A coil-type electronic component has a coil inside or on the surface of its base material wherein the base material in the coil-type electronic component is constituted by a group of grains of a soft magnetic alloy containing iron, silicon and other element that oxidizes more easily than iron; the s
A coil-type electronic component has a coil inside or on the surface of its base material wherein the base material in the coil-type electronic component is constituted by a group of grains of a soft magnetic alloy containing iron, silicon and other element that oxidizes more easily than iron; the surface of each soft magnetic alloy grain has an oxide layer formed on its surface as a result of oxidization of the grain; this oxide layer contains the other element that oxidizes more easily than iron by a quantity larger than that in the soft magnetic alloy grain; and grains are bonded with one another via this oxide layer. The coil-type electronic component can be produced at low cost and combines high magnetic permeability with high saturation magnetic flux density.
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1. A coil-type electronic component having a base material and a coil inside or on the surface of the base material, wherein the base material is constituted by a group of grains of a soft magnetic alloy containing iron, silicon and other element that oxidizes more easily than iron; the surface of e
1. A coil-type electronic component having a base material and a coil inside or on the surface of the base material, wherein the base material is constituted by a group of grains of a soft magnetic alloy containing iron, silicon and other element that oxidizes more easily than iron; the surface of each soft magnetic alloy grain has an oxide layer formed on the surface of each soft magnetic alloy grain as a result of oxidization of the grain; said oxide layer contains the other element that oxidizes more easily than iron in a quantity larger than that in the soft magnetic alloy grain; and grains are bonded with one another via said oxide layer, wherein the aforementioned oxide layer includes in this order a first oxide layer where the content of the aforementioned iron component decreases while the content of the aforementioned element that oxidizes easily increases, and a second oxide layer where the content of the aforementioned iron component decreases and the content of the aforementioned element that oxidizes easily also decreases, as viewed outwardly from the aforementioned alloy grain. 2. A coil-type electronic component according to claim 1, wherein the oxide layer via which the soft magnetic alloy grains are bonded with one another is thicker than an oxide layer other than the bonding oxide layer on the surface of the soft magnetic alloy grains. 3. A coil-type electronic component according to claim 1, wherein the oxide layer via which the soft magnetic alloy grains are bonded with one another is thinner than an oxide layer other than the bonding oxide layer on the surface of the soft magnetic alloy grains. 4. A coil-type electronic component according to claim 1, wherein the oxide layer formed on at least some of the soft magnetic grains has a thickness of at least 50 nanometers. 5. A coil-type electronic component according to claim 1, wherein the aforementioned oxide layer bonding the aforementioned grains is constituted by the same phase. 6. A coil-type electronic component according to claim 1, wherein the aforementioned element that oxidizes more easily than iron is chromium. 7. A coil-type electronic component according to claim 1, wherein the aforementioned element that oxidizes more easily than iron is aluminum. 8. A coil-type electronic component according to claim 6, wherein the aforementioned soft magnetic alloy has a composition of 2 to 8 percent by weight of chromium, 1.5 to 7 percent by weight of silicon, and 88 to 96.5 percent by weight of iron. 9. A coil-type electronic component according to claim 7, wherein the aforementioned soft magnetic alloy has a composition of 2 to 8 percent by weight of aluminum, 1.5 to 12 percent by weight of silicon, and 80 to 96.5 percent by weight of iron. 10. A coil-type electronic component according to claim 1, wherein the average size of the soft magnetic grain based on arithmetic mean is 30 micrometers or less. 11. A coil-type electronic component according to claim 1, wherein the aforementioned first oxide layer, as viewed outwardly from the aforementioned alloy grain, has an inflection point with respect to the content of the aforementioned silicon. 12. A coil-type electronic component according to claim 1, wherein the peak strength ratio of the element that oxidizes more easily than iron, relative to iron, in the oxide layer is higher than the peak strength ratio of the element that oxidizes more easily than iron, relative to iron, in the aforementioned grain, based on calculation by the ZAF method through energy diffusion X-ray analysis using a scanning electron microscope. 13. A coil-type electronic component according to claim 1, wherein the aforementioned coil has its end electrically connected to a conductive film formed on the surface of the aforementioned base material. 14. A coil-type electronic component having a base material and a coil, wherein the base material is constituted by a group of grains of a soft magnetic alloy; the surface of each soft magnetic alloy grain has an oxide layer formed on the surface of each soft magnetic alloy grain as a result of oxidization of the grain; said oxide layer contains a quantity of a metal that oxidizes more easily than iron, said quantity being larger than that in the alloy grains; the grains are bonded with one another via said oxide layer; and a coil said coil is formed inside the base material, wherein the aforementioned oxide layer includes in this order a first oxide layer where the content of the aforementioned iron component decreases while the content of the aforementioned element that oxidizes easily increases, and a second oxide layer where the content of the aforementioned iron component decreases and the content of the aforementioned element that oxidizes easily also decreases, as viewed outwardly from the aforementioned alloy grain. 15. A coil-type electronic component according to claim 14, wherein the coil conductor forms conductive patterns and is sintered simultaneously with the base material. 16. A coil-type electronic component according to claim 14, wherein the metal that oxidizes more easily than iron in the oxide layer is chromium. 17. A coil-type electronic component according to claim 14, wherein the metal that oxidizes more easily than iron in the oxide layer is aluminum.
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