Aqueous and dry duel-action flame and smoke retardant and microbe inhibiting compositions, and related methods
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C09K-021/00
C09K-021/02
C09K-021/06
A62D-001/00
A62D-001/02
A62D-001/06
출원번호
US-0590714
(2009-11-11)
등록번호
US-8715540
(2014-05-06)
발명자
/ 주소
Curzon, Jon Lee
Smoot, Thomas William
출원인 / 주소
MG3 Technologies Inc.
대리인 / 주소
Hastreiter, Esq., Roberta L.
인용정보
피인용 횟수 :
1인용 특허 :
36
초록▼
The present invention provides combined property, dual-action aqueous and dry compositions for application to a material, such as conventional Gypsum Wall Board, ceiling tiles, joint compounds, concrete and other interior building materials, prior to an exposure of the material to fire, or prior to,
The present invention provides combined property, dual-action aqueous and dry compositions for application to a material, such as conventional Gypsum Wall Board, ceiling tiles, joint compounds, concrete and other interior building materials, prior to an exposure of the material to fire, or prior to, during or after exposure of the material to conditions favorable to the growth of microbes, and related methods. When compositions within the present invention are properly applied to a material prior to the material being exposed to fire, or prior to, during or after the material being exposed to conditions favorable to the growth of microbes, these compositions have the effect of reducing the amount of burning that occurs to the material, and/or reducing the amount or density of smoke and associated toxic gases produced by the material, when the material is exposed to fire. These compositions also have the effect of inhibiting or reducing the growth, build-up or deposit of microbes on the material when the material is exposed to conditions favorable to the growth of microbes.
대표청구항▼
1. A dry composition for application to a material to reduce an amount of burning that may occur to the material, or an amount or density of smoke that may be produced by the material, or both, and to reduce, inhibit or prevent a growth of microbes on the material, comprising: (a) at least one alkal
1. A dry composition for application to a material to reduce an amount of burning that may occur to the material, or an amount or density of smoke that may be produced by the material, or both, and to reduce, inhibit or prevent a growth of microbes on the material, comprising: (a) at least one alkaline metal inorganic salt, wherein the alkaline metal inorganic salts are present in the composition in a combined amount ranging from about 2% to about 70% by weight;(b) at least one potassium salt of an organic acid, wherein the potassium salts of an organic acid are present in the composition in a combined amount ranging from about 20% to about 45% by weight;(c) at least one boron-containing compound, wherein the boron-containing compounds are present in the composition in a combined amount ranging from about 0.5% to about 15% by weight;(d) optionally, a microbe-inhibiting compound, wherein the microbe-inhibiting compound is present in the composition in a combined amount ranging from about 0% to about 6% by weight; and(e) optionally, a detection component, wherein the detection component is present in the composition in a combined amount ranging from about 0% to about 10% by weight; wherein the dry composition, when applied to the material in an effective amount, or at an effective application rate: (i) reduces the amount of burning that occurs to the material, or the amount or density of smoke produced by the material, when the material is subsequently exposed to fire; and(ii) when the composition is applied to a material prior to, during or after the material being exposed to conditions favorable to the growth of microbes, reduces, inhibits or prevents the growth of microbes on the material when the material is exposed to conditions favorable to the growth of microbes. 2. The dry composition of claim 1, wherein the alkaline metal inorganic salts are present in the compositions in an amount ranging from about 20% to about 65% by weight. 3. The dry composition of claim 1, wherein the potassium salts of an organic acid are potassium acetate, potassium formate, potassium tartrate, potassium citrate, potassium sorbate or potassium lactate. 4. The dry composition of claim 3, wherein the potassium salt of an organic acid is potassium acetate. 5. The dry composition of claim 2, wherein the boron-containing compounds are present in the compositions in an amount ranging from about 3% to about 10% by weight. 6. The dry composition of claim 5, wherein the dry composition is in a form of a particulate, a powder, granules, ground solid particles, pulverized solid particles, finely dispersed solid particles in a loose or compressed form. 7. The dry composition of claim 1, wherein the dry composition comprises potassium carbonate in an amount of about 62% by weight, potassium acetate in an amount of about 33% by weight, boric acid in an amount of about 5.0% by weight, and provides, or results in, a surface pH level of a material to which it is applied ranging from about 10 to about 14 when such surface is exposed to moisture or water.
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