Interface device for a high temperature superconductor degaussing system junction box
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-039/24
B63G-009/06
H01F-006/06
H01F-013/00
출원번호
US-0057836
(2008-03-28)
등록번호
US-8731629
(2014-05-20)
발명자
/ 주소
King, Christopher G.
Maguire, James F.
출원인 / 주소
American Superconductor Corporation
대리인 / 주소
Occhiuti & Rohlicek LLP
인용정보
피인용 횟수 :
1인용 특허 :
1
초록▼
A junction box is provided which allows serial connection of the individual conductors of at least one high temperature superconductor (HTS) wire bundle. The junction box includes an electrical interface device disposed within a junction box housing. The interface device is configured receive both e
A junction box is provided which allows serial connection of the individual conductors of at least one high temperature superconductor (HTS) wire bundle. The junction box includes an electrical interface device disposed within a junction box housing. The interface device is configured receive both ends of each conductor of each HTS wire bundle, and to provide a superconductive electrical connection between respective first ends of conductors to respective second ends of other wire bundle conductors to form at least one superconductive multi-turn electromagnetic winding.
대표청구항▼
1. An apparatus for forming a multi-turn winding by joining individual high-temperature-superconductor bundle conductors in series, said apparatus comprising a junction box, said junction box comprising a high-temperature-superconductor wire bundle having a first bundle conductor and a second bundle
1. An apparatus for forming a multi-turn winding by joining individual high-temperature-superconductor bundle conductors in series, said apparatus comprising a junction box, said junction box comprising a high-temperature-superconductor wire bundle having a first bundle conductor and a second bundle conductor, said first bundle conductor having a first end and a second end, said first and second ends separated from each other by a first path length that corresponds to a length of said first bundle conductor, said second bundle conductor having a first end and a second end, said first and second ends being separated from each other by a second path length that corresponds to a length of said second bundle conductor, a housing having a first side and a second side, said first side receiving said first end of said first bundle conductor and said first end of said second bundle conductor, and said second side receiving said second end of said first bundle conductor and said second end of said second bundle conductor, and an electrical interface device disposed in said housing, said electrical interface device having a first electrical-interface-device end, a second electrical-interface-device end, a substrate, a first superconducting interface conductor extending across said substrate between said first electrical-interface-device end and said second electrical-interface-device end, and a second superconducting interface conductor extending across said substrate between said first electrical-interface-device end and said second electrical-interface-device end, a third superconducting interface conductor extending across said substrate between said first electrical-interface-device end and said second electrical-interface-device end, wherein said first superconducting interface conductor is separate and distinct from said first bundle conductor, wherein said first superconducting interface conductor is separate and distinct from said second bundle conductor, wherein said second superconducting interface conductor is separate and distinct from said first bundle conductor and wherein said second superconducting interface conductor is separate and distinct from said second bundle conductor, wherein said third superconducting interface device is separate and distinct from said second bundle conductor, wherein said first end of said first bundle conductor is connected to said first superconducting interface conductor, wherein said second end of said first bundle conductor is connected to said second superconducting interface conductor, thereby defining a first turn of said multi-turn winding, and wherein said first end of said second bundle conductor is connected to said second superconducting interface conductor and said second end of said second bundle conductor is connected to said third superconducting interface conductor, thereby defining a second turn of said multi-turn winding, and thereby causing a series connection between said first turn and said second turn of said multi-turn winding, said series connection resulting in said multi-turn winding having a path length that is at least a sum of said first path length and said second path length. 2. The apparatus of claim 1, wherein said housing defines a cryostat. 3. The apparatus of claim 2, wherein said cryostat is configured to provide sufficient cooling to permit said superconducting interface conductors to maintain superconductivity. 4. The apparatus of claim 1, wherein said substrate comprises a sheet having a first side, and a second side opposed to said first side, and a layer of thermally conductive material provided on said second side of said sheet, and wherein said first and second superconducting interface conductors extend within said substrate such that a connection land corresponding to each end of each superconducting interface conductor is exposed on said first side of said sheet. 5. The apparatus of claim 4, wherein a current carrying capacity of said first superconducting interface conductor exceeds a current carrying capacity of said first bundle conductor. 6. The apparatus of claim 5, wherein said current carrying capacity of said first superconducting interface conductor is at least double said current carrying capacity of said first bundle conductor. 7. The apparatus of claim 1, wherein said electrical interface device comprises a plurality of planar substrates, each planar substrate extending along a plane associated with said planar substrate, said planes defining a prism. 8. The apparatus of claim 7, wherein said prism has a triangular base. 9. The apparatus of claim 1, wherein said high-temperature-superconductor wire bundle comprises high-temperature-superconductor bundle conductors numbered n1, n2, n3, . . . ni, ni+1, . . . nN, and wherein said electrical interface device comprises (N+1) superconducting interface conductors embedded in said substrate, wherein at least (N−1) of said (N+1) interface conductors extend between said first electrical-interface-device end and said second electrical-interface-device end, wherein an nith superconducting interface conductor is joined to a first end of an nith bundle conductor at said first electrical-interface-device end, and wherein said nith superconducting interface conductor is joined to an (ni+1)th wire bundle conductor at said second electrical-interface-device end. 10. The apparatus of claim 9, wherein one of said N+1 superconducting interface conductors is connected to an external current source. 11. The apparatus of claim 9, wherein one of said N+1 superconducting interface conductors is configured to accept power input, and another of said N+1 superconducting interface conductors is configured to provide power output. 12. The apparatus of claim 1, wherein said electrical interface device comprises a first planar substrate disposed within said junction box, and a second planar substrate disposed within said junction box, said second planar substrate being parallel to said first planar substrate, said first planer substrate being spaced apart from said second planar substrate. 13. The apparatus of claim 1 wherein said junction box comprises N high-temperature-superconductor wire bundles, and said electrical interface device comprises a substrate for each of said N high-temperature-superconductor wire bundles. 14. The apparatus of claim 1, wherein said interface device comprises a plurality of substrates, each substrate includes a plurality of superconducting interface conductors. 15. The apparatus of claim 1, wherein said multi-turn winding is an N-turn winding, each turn of which is formed by a single bundle conductor, and wherein said N turns are formed by N serially joined bundle conductors. 16. The apparatus of claim 1, wherein each superconducting interface conductor is embedded in said substrate.
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