초록 ▼

An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is se

An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.

대표청구항 ▼

1. An electronic device having electronic components that generate heat, comprising: a housing arranged to enclose and support: at least some of the electronic components, anda heat sink structure configured to dissipate at least some of the heat generated by the electronic components separated from

1. An electronic device having electronic components that generate heat, comprising: a housing arranged to enclose and support: at least some of the electronic components, anda heat sink structure configured to dissipate at least some of the heat generated by the electronic components separated from the housing by a gap having a plurality of thicknesses that restrict thermal conduction therebetween, the heat sink structure including at least one heat sink recess and/or at least one heat sink protrusion arranged to respectively expand the gap and/or narrow the gap,wherein the housing also includes at least one housing recess and/or at least one housing protrusion arranged to respectively expand the gap and/or narrow the gap. 2. The electronic device defined in claim 1 wherein a location of the at least one heat sink recess is associated with a location of the at least one electronic component. 3. The electronic device defined in claim 1 wherein the heat sink structure has at least one heat sink recess and at least one heat sink protrusion. 4. The electronic device defined in claim 1 wherein the housing has at least one housing recess and at least one housing protrusion. 5. The electronic device defined in claim 1 wherein the gap is at least partially filled with a low thermally conductive material. 6. The electronic device defined in claim 1 wherein the heat sink structure comprises a material selected from the group consisting of aluminum and copper and wherein the housing comprises plastic. 7. The electronic device defined in claim 1 wherein the housing is arranged to further enclose and support: a plurality of support structures formed from portions of the housing, wherein the heat sink structure is attached to the support structures. 8. The electronic device defined in claim 7 wherein each of the support structures has a protruding portion that protrudes through a respective one of a plurality of openings in the heat sink structure. 9. The electronic device defined in claim 8 wherein each protruding portion has a longitudinal axis and a cavity that lies along the longitudinal axis. 10. The electronic device defined in claim 9 wherein each of the support structures has a plurality of radially extending fins. 11. The electronic device defined in claim 10 wherein a tip portion of each protruding portion is bent from a heat staking process to attach the heat sink structure to the housing. 12. An electronic device having electronic components that generate heat, comprising: a housing arranged to house: at least one of the electronic components; anda heat sink configured to dissipate at least some of the heat from the at least one electronic components separated from the housing by a gap having a plurality of thicknesses that restrict thermal conduction therebetween, the heat sink comprising: a plurality of support structures each having a protrusion that passes through a respective opening of the heat sink. 13. The electronic device defined in claim 12 wherein each of the protrusions contains a cylindrical cavity and a plurality of radially extending fins. 14. An electronic device having at least one electronic component that generates heat, comprising: a plastic housing arranged to enclose: at least one electronic component a heat sink configured to dissipate the heat from the at least one electronic component, the heat sink separated from the housing by a gap configured to reduce thermal conduction from the heat sink to the housing, wherein the heat sink comprises at least one opening, andat least one plastic support structure having a protrusion that passes through the at least one opening. 15. The electronic device defined in claim 14 wherein each of the protrusions has a longitudinal axis and a cavity that lies along the longitudinal axis and wherein the plastic support structure has a plurality of radially extending fins that extend outwards from the longitudinal axis. 16. The electronic device defined in claim 15 wherein the heat sink and plastic housing are configured so that the gap is thicker in areas proximate the at least one electronic component than in other areas of the gap. 17. An electronic device having electronic components that generate heat, comprising: a housing arranged to enclose and support: at least one of the electronic components, andat least one heat sink structure arranged to dissipate at least some of the heat generated by the at least one electronic component, the heat sink structure separated from the housing by a gap having a plurality of thicknesses that restrict thermal conduction therebetween, the housing including at least one housing recess and/or at least one housing protrusion arranged to respectively expand the gap and/or narrow the gap resulting in a substantially uniform heat transfer between the at least one heat sink structure and the housing. 18. The electronic device defined in claim 17 wherein at least a portion of the gap comprises a low thermally conductive material. 19. The electronic device defined in claim 18 wherein the low thermally conductive material comprises a foam material. 20. The electronic device defined in claim 18 wherein the low thermally conductive material comprises air. 21. The electronic device defined in claim 1 wherein the at least one heat sink recess or the at least one heat sink protrusion has a thickness in accordance with an amount of heat generated by a corresponding electronic component. 22. The electronic device defined in claim 1 wherein the gap comprises a low thermally conductive material. 23. The electronic device defined in claim 22 wherein the low thermally conductive material is selected from the group consisting of air and a low density plastic material. 24. The electronic device defined in claim 22 wherein the low thermally conductive material comprises a foam material.