IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0228363
(2011-09-08)
|
등록번호 |
US-8749914
(2014-06-10)
|
발명자
/ 주소 |
- Otake, Noritaka
- Hayakawa, Takako
- Ichikawa, Kazuhide
- Nakamiya, Teruhiro
|
출원인 / 주소 |
|
인용정보 |
피인용 횟수 :
7 인용 특허 :
3 |
초록
▼
A disk-enclosure base that is configured to inhibit formation of adherent solder-flux residue. The disk-enclosure base includes a casting, a through-hole fabricated in the casting, a solder channel, an E-coat layer, and an E-coat-free zone. The E-coat layer is applied to a first portion of an interi
A disk-enclosure base that is configured to inhibit formation of adherent solder-flux residue. The disk-enclosure base includes a casting, a through-hole fabricated in the casting, a solder channel, an E-coat layer, and an E-coat-free zone. The E-coat layer is applied to a first portion of an interior surface of the casting. The E-coat-free zone is adjacent to and surrounds the solder channel. The E-coat-free zone also includes a second portion of the interior surface of the casting lying between the solder channel and the E-coated first portion of the interior surface of the casting. The E-coat-free zone is configured to inhibit formation of adherent solder-flux residue. A disk-enclosure-base/electrical-feedthrough assembly that is configured to inhibit formation of adherent solder-flux residue, and a hard-disk drive (HDD) including the disk-enclosure-base/electrical-feedthrough assembly are also provided.
대표청구항
▼
1. A disk-enclosure base that is configured to inhibit formation of adherent solder-flux residue, said disk-enclosure base comprising: a casting;a through-hole fabricated in said casting configured to accept an electrical feedthrough;a solder channel adjacent to and surrounding said through-hole;an
1. A disk-enclosure base that is configured to inhibit formation of adherent solder-flux residue, said disk-enclosure base comprising: a casting;a through-hole fabricated in said casting configured to accept an electrical feedthrough;a solder channel adjacent to and surrounding said through-hole;an E-coat layer applied to a first portion of an interior surface of said casting; andan E-coat-free zone adjacent to and surrounding said solder channel, and comprising a second portion of said interior surface of said casting lying between said solder channel and said E-coated first portion of said interior surface of said casting;wherein said E-coat-free zone is configured to inhibit formation of adherent solder-flux residue. 2. The disk-enclosure base of claim 1, wherein said E-coat-free zone has a width configured to inhibit splattered solder-flux, resulting from a soldering operation of said electrical feedthrough to said disk-enclosure base, from reacting with said E-coat layer. 3. The disk-enclosure base of claim 1 said casting further comprising: a tiered flange-structure adjacent to and surrounding said through-hole. 4. The disk-enclosure base of claim 3, wherein said E-coat-free zone comprises a region adjacent to and surrounding said tiered flange-structure on said interior surface of said casting. 5. The disk-enclosure base of claim 4, wherein said E-coat-free zone has a width configured to inhibit splattered solder-flux, resulting from a soldering operation of said electrical feedthrough to said disk-enclosure base, from reacting with said E-coat layer. 6. The disk-enclosure base of claim 1, wherein said casting is composed of a metal selected from the group consisting of aluminum, an aluminum alloy, nickel, and a nickel alloy. 7. A disk-enclosure-base/electrical-feedthrough assembly that is configured to inhibit formation of adherent solder-flux residue, said disk-enclosure-base/electrical-feedthrough assembly comprising: an electrical feedthrough;a solder joint; anda disk-enclosure base comprising: a casting;a through-hole in which said electrical feedthrough is disposed;an E-coat layer applied to a first portion of an interior surface of said casting; andan E-coat-free zone surrounding said solder joint, and comprising a second portion of said interior surface of said casting lying between said solder joint and said E-coated first portion of said interior surface of said casting; andwherein said solder joint joins said electrical feedthrough to said disk-enclosure base, and is configured to seal hermitically said electrical feedthrough to said disk-enclosure base;wherein said E-coat-free zone is configured to inhibit formation of adherent solder-flux residue. 8. The disk-enclosure-base/electrical-feedthrough assembly of claim 7, wherein said solder joint between said electrical feedthrough and said disk-enclosure base comprises a lap joint. 9. The disk-enclosure-base/electrical-feedthrough assembly of claim 7, wherein said solder joint between said electrical feedthrough and said disk-enclosure base comprises a butt joint. 10. The disk-enclosure-base/electrical-feedthrough assembly of claim 7, wherein said casting is composed of a metal selected from the group consisting of aluminum, an aluminum alloy, nickel, and a nickel alloy. 11. The disk-enclosure-base/electrical-feedthrough assembly of claim 10, wherein a wetting characteristic of a solder of said solder joint to said metal is selected to produce a concave outer surface of said solder joint. 12. The disk-enclosure-base/electrical-feedthrough assembly of claim 10, wherein a wetting characteristic of a solder of said solder joint to said metal is selected to prevent formation of a crack in said solder joint. 13. The disk-enclosure-base/electrical-feedthrough assembly of claim 7, wherein said E-coat-free zone is configured to facilitate removal of solder-flux residue with liquid. 14. The disk-enclosure-base/electrical-feedthrough assembly of claim 13, wherein said liquid comprises water. 15. A hard-disk drive (HDD) with a disk-enclosure-base/electrical-feedthrough assembly that is configured to inhibit formation of adherent solder-flux residue, said HDD comprising: a magnetic-recording disk;a disk enclosure comprising a disk-enclosure cover, and a disk-enclosure-base/electrical-feedthrough assembly, said disk-enclosure-base/electrical-feedthrough assembly comprising: an electrical feedthrough;a solder joint; anda disk-enclosure base comprising: a casting;a through-hole in which said electrical feedthrough is disposed;an E-coat layer applied to a first portion of an interior surface of said casting; andan E-coat-free zone surrounding said solder joint, and comprising a second portion of said interior surface of said casting lying between said solder joint and said E-coated first portion of said interior surface of said casting; andwherein said solder joint joins said electrical feedthrough to said disk-enclosure base, and is configured to seal hermitically said electrical feedthrough to said disk-enclosure base;wherein said E-coat-free zone is configured to inhibit formation of adherent solder-flux residue;a spindle motor affixed in said disk-enclosure-base/electrical-feedthrough assembly, for rotating said magnetic-recording disk; anda magnetic-recording head comprising: a write element configured to write data to said magnetic-recording disk;a read element configured to read data from said magnetic-recording disk. 16. The HDD of claim 15, further comprising a low-density gas; wherein said low-density gas fills an interior space of said HDD formed by said disk enclosure. 17. The HDD of claim 16, wherein said low-density gas comprises helium. 18. The HDD of claim 16, wherein said solder joint between said electrical feedthrough and said disk-enclosure base is configured to be impervious to leakage of said low-density gas out from said interior space of said HDD through said solder joint. 19. The HDD of claim 16, wherein said solder joint is substantially free of cracks that could result in leakage of said low-density gas out from said interior space of said HDD through said solder joint. 20. The HDD of claim 15, wherein said disk-enclosure-base/electrical-feedthrough assembly is substantially free of corrosive solder-flux residue.
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