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Various embodiments of the invention relate to enclosure assemblies housing at least one electronic board assembly and systems (e.g., missiles or unmanned vehicles) that may employ such enclosure assemblies. In an embodiment, an enclosure assembly includes an enclosure having an interior surface def

Various embodiments of the invention relate to enclosure assemblies housing at least one electronic board assembly and systems (e.g., missiles or unmanned vehicles) that may employ such enclosure assemblies. In an embodiment, an enclosure assembly includes an enclosure having an interior surface defining an interior space and an inner diameter. At least one electronic board assembly is positioned within the interior space and includes a first peripheral edge region and an opposing second peripheral edge region. The electronic board assembly extends diametrically so that the first and second peripheral edge regions are at least proximate to the interior surface. In another embodiment, a plurality of electronic board assemblies are positioned within the interior space and each extends generally along a respective non-diametric chord defined by the interior surface.

대표청구항 ▼

1. An enclosure assembly, comprising: an enclosure including an interior surface defining an interior space and an inner diameter; andat least one electronic board assembly positioned within the interior space and including a first peripheral edge region and an opposing second peripheral edge region

1. An enclosure assembly, comprising: an enclosure including an interior surface defining an interior space and an inner diameter; andat least one electronic board assembly positioned within the interior space and including a first peripheral edge region and an opposing second peripheral edge region, the at least one electronic board assembly extending diametrically so that the first and second peripheral edge regions are at least proximate to the interior surface, the electronic board assembly comprising a PCI mezzanine board having a PCI bus interface wherein the first and second peripheral edge regions comprise edges other than the PCI bus interface. 2. The enclosure assembly of claim 1 wherein at least one electronic board assembly comprises a plurality of electronic board assemblies longitudinally spaced and each including a corresponding first peripheral edge region and a corresponding opposing second peripheral edge region, each electronic board assembly generally lying in a different plane and extending diametrically so that each corresponding first peripheral edge region and each corresponding opposing second peripheral edge region is at least proximate to the interior surface. 3. The enclosure assembly of claim 1 wherein the interior surface comprises first and second longitudinally extending slots formed therethrough, the first peripheral edge region of the at least one electronic board assembly inserted into the corresponding first longitudinally extending slot and the second peripheral edge region of the at least one electronic board assembly inserted into the corresponding second longitudinally extending slot. 4. The enclosure assembly of claim 3 wherein the at least one electronic board assembly comprises: a first locking device attached to the first peripheral edge region, and received by and locked within the first longitudinally extending slot; anda second locking device attached to the second peripheral edge region, and received by and locked within the second longitudinally extending slot. 5. The enclosure assembly of claim 1 wherein the at least one electronic board assembly comprises: a first mounting device attached to the first peripheral edge region that engages a first mount associated with the enclosure; anda second mounting device attached to the second peripheral edge region that engages a second mount associated with the enclosure. 6. The enclosure assembly of claim 1 wherein the inner diameter of the enclosure is about 4 inch. 7. The enclosure assembly of claim 1 wherein the at least electronic board assembly comprises external electrical connectors that are not located within a peripheral edge region thereof. 8. The enclosure assembly of claim 1 wherein the at least one electronic board assembly comprises: a carrier substrate including a first side and an opposing second side;a first electronic circuit board mounted to the first side and operatively coupled to the carrier substrate; anda second electronic circuit board mounted to the second side and operatively coupled to the carrier substrate. 9. The enclosure assembly of claim 8 wherein: the first electronic circuit board comprises the PCU mezzanine board as a first PCI mezzanine board; andthe second electronic circuit board comprises a second PCI mezzanine board. 10. The enclosure assembly of claim 1 wherein the at least one electronic board assembly comprises: a carrier board including a first side and an opposing second side;a first electronic circuit board mounted to the first side of the carrier board and operatively coupled to the carrier board, the first electronic circuit board including a first pipeline accelerator; anda second electronic circuit board mounted to the second side of the carrier board and operatively coupled to the carrier board, the second electronic circuit board including a second pipeline accelerator. 11. An enclosure assembly, comprising: an enclosure including an interior surface defining an interior space and a plurality of non-diametric chords; and a plurality of electronic board assemblies positioned within the interior space and each including a first peripheral edge region having a high-thermal conductivity interface and an opposing second peripheral edge region having a high-thermal conductivity interface, each electronic board assembly extending generally along a respective one of the non-diametric chords so that the first and second peripheral edge regions thereof are interface with the interior surface such that heat is transferred from the plurality of electronic board assemblies to the enclosure; wherein each electronic board assembly further comprises a PCI mezzanine board having a PCI bus interface wherein the first and second peripheral edge regions comprise edges other than the PCI bus interface. 12. The enclosure assembly of claim 11 wherein the interior surface comprises a plurality of longitudinally extending slots formed therethrough, the first peripheral edge region of each electronic board assembly inserted into a respective one of the longitudinally extending slots and the second peripheral edge region of each electronic board assembly inserted into a respective one of the longitudinally extending slots. 13. The enclosure assembly of claim 11 wherein each electronic board assembly comprises: a first locking device attached to the first peripheral edge region, and received by and locked within the first longitudinally extending slot; anda second locking device attached to the second peripheral edge region, and received by and locked within the second longitudinally extending slot. 14. The enclosure assembly of claim 11 wherein each electronic board assembly comprises: a first mounting device attached to the first peripheral edge region that engages a first mount associated with the enclosure; anda second mounting device attached to the second opposing peripheral edge region that engages a second mount associated with the enclosure. 15. The enclosure assembly of claim 11 wherein the interior surface of the enclosure defines an inner diameter that is greater than about 4 inch. 16. The enclosure assembly of claim 11 wherein each electronic board assembly comprises external electrical connectors that are not located within a peripheral edge region thereof. 17. The enclosure assembly of claim 11 wherein the at least one electronic board assembly comprises: a carrier substrate including a first side and an opposing second side;a first electronic circuit board mounted to the first side and operatively coupled to the carrier substrate; anda second electronic circuit board mounted to the second side and operatively coupled to the carrier substrate. 18. The enclosure assembly of claim 17 wherein: the first electronic circuit board comprises a first PCI mezzanine board; andthe second electronic circuit board comprises a second PCI mezzanine board. 19. The enclosure assembly of claim 11 wherein the at least one electronic board assembly comprises: a carrier board including a first side and an opposing second side;a first electronic circuit board mounted to the first side of the carrier board and operatively coupled to the carrier board, the first electronic circuit board including a first pipeline accelerator; anda second electronic circuit board mounted to the second side of the carrier board and operatively coupled to the carrier board, the second electronic circuit board including a second pipeline accelerator. 20. A system, comprising: an enclosure assembly including: an enclosure including an interior surface defining an interior space and an inner diameter; andat least one electronic board assembly positioned within the interior space and including a first peripheral edge region and an opposing second peripheral edge region, the at least one electronic board assembly extending diametrically so that the first and second peripheral edge regions are extended through the interior surface; anda propulsion system operatively coupled to the at least one electronics module. 21. The system of claim 20 wherein the enclosure forms at least part of a missile body. 22. The system of claim 20 wherein the enclosure forms at least part of a vehicle body. 23. A system, comprising: an enclosure assembly including: an enclosure including an interior surface defining an interior space and a plurality of non-diametric chords; anda plurality of electronic board assemblies each including a first peripheral edge region and an opposing second peripheral edge region, each electronic board assembly extending generally along a respective one of the non-diametric chords so that the first and second peripheral edge regions thereof are extended through the interior surface; anda propulsion system operatively coupled to the at least one electronics module. 24. The system of claim 23 wherein the enclosure forms at least part of a missile body. 25. The system of claim 23 wherein the enclosure forms at least part of a vehicle body.