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특허 상세정보

MyON담기
내보내기 페이스북 공유 카카오톡 공유

Modular sensor assembly including removable sensing module

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) G06F-015/00   
미국특허분류(USC) 702/189; 700/066; 073/431
출원번호 US-0103891 (2011-05-09)
등록번호 US-8718981 (2014-05-06)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Seager Tufte & Wickhem LLC.
인용정보 피인용 횟수 : 1  인용 특허 : 108
초록
▼

A modular sensor assembly in which a sensing module may be packaged and provided separately from a signal processing module and which, in some applications, may facilitate disposal and/or replacement of the sensing module when exposed to a “dirty” or “contaminated” environment without requiring disposal and/or replacement of the entire sensor assembly. In certain applications, the sensing module may include at least one transducer or sensor and a local memory containing a set of conditioning coefficients. The sensing module may be removably coupled to a ...

대표
청구항
▼

1. A modular sensor assembly, comprising: a signal processing module configured to be connected to an end-user device and configured to produce a conditioned output signal from a raw or partially conditioned output signal, the signal processing module comprising a signal conditioning block;a sensing module housed separately from and removably mechanically coupled to the signal processing module, the sensing module comprising at least one transducer or sensor for sensing a physical parameter and a local memory configured to retain a set of conditioning co...

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