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Aluminum bonding member and method for producing same

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23P-025/00
출원번호 US-0404233 (2012-02-24)
등록번호 US-8745841 (2014-06-10)
우선권정보 JP-2004-103164 (2004-03-31); JP-2004-218526 (2004-07-27)
발명자 / 주소
  • Osanai, Hideyo
출원인 / 주소
  • Dowa Metaltech Co., Ltd.
대리인 / 주소
    Bachman & LaPointe, P.C.
인용정보 피인용 횟수 : 1  인용 특허 : 45

초록

There is provided an aluminum bonding member capable of being simply and inexpensively produced and capable of being used as a cooling member having a high cooling power. The aluminum bonding member 10 has an aluminum member 12 of aluminum or an aluminum alloy exposed to the outside, and a tubular m

대표청구항

1. A method for producing an aluminum bonding member, said method comprising the steps of: preparing a tubular member of a material which does not melt at a temperature close to a melting point of aluminum or an aluminum alloy;putting said tubular member in a die so that opening end portions of the

이 특허에 인용된 특허 (45)

  1. Osanai,Hideyo; Ideguchi,Satoru, Aluminum/ceramic bonding substrate and method for producing same.
  2. Osanai,Hideyo; Ideguchi,Satoru, Aluminum/ceramic bonding substrate and method for producing same.
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  4. Osanai, Hideyo; Ibaragi, Susumu; Namioka, Makoto, Apparatus, mold, and method for manufacturing metal-ceramic composite member.
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  13. Hirashima Yutaka,JPX ; Taniguchi Yoshitaka,JPX ; Hushii Yasuhito,JPX ; Tujimura Yoshihiko,JPX ; Terano Katsunori,JPX ; Gotoh Takeshi,JPX ; Takakura Syoji,JPX ; Yoshino Nobuyuki,JPX ; Sugimoto Isao,JP, Circuit substrate.
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  22. Kuroki Takanori (2-12-1 Hinosato ; Munakata-shi ; Fukuoka-ken JPX), Heat exchanger structure and method of manufacturing same.
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  31. Osanai,Hideyo; Ibaraki,Susumu; Iyoda,Ken; Namioka,Makoto, Metal/ceramic bonding substrate and method for producing same.
  32. Osanai,Hideyo; Takahashi,Takayuki; Namioka,Makoto, Metal/ceramic bonding substrate and method for producing same.
  33. Osanai,Hideyo; Takahashi,Takayuki; Namioka,Makoto, Metal/ceramic bonding substrate and method for producing same.
  34. Singer Alfred Richard Eric,GBX ; Jordan Richard Michael,GBX ; Roche Allen Dennis,GBX, Metallic articles having heat transfer channels and method of making.
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  37. Osanai,Hideyo; Namioka,Makoto; Ibaraki,Susumu, Method for producing metal/ceramic bonding circuit board.
  38. Osanai, Hideyo; Furo, Masahiro, Method of manufacturing a metal-ceramic circuit board.
  39. Natsuhara Masuhiro (Hyogo JPX) Ukegawa Harutoshi (Hyogo JPX), Mounting structure for semiconductor device having low thermal resistance.
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  41. Vijay Mangtani, Power module with closely spaced printed circuit board and substrate.
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  44. Hideki Hirotsuru JP; Kenji Nomura JP; Ryuichi Terasaki JP; Mitsuaki Saito JP; Kazuyuki Hiruta JP; Akira Miyai JP, Silicon carbide composite, method for producing it and heat dissipation device employing it.
  45. Komorita Hiroshi,JPX ; Ikeda Kazuo,JPX ; Komatsu Michiyasu,JPX ; Sato Yoshitoshi,JPX ; Naba Takayuki,JPX, Silicon nitride circuit board and semiconductor module.

이 특허를 인용한 특허 (1)

  1. Yokoyama, Takeshi; Saito, Takashi, Method of manufacturing semiconductor device.
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