초록

Embodiments of the present disclosure include devices or systems that include a composite thermal capacitor disposed in thermal communication with a hot spot of the device, methods of dissipating thermal energy in a device or system, and the like.

대표청구항 ▼

1. A device, comprising: an electronic device having at least one hot spot, anda composite thermal capacitor disposed in thermal communication with the hot spot of the electronic device, wherein the composite thermal capacitor includes a phase change material, wherein the heat from the hot spot is s

1. A device, comprising: an electronic device having at least one hot spot, anda composite thermal capacitor disposed in thermal communication with the hot spot of the electronic device, wherein the composite thermal capacitor includes a phase change material, wherein the heat from the hot spot is stored by the phase change material. 2. The device of claim 1, wherein the phase change material is selected from the group consisting of: solid-to-solid, a solid-to-liquid, a solid-to-gas, and a liquid-to-gas, phase change material. 3. The device of claim 1, wherein the composite thermal capacitor includes the phase change material imbedded into a matrix of a high thermal conductivity material. 4. The device of claim 3, wherein the high thermal conductivity material is selected from the group consisting of: copper, silver, gold, aluminum, graphitzed carbon, silicon, carbon nanotubes, diamond, graphene, and a combination thereof. 5. The device of claim 3, wherein the ratio of the phase change material to the high thermal conductivity material is about 1:100 to 1:1. 6. The device of claim 1, wherein the electronic device is selected from the group consisting of: a two-dimensional semiconductor chip stack, a three-dimensional semiconductor chip stack, a multi-core semiconductor chip, a memory device, Application Specific Integrated Circuits (ASICs), System-on-a-Chip (SoC), a microelectronic chip, a optoelectronic chip, a hybrid optoelectronic/microelectronic chip, a memory device, analog or radio frequency (RF) micro devices, System on a Package (SOP), biochips, medical or electronic imaging devices, and on chip power management devices. 7. The device of claim 1, wherein the composite thermal capacitor is in thermal communication with the hot spot of the electronic device using a structure selected from the group consisting of one or more through-silica vias, a high conductivity slab, a heat pipe, a fluidic loop, a solid state heat pump, an intermediate electronic device, and a combination thereof. 8. The device of claim 1, further comprising an active regeneration cooling device in thermal communication with the composite thermal capacitor, wherein the heat from the composite thermal capacitor is dissipated by the active regeneration cooling device. 9. The device of claim 8, wherein the active regeneration cooling device is selected from the group consisting of: solid state cooling device, a fluidic cooling device, a heat pipe, and a combination thereof. 10. The device of claim 8, further comprising an external heat sink in thermal communication with the active regeneration device. 11. The device of claim 3, wherein the composite thermal capacitor has a first area and a second area, wherein the first area includes the phase change material and the second area includes the high thermal conductivity material, wherein the first area can include one or more portions, wherein each portion has the second area as a boundary, and the first area and second area are in thermal communication between each other. 12. The device of claim 11, wherein each portion of the first area has a cross-section selected from the group consisting of: a polygonal cross-section, a circular cross-section, substantially circular cross-section, annular cross section, and a combination thereof. 13. The device of claim 12, wherein each portion has an outer boundary defined by the second area.