$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Connector 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-012/00
출원번호 US-0498236 (2010-10-05)
등록번호 US-8770988 (2014-07-08)
우선권정보 JP-2009-231829 (2009-10-05); JP-2010-201792 (2010-09-09)
국제출원번호 PCT/JP2010/067819 (2010-10-05)
§371/§102 date 20120326 (20120326)
국제공개번호 WO2011/043488 (2011-04-14)
발명자 / 주소
  • Furukawa, Koji
출원인 / 주소
  • Yazaki Corporation
대리인 / 주소
    Sughrue Mion, PLLC
인용정보 피인용 횟수 : 2  인용 특허 : 72

초록

To provide a connector embedded with a substrate which can be fabricated with fewer working process at a lower cost. A connector 10 includes a substrate 1 with an electronic component 3 mounted thereon, a terminal 4 which is electrically connected to the substrate 1, and a housing 5 comprised of syn

대표청구항

1. A connector comprising: a substrate on which an electronic component is mounted;a terminal which is electrically connected to the substrate; anda housing comprised of a synthetic resin, to which the substrate and the terminal are attached;wherein the electronic component mounted on the substrate

이 특허에 인용된 특허 (72)

  1. Hassan Altaf ; Bhattacharyya Bidyut K., Anchor provisions to prevent mold delamination in an overmolded plastic array package.
  2. Mayuzumi,Takuya; Eguchi,Shuji; Sasaki,Masahiro; Kadoya,Kiyoomi, Control device and method of manufacturing thereof.
  3. Wetzel, Gerhard, Electrical component.
  4. Brandenburg,Scott D.; Myers,Bruce A., Electronic assembly with solder-bonded heat sink.
  5. Masumoto Yoshihide (Himeji JPX), Electronic circuit apparatus.
  6. Sugimoto,Keiichi; Nakagawa,Mitsuru, Electronic circuit apparatus.
  7. Nakamura, Tadashi; Tsuzuki, Takeo, Electronic circuit device.
  8. Sugimoto, Keiichi; Nakagawa, Mitsuru, Electronic circuit device and electronic key transceiver.
  9. Sugimoto, Keiichi; Nakagawa, Mitsuru, Electronic circuit device and manufacturing method of the same.
  10. Sugimoto,Keiichi; Nakagawa,Mitsuru, Electronic circuit device and manufacturing method of the same.
  11. Okamoto Mikio,JPX ; Ebara Katsumi,JPX, Electronic circuit device and method of fabricating the same.
  12. Mayuzumi, Takuya; Sasaki, Masahiro; Kadoya, Kiyoomi, Electronic circuit device and production method of the same.
  13. Nakatani Yoshio (Toyonaka JPX) Tamura Tooru (Ikeda JPX) Nozu Mikio (Yamatokouriyama JPX) Manabe Takahiro (Katano JPX), Electronic circuit module.
  14. Brandenburg Scott David ; Daanen Jeffery Ralph, Electronic circuit with integrated terminal pins.
  15. Yamaguchi, Shinji; Hirose, Tetsu; Abe, Kenichi, Electronic component embedded connector, and method and device for manufacturing the same.
  16. Ogawa, Toshio; Takahashi, Masaaki; Kamimura, Noritaka; Yamada, Kazuji; Kaminaga, Toshiaki, Electronic device and method of fabricating the same.
  17. Pearce, David W., Encapsulated assemblies.
  18. Mehta Rajendra M. (Ypsilanti MI), Encapsulated product and method of manufacture.
  19. Lo Randy (Campbell CA) Takiar Hem P. (Fremont CA), Encapsulation filler technology for molding active electronics components such as IC cards or PCMCIA cards.
  20. Nguyen Tan ; Mitchell Craig S. ; Distefano Thomas H., Encapsulation of microelectronic assemblies.
  21. Koike, Yasuhiro; Saito, Hidefumi; Okawa, Katsumi; Iimura, Junichi, Hybrid integrated circuit device and manufacturing method thereof.
  22. Yee,Jae Hak; Chung,Young Suk; Lee,Jae Jin; Davis,Terry; Han,Chung Suk; Ku,Jae Hun; Kwak,Jae Sung; Ryu,Sang Hyun, Leadframe having lead locks to secure leads to encapsulant.
  23. Komiya Zen,JPX ; Yamaguchi Yoshikazu,JPX ; Watanabe Tsuyoshi,JPX ; Ukachi Takashi,JPX, Liquid curable resin composition.
  24. Uchida, Hirofumi; Komiya, Zen; Ukachi, Takashi, Liquid curable resin composition and cured products.
  25. Oliver Stotz DE, Means and process for encapsulating electric circuits by means of injection molding.
  26. Rauchmaul Siegfried (Munich DEX) Schmidt Hans-Fr. (Eurasburg DEX) Bednarz Juergen (Penzberg DEX) Horsmann Karl-Heinz (Munich DEX) Criens Ralf (Munich DEX) Scheffler Horst (Munich DEX) Peltz Hanns-Hei, Method and an encapsulation for encapsulating electrical or electronic components or assemblies.
  27. Itoh Katsuya (Yokkaichi JPX) Sawada Hisashi (Yokkaichi JPX) Okamoto Masaki (Yokkaichi JPX) Furuta Yoshiaki (Yokkaichi JPX), Method and apparatus for connecting electronic parts and terminals.
  28. Hirao Yasunobu (Toyokawa JPX) Motoyama Yuji (Okazaki JPX) Nagasaka Takashi (Anjo JPX) Katsuyama Hidekazu (Nukata-gun JPX), Method for producing multi-board electronic device.
  29. Brandenburg,Scott D.; Oman,Todd P.; Miller,Micheal E., Method of developing an electronic module.
  30. Brandenburg Scott David ; Koors Mark Anthony ; Daanen Jeffery Ralph, Method of forming an overmolded electronic assembly.
  31. Ishida Yoshihiro (Tokorozawa JPX) Komatsu Katsuji (Kawagoe JPX) Mimura Seiichi (Kawagoe JPX) Takenouchi Kikuo (Higashimurayama JPX) Yabe Isao (Tokorozawa JPX) Ichikawa Shingo (Sayama JPX) Shimada Yos, Method of making a resin encapsulated pin grid array with integral heatsink.
  32. Palmer Clarence K. (Polo IL), Method of making sealed housings containing delicate structures.
  33. Iimura, Junichi; Okawa, Katsumi; Koike, Yasuhiro; Saito, Hidefumi, Method of manufacturing a hybrid integrated circuit device.
  34. Hunkeler,Hugh R.; Fortune,Duane D., Method of manufacturing a sealed electronic module.
  35. Komathu Kathuzi (Kawagoe JPX), Method of molding a protective cover on a pin grid array.
  36. Jaklin,Ralf; Wallrafen,Werner, Method of producing an electronic device and electronic device.
  37. Brandenburg, Scott D.; Laudick, David A; Oberlin, Gary E., Method of producing an overmolded electronic module with a flexible circuit pigtail.
  38. Sasaki,Kouji; Iizumi,Tomihiro, Mold-type electronic control unit.
  39. Branan Mac W. (1211 SE. 11th St. Fr. Lauderdale FL 33316) Reiff David E. (16911 SW. 66th St. Ft. Lauderdale FL 33331) Dorinski Dale W. (8740 NW. 17th Manor Coral Springs FL 33071), Molded electrical assembly having an integral connector.
  40. Yamaguchi, Atsushi; Miyakawa, Hidenori; Sakatani, Shigeaki; Matsuno, Koso, Mounted structure.
  41. Matsumoto Kunio (Yokohama JPX) Hirota Kazuo (Chigasaki JPX) Kishimoto Munehisa (Kamakura JPX), Mounting structure and electronic device employing the same.
  42. Taylor Carl James (Morgan Hill CA) Patterson Michael William (Pleasanton CA), Overmolded PC board with ESD protection and EMI suppression.
  43. Veenstra, Thomas J.; Mulder, Jason R.; Fleischmann, Eric L., Overmolded circuit board and method.
  44. Brandenburg Scott David ; Koors Mark Anthony ; Daanen Jeffery Ralph, Overmolded electronic assembly.
  45. Mandel,Larry M; Laudick,David A., Overmolded electronic assembly with insert molded heat sinks.
  46. Daanen Jeffery Ralph ; Brandenburg Scott David, Overmolded electronic module with underfilled surface-mount components.
  47. Brandenburg, Scott D.; Degenkolb, Thomas A.; Myers, Bruce A., Overmolded electronic package including circuit-carrying substrate.
  48. Worp Nicolaas H. (Margate FL) Freyman Bruce J. (Plantation FL) Conrath Kurt C. (Lauderhill FL), Overmolded semiconductor package with anchoring means.
  49. Hirata Atsuomi (Nara JPX) Nakamura Yoshihiko (Nishinomiya JPX) Morii Kensaku (Takatsuki JPX), Plastic molded pin grid chip carrier package.
  50. Busse, Ralf-Dieter, Plug-in connector for circuit boards.
  51. Tanner, Juergen, Potting shell.
  52. Mayuzumi, Takuya; Sasaki, Masahiro; Kadoya, Kiyoomi, Production method of an electronic circuit device.
  53. Luettgen, Michael John; Degrood, Susan Marie, Protected electronic assembly.
  54. Liptak Julius M. ; Gerlach Michael Joseph, Protective containment apparatus for potted electronic circuits.
  55. Patterson Michael W. (Pleasanton CA) Takiar Hem P. (Fremont CA), Removable computer peripheral cards having a solid one-piece housing.
  56. Schenk Robert J. (28 Valley View Ter. Wayne NJ 07470), Removable rigid support structure for circuit cards.
  57. Segawa Tadanori (Hitachi JPX) Suzuki Hiroshi (Hitachi JPX) Kitamura Masahiro (Hitachi JPX) Numata Shunichi (Hitachi JPX) Nishi Kunihiko (Higashikurume JPX), Resin encapsulated electronic devices.
  58. Kaminaga Toshiaki,JPX ; Shida Masami,JPX ; Sugiura Noboru,JPX ; Kobayashi Ryoichi,JPX ; Fukatsu Katsuaki,JPX, Resin sealed electronic device and method of fabricating the same and ignition coil for internal combustion engine using the same.
  59. Suzuki Masataka,JPX ; Ashiya Hiroyuki,JPX ; Maki Yayoi,JPX ; Masuda Atsushi,JPX, Resin-coated mount substrate and method of producing the same.
  60. Okuda Hiroshi,JPX, Resin-molded electronic circuit device.
  61. Diaz Steve ; Horsma Dave ; Kulkarni Narendra ; Lundquist Peter ; Nakazato Akira ; Shen Nelson ; Lippe Paul von der, Sealed electronic packaging for environmental protection of active electronics.
  62. Tokunaga Masatoshi,JPX, Semiconductor device including molded IC fixed to casing.
  63. Hikita Junichi,JPX ; Shibata Kazutaka,JPX, Semiconductor device with package.
  64. Lee,Tae Heon; Seo,Mu Hwan, Semiconductor package having reduced thickness.
  65. Neuhaeuser,Torsten, Sensor.
  66. Jones Allen M. (Novi MI), Shielded self-molding package for an electronic component.
  67. Heiss Reinhold (Deutenhausen DEX), Shielding for flat modules.
  68. Wimberger Friedl, Reinhold; Broeksema, Egbert; Deeben, Henricus A.C., Synthetic resin capping layer on a printed circuit.
  69. Brandenburg,Scott D.; Laudick,David A., Technique for manufacturing an overmolded electronic assembly.
  70. Burns Carmen D. ; Cady James W. ; Roane Jerry M. ; Troetschel Phillip Randall, Warp-resistent ultra-thin integrated circuit package fabrication method.
  71. Shiu, George; Koh, Wei, Waterproof USB drives and method of making.
  72. Degenkolb, Thomas A.; Brandenburg, Scott D.; Mandel, Larry M.; Chow, Kin Yean; Fang, Ching Meng; Yong, Sim Ying, Wrap-around overmold for electronic assembly.

이 특허를 인용한 특허 (2)

  1. Schillinger, Jakob; Romhart, Günther; Dinard, Yann, Electronic device and method for producing an electronic device.
  2. Matoy, Jennifer L., Pin to PCB connection structure and method.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로