초록 ▼

A wiring board includes: wiring layers; insulating layers disposed between the wiring layers; and external connection pads respectively including surface plated layers, for connecting to an external circuit. In each of the external connection pads in one face of the wiring board, an outer peripheral

A wiring board includes: wiring layers; insulating layers disposed between the wiring layers; and external connection pads respectively including surface plated layers, for connecting to an external circuit. In each of the external connection pads in one face of the wiring board, an outer peripheral edge of the external connection pad is retracted from an outer peripheral edge of the surface plated layer toward a center of the external connection pad.

대표청구항 ▼

1. A wiring board comprising: wiring layers; vias protruding from an outermost one of the wiring layers so that the wiring layers respectively include vias; insulating layers disposed alternately with the wiring layers, an outermost one of the insulating layers covering the outermost one of the wiri

1. A wiring board comprising: wiring layers; vias protruding from an outermost one of the wiring layers so that the wiring layers respectively include vias; insulating layers disposed alternately with the wiring layers, an outermost one of the insulating layers covering the outermost one of the wiring layers so as to embed the vias therewithin, the outermost one of the insulating layers having recesses; connection pads respectively disposed within the recesses so as to be connected with the vias; and surface plated layers respectively disposed on the connection pads within the recesses, wherein an outer peripheral edge of each of the connection pads is retracted from an outer peripheral edge of a corresponding one of the surface plated layers toward a center of the connection pad, wherein an outermost face of each of the surface plated layers is indented from an outermost face of the outermost one of the insulating layers, wherein a peripheral edge portion of the outermost face of each of the surface plated layers is covered by one of said insulating layers of said wiring board, wherein each of the vias is connected to one face of a corresponding one of the connection pads, the one face being opposite to an other face on which a corresponding one of the surface plated layers is formed, wherein via holes are formed in the insulating layers, each of the via holes exposing the one face of the corresponding one of the connection pads, wherein each of the via holes has a circular truncated cone-like shape in which a diameter decreases towards the one face of the corresponding one of the connection pads, and wherein the vias are respectively provided in the via holes. 2. The wiring board according to claim 1, wherein the connections pads are: pads for mounting a semiconductor chip on the wiring board; orpads for mounting the wiring board on another electronic component. 3. The wiring board according to claim 1, wherein the connection pads are pads for mounting the wiring board on another board. 4. The wiring board according to claim 1, wherein each of the surface plated layers includes a plurality of plated layers. 5. The wiring board according to claim 1, wherein each of the connection pads is made of at least one of copper and a copper alloy. 6. The wiring board according to claim 1, wherein a rear face and a side face of each connection pad directly contact the outermost one of the insulating layers, andwherein a rear face and a side face of each surface plated layer directly contact the outermost one of the insulating layers. 7. The wiring board according to claim 1, wherein a rear face and a side face of each connection pad directly contact the outermost one of the insulating layers, andwherein a rear face and a side face of each surface plated layer directly contact the outermost one of the insulating layers. 8. The wiring board according to claim 4, wherein each of the surface plated layers is made of a gold layer and a nickel layer. 9. The wiring board according to claim 6, wherein, in each surface plated layer, the rear face is opposite to the outermost face. 10. The wiring board according to claim 7, wherein, in each surface plated layer, the rear face is opposite to the outermost face. 11. The wiring board comprising: wiring layers; vias protruding from an outermost one of the wiring layers so that the wiring layers respectively include vias; insulating layers disposed alternately with the wiring layers, an outermost one of the insulating layers covering the outermost one of the wiring layers so as to embed the vias therewithin, the outermost one of the insulating layers having recesses; connection pads respectively disposed within the recesses so as to be connected with the vias; and surface plated layers respectively disposed on the connection pads within the recesses, wherein an outer peripheral edge of each of the connection pads is retracted from an outer peripheral edge of a corresponding one of the surface plated layers toward a center of the connection pad, wherein the outer peripheral edge of each of the surface plated layers substantially matches with an inner peripheral wall of a corresponding one of the recesses, wherein an outermost face of each of the surface plated layers is indented from an outermost face of the outermost one of the insulating layers, wherein each of the surface plated layers is made of at least one of: (i) a tin layer and a silver layer; and (ii) a tin layer, wherein each of the vias is connected to one face of a corresponding one of the connection pads, the one face being opposite to an other face on which a corresponding one of the surface plated layers is formed, wherein via holes are formed in the insulating layers, each of the via holes exposing the one face of the corresponding one of the connection pads, wherein each of the via holes has a circular truncated cone-like shape in which a diameter decreases towards the one face of the corresponding one of the connection pads, and wherein the vias are respectively provided in the via holes. 12. A wiring board comprising: wiring layers;vias protruding from an outermost one of the wiring layers;insulating layers disposed alternately with the wiring layers, an outermost one of the insulating layers covering the outermost one of the wiring layers so as to embed the vias therewithin, the outermost one of the insulating layers having recesses;connection pads respectively disposed within the recesses so as to be connected with the vias; andsurface plated layers respectively disposed on the connection pads within the recesses,wherein an outer peripheral edge of each of the connection pads is retracted from an outer peripheral edge of a corresponding one of the surface plated layers toward a center of the connection pad,wherein the outer peripheral edge of each of the surface plated layers substantially matches with an inner peripheral wall of a corresponding one of the recesses,wherein an outermost face of each of the surface plated layers is indented from an outermost face of the outermost one of the insulating layers,wherein the wiring layers respectively include vias,wherein each of the vias is connected to one face of a corresponding one of the connection pads, the one face being opposite to an other face on which a corresponding one of the surface plated layers is formed,wherein via holes are formed in the insulating layers, each of the via holes exposing the one face of the corresponding one of the connection pads,wherein each of the via holes has a circular truncated cone-like shape in which a diameter decreases toward the one face of the corresponding one of the connection pads,wherein the vias are respectively provided in the via holes, andwherein the connection pads are: pads for mounting a semiconductor chip on the wiring board; orpads for mounting the wiring board on another electronic component. 13. The wiring board according to claim 12, wherein each of the surface plated layers is made of at least one of: (i) a tin layer and a silver layer; and (ii) a tin layer. 14. The wiring board according to claim 12, wherein each of the connection pads is made of at least one of copper and a copper alloy. 15. The wiring board according to claim 12, wherein each of the surface plated layers includes a plurality of plated layers, and each of the surface plated layers is made of a gold layer and a nickel layer.