IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0692215
(2012-12-03)
|
등록번호 |
US-8713957
(2014-05-06)
|
발명자
/ 주소 |
- Campbell, Levi A.
- Chu, Richard C.
- David, Milnes P.
- Ellsworth, Jr., Michael J.
- Iyengar, Madhusudan K.
- Simons, Robert E.
|
출원인 / 주소 |
- International Business Machines Corporation
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
1 인용 특허 :
13 |
초록
▼
Cooling methods are provided for immersion-cooling one or more electronic components. The cooling method includes: providing a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compart
Cooling methods are provided for immersion-cooling one or more electronic components. The cooling method includes: providing a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid; and providing a vapor-condenser, heat sink, and thermal conductive path. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the heat sink includes a first region and a second region, with the first region of the heat sink being in thermal contact with the vapor-condenser. The thermal conduction path couples the fluid-tight compartment and the second region of the heat sink in thermal contact, and includes a thermoelectric array, which facilitates transfer of heat from the fluid-tight compartment to the second region of the heat sink through the thermal conduction path.
대표청구항
▼
1. A cooling apparatus comprising: a housing at least partially surrounding and forming a fluid-tight compartment about at least one electronic component to be cooled;a dielectric fluid disposed within the fluid-tight compartment, wherein the at least one electronic component to be cooled is immerse
1. A cooling apparatus comprising: a housing at least partially surrounding and forming a fluid-tight compartment about at least one electronic component to be cooled;a dielectric fluid disposed within the fluid-tight compartment, wherein the at least one electronic component to be cooled is immersed within the dielectric fluid;a vapor-condenser comprising a plurality of thermally conductive condenser fins extending within the fluid-tight compartment;a heat sink comprising a first region and a second region, the first region of the heat sink being in thermal contact with the vapor-condenser; anda thermal conduction path coupling the fluid-tight compartment and the second region of the heat sink in thermal contact, the thermal conduction path comprising a thermoelectric array including at least one thermoelectric module, the thermoelectric array facilitating controlled transfer of heat from the fluid-tight compartment to the second region of the heat sink through the thermal conduction path. 2. The cooling apparatus of claim 1, wherein the first region of the heat sink is coupled to the vapor-condenser, and aligns over the at least one electronic component to be cooled. 3. The cooling apparatus of claim 1, wherein the thermal conduction path comprises a portion of the vapor-condenser, and the thermoelectric array is coupled to and disposed between the portion of the vapor-condenser and the second region of the heat sink. 4. The cooling apparatus of claim 1, wherein the first region of the heat sink aligns over the at least one electronic component to be cooled, and wherein the cooling apparatus further comprises at least one heat spreader coupled to the at least one electronic component to be cooled, the at least one heat spreader comprising multiple fluid-boiling fins extending therefrom within the fluid-tight compartment. 5. The cooling apparatus of claim 4, wherein the thermoelectric array comprises a first thermoelectric array, and wherein the cooling apparatus further comprises a second thermoelectric array, the second thermoelectric array being coupled to and disposed between the at least one electronic component to be cooled and the at least one heat spreader comprising the multiple fluid-boiling fins extending therefrom within the fluid-tight compartment. 6. The cooling apparatus of claim 1, wherein the heat sink comprises at least two regions at least partially spaced apart, the at least two regions comprising the first region and the second region, and wherein the first region aligns over the at least one electronic component to be cooled, and the second region is offset from the at least one electronic component to be cooled. 7. The cooling apparatus of claim 1, wherein the first region comprises a first side of the heat sink and the second region comprises a second side of the heat sink, the first side and the second side being opposing sides of the heat sink, and wherein the heat sink is a liquid-cooled heat sink. 8. The cooling apparatus of claim 7, wherein the thermal conduction path further comprises a thermal spreader and at least one heat pipe, the at least one heat pipe comprising a first heat pipe section residing within the thermal spreader, and the thermoelectric array being coupled to and disposed between the thermal spreader and the second region of the heat sink. 9. The cooling apparatus of claim 8, wherein the at least one heat pipe extends into the fluid-tight compartment and facilitates conduction of heat from the fluid-tight compartment into the heat spreader. 10. The cooling apparatus of claim 8, wherein the at least one heat pipe further comprises a second heat pipe section residing within at least one of the heat sink or the vapor-condenser and extending in a direction substantially parallel to the first heat pipe section disposed within the thermal spreader. 11. The cooling apparatus of claim 1, further comprising a controller coupled to control operation of the thermoelectric array, the controller operating the thermoelectric array in one of a first cooling mode or a second cooling mode, wherein in the first cooling mode, the thermoelectric array is deactivated and the vapor-condenser is cooled via the first region of the heat sink being in thermal contact therewith, and in the second cooling mode, the thermoelectric array is energized and actively transferring heat thereacross, and the vapor-condenser is cooled via the first region of the heat sink being in thermal contact therewith and via transfer of heat through the thermal conduction path from the fluid-tight compartment to the second region of the heat sink. 12. A liquid-cooled electronic system comprising: an electronics rack comprising at least one electronic component to be cooled; anda cooling apparatus configured to immersion-cool the at least one electronic component, the cooling apparatus comprising: a housing at least partially surrounding and forming a fluid-tight compartment about the at least one electronic component to be cooled;a dielectric fluid disposed within the fluid-tight compartment, wherein the at least one electronic component to be cooled is immersed within the dielectric fluid;a vapor-condenser comprising a plurality of thermally conductive condenser fins extending within the fluid-tight compartment;a heat sink comprising a first region and a second region, the first region of the heat sink being in thermal contact with the vapor-condenser; anda thermal conduction path coupling the fluid-tight compartment and the second region of the heat sink in thermal contact, the thermal conduction path comprising a thermoelectric array including at least one thermoelectric module, the thermoelectric array facilitating controlled transfer of heat from the fluid-tight compartment to the second region of the heat sink through the thermal conduction path. 13. The liquid-cooled electronic system of claim 12, wherein the first region of the heat sink is coupled to the vapor-condenser, and aligns over the at least one electronic component to be cooled. 14. The liquid-cooled electronic system of claim 12, wherein the first region of the heat sink aligns over the at least one electronic component to be cooled, and wherein the cooling apparatus further comprises at least one heat spreader coupled to the at least one electronic component to be cooled, the at least one heat spreader comprising multiple fluid-boiling fins extending therefrom within the fluid-tight compartment. 15. The liquid-cooled electronic system of claim 12, wherein the first region comprises a first side of the heat sink and the second region comprises a second side of the heat sink, the first side and the second side being opposing sides of the heat sink, and wherein the heat sink is a liquid-cooled heat sink. 16. The liquid-cooled electronic system of claim 15, wherein the thermal conduction path further comprises a thermal spreader and at least one heat pipe, the at least one heat pipe comprising a first heat pipe section residing within the thermal spreader, and the thermoelectric array being coupled to and disposed between the thermal spreader and the second region of the heat sink. 17. The liquid-cooled electronic system of claim 16, wherein the at least one heat pipe extends into the fluid-tight compartment and facilitates conduction of heat from the fluid-tight compartment into the heat spreader. 18. The liquid-cooled electronic system of claim 16, wherein the at least one heat pipe further comprises a second heat pipe section residing within at least one of the heat sink or the vapor-condenser and extending in a direction substantially parallel to the first heat pipe section disposed within the thermal spreader. 19. The liquid-cooled electronic system of claim 12, further comprising a controller coupled to control operation of the thermoelectric array, the controller operating the thermoelectric array in one of a first cooling mode or a second cooling mode, wherein in the first cooling mode, the thermoelectric array is deactivated and the vapor-condenser is cooled via the first region of the heat sink being in thermal contact therewith, and in the second cooling mode, the thermoelectric array is energized and actively transferring heat thereacross, and the vapor-condenser is cooled via the first region of the heat sink being in thermal contact therewith and via transfer of heat through the thermal conduction path from the fluid-tight compartment to the second region of the heat sink. 20. A method of facilitating cooling of at least one electronic component, the method comprising: providing a housing at least partially surrounding and forming a fluid-tight compartment about the at least one electronic component to be cooled;immersing the at least one electronic component within a dielectric fluid within the fluid-tight compartment;providing a vapor-condenser comprising a plurality of thermally conductive condenser fins extending into the fluid-tight compartment;providing a heat sink comprising a first region and a second region, the first region of the heat sink being in thermal contact with the vapor-condenser; andproviding a thermal conduction path coupling the fluid-tight compartment and the second region of the heat sink in thermal contact, the thermal conduction path comprising a thermoelectric array including at least one thermoelectric module, the thermoelectric array facilitating transfer of heat from the fluid-tight compartment to the second region of the heat sink through the thermal conduction path.
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