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Semiconductor device structures and printed circuit boards comprising semiconductor devices

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-029/40
출원번호 US-0848914 (2013-03-22)
등록번호 US-8736028 (2014-05-27)
발명자 / 주소
  • Tuttle, Mark E.
출원인 / 주소
  • Micron Technology, Inc.
대리인 / 주소
    TraskBritt
인용정보 피인용 횟수 : 1  인용 특허 : 63

초록

The present invention relates to methods for forming through-wafer interconnects in semiconductor substrates and the resulting structures. In one embodiment, a method for forming a through-wafer interconnect includes providing a substrate having a pad on a surface thereof, depositing a passivation l

대표청구항

1. A semiconductor device, comprising: a conductive pad on a surface of a substrate;a passivation material over the conductive pad;through-wafer interconnect (TWI) structures including at least one TWI structure extending through the conductive pad and into the substrate; andan insulative material e

이 특허에 인용된 특허 (63)

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  48. Hanaoka, Terunao; Wada, Kenji; Hashimoto, Nobuaki; Ito, Haruki; Umetsu, Kazushige; Matsushima, Fumiaki, Semiconductor device and manufacturing method therefor, circuit board, and electronic equipment.
  49. Hanaoka, Terunao; Wada, Kenji; Hashimoto, Nobuaki; Ito, Haruki; Umetsu, Kazushige; Matsushima, Fumiaki, Semiconductor device and manufacturing thereof, including a through-hole with a wider intermediate cavity.
  50. Miyazawa,Ikuya, Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument.
  51. Farnworth, Warren M.; Wood, Alan G., Semiconductor device including through-wafer interconnect structure.
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  53. Yamaguchi,Koji, Semiconductor device, stacked semiconductor device, methods of manufacturing them, circuit board, and electronic instrument.
  54. Noddin David B., Semiconductor flip chip package.
  55. Halahan,Patrick B.; Siniaguine,Oleg, Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same.
  56. Akram Salman, Semiconductor substrate-based BGA interconnection and methods of farication same.
  57. Tanielian Minas H. (Bellevue WA), Silicon wafers containing conductive feedthroughs.
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  59. Jolly Gurvinder (Orleans CAX) Yung Bud K. (Ottawa CAX), Tapering sidewalls of via holes.
  60. Hsu Chen-Chung (Taichung TWX), Three-dimensional multichip package and methods of fabricating.
  61. Claude Louis Bertin ; Wayne John Howell ; William R. Tonti ; Jerzy Maria Zalesinski, Through-chip conductors for low inductance chip-to-chip integration and off-chip connections.
  62. Akram,Salman; Kirby,Kyle K., Through-substrate interconnect fabrication methods.
  63. Nagarajan, Ranganathan; Premachandran, Chirayarikathuveedu Sankarapillai; Chen, Yu; Kripesh, Vaidyanathan, Wafer-level package for micro-electro-mechanical systems.

이 특허를 인용한 특허 (1)

  1. Zhao, Xing; Na, Duk Ju; Chia, Lai Yee, Semiconductor device and method of forming conductive vias by direct via reveal with organic passivation.
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