The present invention provides wood preservative compositions comprising micronized particles. In one embodiment, the composition comprises dispersions of micronized metal or metal compounds. In another embodiment, the wood preservative composition comprises an inorganic biocide comprising a metal o
The present invention provides wood preservative compositions comprising micronized particles. In one embodiment, the composition comprises dispersions of micronized metal or metal compounds. In another embodiment, the wood preservative composition comprises an inorganic biocide comprising a metal or metal compound and organic biocide. When the composition comprises an inorganic biocide and an organic biocide, the inorganic biocide or the organic biocide or both are present as micronized particles. When compositions of the present invention are used for preservation of wood, there is minimal leaching of the metal and biocide from the wood.
대표청구항▼
1. Wood treated with an aqueous wood preservative composition, wherein said composition comprises: (a) a biocidally effective amount of particles of a copper compound with a particle size of between 0.001 and 25 microns; and(b) a biocidally effective amount of one or more organic biocides, wherein t
1. Wood treated with an aqueous wood preservative composition, wherein said composition comprises: (a) a biocidally effective amount of particles of a copper compound with a particle size of between 0.001 and 25 microns; and(b) a biocidally effective amount of one or more organic biocides, wherein the particles of the copper compound are distributed throughout the wood and render the wood resistant to fungal decay. 2. The wood of claim 1, wherein the copper compound is selected from the group consisting of copper hydroxide, cupric oxide, cuprous oxide, copper carbonate, basic copper carbonate, copper oxychloride, copper 8-hydroxyquinolate, copper dimethyldithiocarbamate, copper omadine, and copper borate. 3. The wood of claim 1, wherein the particles of the copper compound have a size of between 0.001 and 10.0 microns. 4. The wood of claim 3, wherein the particles of the copper compound have a size of between 0.05 and 10.0 microns. 5. The wood of claim 4, wherein the particles of the copper compound have a size of between 0.05 and 1.0 micron. 6. The wood of claim 1, wherein the organic biocide is selected from the group consisting of fungicide, insecticide, algaecide, moldicide, and bactericide. 7. The wood of claim 1, wherein the organic biocide is an azole, a borate, or a fluoride. 8. The wood of claim 7, wherein the organic biocide is an azole. 9. The wood of claim 8, wherein the azole is tebuconazole. 10. The wood of claim 1, wherein the organic biocide is a solid. 11. The wood of claim 10, wherein the organic biocide has a particle size of between 0.001 and 25 microns. 12. The wood of claim 11, wherein the organic biocide is tebuconazole. 13. The wood of claim 1, wherein the wood comprises coniferous wood. 14. The wood of claim 13, wherein the coniferous wood comprises southern pine. 15. The wood of claim 1, wherein the particles of the copper compound are uniformly distributed throughout a cross-section of the wood. 16. The wood of claim 15, wherein copper leaching from the wood is reduced as compared to copper leaching from a wood comprising copper monoethanolamine complex. 17. The wood of claim 1, wherein the wood is lumber. 18. The wood of claim 1, wherein the particles of the copper compound are obtained by milling.
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이 특허에 인용된 특허 (136)
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