[특허]Semiconductor light source

Semiconductor light source 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-033/00 F21V-029/00
출원번호	US-0785203 (2010-05-21)
등록번호	US-8723212 (2014-05-13)
발명자 / 주소	Cao, Densen
출원인 / 주소	CAO GROUP, Inc.
대리인 / 주소	Jones, Terry S.
인용정보	피인용 횟수 : 0 인용 특허 : 63

초록

A semiconductor light source for illuminating physical spaces includes a lead frame with multiple facets, each facet having one or more semiconductor light emitting devices mounted thereon.

대표청구항 ▼

1. A semiconductor light source, comprising: an electrically and thermally conductive outer lead frame, the outer lead frame comprising: a first end having a plurality of facets;a second end spaced from the first end and configured for mating with an electrical socket; anda hollow passageway extending through the outer lead frame, the hollow passageway having a first opening in the first end and a second opening in the second end;an electrically conductive inner lead frame, the inner lead frame comprising: a shaft having a first end and a second end spaced from the first end, the shaft extending through the hollow passageway of the outer lead frame, anda cap attached to the first end of the shaft;an insulation layer electrically isolating the inner lead frame from the outer lead frame; anda semiconducting LED chip positioned on at least one facet of the plurality of facets, the semiconducting LED chip in electrical communication with the cap and in electrical communication with the outer lead frame. 2. The device as recited in claim 1 further comprising a semiconductor LED chip positioned on each one of said plurality of facets, each such semiconductor LED chip being in electrical communication with the cap and in electrical communication with the outer lead frame. 3. The device as recited in claim 1, wherein said outer lead frame further comprises an intermediate portion positioned intermediate said first and second ends. 4. The device as recited in claim 3, further comprising a base member secured to the intermediate portion. 5. The device as recited in claim 4, wherein said outer lead frame includes a central axis extending between the first and second ends and wherein the base member is axisymmetric with respect to said central axis, extending radially outward from said intermediate portion. 6. The device as recited in claim 1, wherein said insulation layer comprises an epoxy material. 7. The device as recited in claim 1, wherein said semiconducting LED chip is covered with a light conversion layer. 8. The device as recited in claim 2, wherein one or more of said semiconducting LED chips is covered with a light conversion layer. 9. The device as recited in claim 8, wherein said conversion layer comprises a phosphorous material. 10. The device recited in claim 1, wherein the shaft includes a central axis extending between the first and second ends and wherein the cap is axisymmetric with respect to said central axis. 11. The device as recited in claim 1, further comprising a housing covering the first end of the outer lead frame. 12. A semiconductor light source, comprising: an electrically and thermally conductive outer lead frame, the outer lead frame comprising: a first end having a plurality of facets;a second end spaced from the first end and configured for mating with an electrical socket; anda hollow passageway extending through the outer lead frame, the hollow passageway having a first opening in the first end and a second opening in the second end;an electrically conductive inner lead frame, the inner lead frame comprising: a shaft having a first end and a second end spaced from the first end, the shaft extending through the hollow passageway of the outer lead frame; anda cap attached to the first end of the shaft;an insulation layer electrically isolating the inner lead frame from the outer lead frame; anda plurality of semiconducting LED chips, at least one semiconducting LED chip of the plurality of semiconducting LED chips positioned on each facet of the plurality of facets and each semiconducting LED chip of the plurality of semiconducting LED chips in electrical communication with the cap and in electrical communication with the outer lead frame. 13. The device as recited in claim 12, wherein said outer lead frame further comprises an intermediate portion positioned intermediate said first and second ends. 14. The device as recited in claim 13, further comprising a base member secured to the intermediate portion. 15. The device as recited in claim 14, wherein said outer lead frame includes a central axis extending between the first and second ends and wherein the base member is axisymmetric with respect to said central axis, extending radially outward from said intermediate portion. 16. The device as recited in claim 12, wherein said insulation layer comprises an epoxy material. 17. The device as recited in claim 12, wherein each semiconducting LED chip of the plurality of semiconducting LED chips is covered with a light conversion layer. 18. The device as recited in claim 17, wherein said conversion layer comprises a phosphorous material. 19. The device as recited in claim 12, further comprising a housing covering the first end of the outer lead frame. 20. A semiconductor light source, comprising: an electrically and thermally conductive outer lead frame, the outer lead frame comprising: a first end having at least one facet;a second end spaced from the first end and configured for mating with an electrical socket; anda hollow passageway extending through the outer lead frame, said hollow passageway having a first opening in the first end and a second opening in the second end, said hollow passageway being coaxial with a central axis of the first and second ends;an electrically conductive inner lead frame, the inner lead frame comprising: a shaft having a first end and a second end spaced from the first end, the shaft extending through the hollow passageway of the outer lead frame and being coaxial with the central axis; anda cap attached to the first end of the shaft;an insulation layer electrically isolating the inner lead frame from the outer lead frame;at least one semiconducting LED chip positioned on the at least one facet the semiconducting LED chip in electrical communication with the cap and in electrical communication with the outer lead frame; anda housing covering the first end of the outer lead frame, the at least one semiconducting LED chip, and the cap.

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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
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