항
▼
1. A mold-tool system for use with a molding-system platen structure, the mold-tool system comprising: a frame assembly being connectable with the molding-system platen structure; anda set of shooting-pot assemblies being supported by the frame assembly, wherein each shooting-pot assembly of the set
1. A mold-tool system for use with a molding-system platen structure, the mold-tool system comprising: a frame assembly being connectable with the molding-system platen structure; anda set of shooting-pot assemblies being supported by the frame assembly, wherein each shooting-pot assembly of the set of shooting-pot assemblies is controlled to actuate independently of other shooting-pot assemblies within the set of shooting-pot assemblies. 2. The mold-tool system of claim 1, wherein: the frame assembly includes a hot-runner frame assembly of a mold-runner system, andthe set of shooting-pot assemblies are supported by the hot-runner frame assembly. 3. The mold-tool system of claim 2, further comprising: a melt-distribution assembly being connected to the set of shooting-pot assemblies, the melt-distribution assembly configured to distribute a melt to the set of shooting-pot assemblies. 4. The mold-tool system of claim 3, wherein: the melt-distribution assembly is configured to: (i) connect with a first-machine nozzle of a first-melt liquefier being configured to provide a first resin to the melt-distribution assembly; and(ii) connect with a second-machine nozzle of a second-melt liquefier being configured to supply a second resin to the melt-distribution assembly. 5. The mold-tool system of claim 3, wherein: the melt-distribution assembly includes:a relatively lower-pressure circuit, anda relatively higher-pressure circuit,the relatively lower-pressure circuit is configured to connect a machine nozzle of a melt-liquefier assembly with the set of shooting-pot assemblies,the relatively higher-pressure circuit is configured to connect the set of shooting-pot assemblies with a mold assembly. 6. The mold-tool system of claim 5, wherein: the relatively lower-pressure circuit includes: a grouping of melt-splitter assemblies, anda collection of conduits,the grouping of melt-splitter assemblies and the collection of conduits are configured to connect the machine nozzle of the melt-liquefier assembly with the set of shooting-pot assemblies in accordance with a hierarchy of interconnected levels. 7. The mold-tool system of claim 6, wherein: the collection of conduits includes flexible conduits. 8. The mold-tool system of claim 6, wherein: the collection of conduits includes rigid conduits. 9. The mold-tool system of claim 3, wherein: at least one shooting-pot assembly of the set of shooting-pot assemblies has a different volume of melt in comparison to a volume of melt in at least one other shooting-pot assembly of the set of shooting-pot assemblies. 10. The mold-tool system of claim 3, further comprising: a sensor assembly being connected with shooting-pot assemblies of the set of shooting-pot assemblies, the sensor assembly being configured to provide sensed signals indicating: (i) a position parameter, and (ii) a speed parameter associated with the shooting-pot assemblies;a group of shooting-pot actuators being connected with a respective shooting-pot assembly of the set of shooting-pot assemblies; anda computer system, including: a processor;a sensor-interface module connecting the processor with the sensor assembly;a control-interface module connecting the processor with the group of shooting-pot actuators; anda controller-usable medium connected with the processor, the controller-usable medium embodying a collection of instructions being executable by the processor, the collection of instructions being configured to direct the processor to: monitor, via the sensor-interface module, the sensed signals associated with the sensor assembly; andcontrol, via the control-interface module, the group of shooting-pot actuators in response to monitoring of the sensed signals associated with the shooting-pot assemblies, so that the control of the each shooting-pot assembly of the set of shooting-pot assemblies is independent. 11. The mold-tool system of claim 10, wherein: the melt-distribution assembly is configured to: (i) connect with a first-machine nozzle of a first-melt liquefier being configured to provide a first resin to the melt-distribution assembly; and(ii) connect with a second-machine nozzle of a second-melt liquefier being configured to supply a second resin to the melt-distribution assembly. 12. The mold-tool system of claim 10, wherein: the melt-distribution assembly includes: a relatively lower-pressure circuit, anda relatively higher-pressure circuit,the relatively lower-pressure circuit is configured to connect a machine nozzle of a melt-liquefier assembly with the set of shooting-pot assemblies,the relatively higher-pressure circuit is configured to connect the set of shooting-pot assemblies with a mold assembly. 13. The mold-tool system of claim 12, wherein: the relatively lower-pressure circuit includes: a grouping of melt-splitter assemblies, anda collection of conduits,the grouping of melt-splitter assemblies and the collection of conduits are configured to connect the machine nozzle of the melt-liquefier assembly with the set of shooting-pot assemblies in accordance with a hierarchy of interconnected levels. 14. The mold-tool system of claim 10, wherein: at least one shooting-pot assembly of the set of shooting-pot assemblies has a different volume of melt in comparison to a volume of melt in at least one other shooting-pot assembly of the set of shooting-pot assemblies. 15. The mold-tool system of claim 1, further comprising: a mold assembly being connectable with the set of shooting-pot assemblies.
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