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Interconnects for optoelectronic devices are described. For example, an interconnect for an optoelectronic device includes an interconnect body having an inner surface, an outer surface, a first end, and a second end. A plurality of bond pads is coupled to the inner surface of the interconnect body,

Interconnects for optoelectronic devices are described. For example, an interconnect for an optoelectronic device includes an interconnect body having an inner surface, an outer surface, a first end, and a second end. A plurality of bond pads is coupled to the inner surface of the interconnect body, between the first and second ends. A stress relief feature is disposed in the interconnect body. The stress relief feature includes a slot disposed entirely within the interconnect body without extending through to the inner surface, without extending through to the outer surface, without extending through to the first end, and without extending through to the second end of the interconnect body.

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1. An interconnect for an optoelectronic device, the interconnect comprising: an interconnect body comprising an inner surface, an outer surface, a first end, and a second end;a plurality of bond pads coupled to the inner surface of the interconnect body, between the first and second ends; anda stre

1. An interconnect for an optoelectronic device, the interconnect comprising: an interconnect body comprising an inner surface, an outer surface, a first end, and a second end;a plurality of bond pads coupled to the inner surface of the interconnect body, between the first and second ends; anda stress relief feature disposed in the interconnect body, the stress relief feature comprising a first narrow slot disposed entirely within the interconnect body without extending through to the inner surface, without extending through to the outer surface, without extending through to the first end, and without extending through to the second end of the interconnect body, the first narrow slot positioned in a location approximately equally between the first and second ends, the first narrow slot comprising an opening at the inner surface of the interconnect body and extending into the interconnect body, but not through to the outer surface. 2. The interconnect of claim 1, wherein the stress relief feature further comprises a second narrow slot in a location proximate to the first end and distal from the second end, the second narrow slot comprising an opening at the outer surface of the interconnect body and extending into the interconnect body, but not through to the inner surface, and a third narrow slot between the second narrow slot and the first end, the third narrow slot between and orthogonal to the inner and outer surfaces, but not opening into either of the inner and outer surfaces. 3. The interconnect of claim 1, wherein the stress relief feature further comprises a vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body. 4. The interconnect of claim 1, wherein the stress relief feature further comprises: a second narrow slot in a location proximate to the first end and distal from the second end, the second narrow slot comprising an opening at the outer surface of the interconnect body and extending into the interconnect body, but not through to the inner surface;a third narrow slot between the second narrow slot and the first end, the third narrow slot between and orthogonal to the inner and outer surfaces, but not opening into either of the inner and outer surfaces; anda vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body. 5. The interconnect of claim 1, wherein the interconnect is a coupling interconnect. 6. The interconnect of claim 1, wherein the interconnect is a terminal interconnect. 7. An interconnect for an optoelectronic device, the interconnect comprising: an interconnect body comprising an inner surface, an outer surface, a first end, and a second end;a plurality of bond pads coupled to the inner surface of the interconnect body, between the first and second ends;a stress relief feature disposed in the interconnect body, the stress relief feature comprising a first narrow slot disposed entirely within the interconnect body without extending through to the inner surface, without extending through to the outer surface, without extending through to the first end, and without extending through to the second end of the interconnect body, the first narrow slot positioned in a location approximately equally between the first and second ends, the first narrow slot comprising an opening at the inner surface of the interconnect body and extending into the interconnect body, but not through to the outer surface;a first L-shaped extension at the first end of the interconnect body; anda second L-shaped extension at the second end of the interconnect body, the horizontal bases of each of the first and second L-shaped extensions proximate to the inner surface and distal from the outer surface of the interconnect body. 8. The interconnect of claim 7, wherein the stress relief feature further comprises a second narrow slot in a location proximate to the first end and distal from the second end, the second narrow slot comprising an opening at the outer surface of the interconnect body and extending into the interconnect body, but not through to the inner surface, and a third narrow slot between the second narrow slot and the first end, the third narrow slot between and orthogonal to the inner and outer surfaces, but not opening into either of the inner and outer surfaces. 9. The interconnect of claim 7, wherein the stress relief feature further comprises a vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body. 10. The interconnect of claim 7, wherein the stress relief feature further comprises: a second narrow slot in a location proximate to the first end and distal from the second end, the second narrow slot comprising an opening at the outer surface of the interconnect body and extending into the interconnect body, but not through to the inner surface;a third narrow slot between the second narrow slot and the first end, the third narrow slot between and orthogonal to the inner and outer surfaces, but not opening into either of the inner and outer surfaces; anda vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body. 11. The interconnect of claim 7, wherein the interconnect is a coupling interconnect. 12. The interconnect of claim 7, wherein the interconnect is a terminal interconnect. 13. An interconnect for an optoelectronic device, the interconnect comprising: an interconnect body comprising an inner surface, an outer surface, a first end, and a second end;a plurality of bond pads coupled to the inner surface of the interconnect body, between the first and second ends; anda stress relief feature disposed in the interconnect body, the stress relief feature comprising a slot disposed entirely within the interconnect body without extending through to the inner surface, without extending through to the outer surface, without extending through to the first end, and without extending through to the second end of the interconnect body, wherein the stress relief feature further comprises a vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body. 14. The interconnect of claim 13, wherein the stress relief feature further comprises a first narrow slot in a location proximate to the first end and distal from the second end, the first narrow slot comprising an opening at the outer surface of the interconnect body and extending into the interconnect body, but not through to the inner surface, and a second narrow slot between the first narrow slot and the first end, the second narrow slot between and orthogonal to the inner and outer surfaces, but not opening into either of the inner and outer surfaces. 15. The interconnect of claim 13, wherein the interconnect is a coupling interconnect. 16. The interconnect of claim 13, wherein the interconnect is a terminal interconnect.