초록 ▼

To provide a laser cutting method that is capable of cutting the substrates high accurately with high throughput at a low cost. It is a laser cutting method for cutting a laminated substrate that is formed by laminating at least a pair of substrates. The method comprises the steps of: providing a pa

To provide a laser cutting method that is capable of cutting the substrates high accurately with high throughput at a low cost. It is a laser cutting method for cutting a laminated substrate that is formed by laminating at least a pair of substrates. The method comprises the steps of: providing a pattern member with a characteristic of absorbing light of a wavelength that transmits each of the substrates, between each of the substrates along a cutting position of the laminated substrate; and irradiating a laser of the wavelength that transmits the substrates along the pattern member, whereby the laminated substrate is cut along the pattern member.

대표청구항 ▼

1. A laser cutting method for cutting a laminated glass substrate that is formed by laminating at least a pair of glass substrates, comprising the steps of: providing a pattern member between the pair of the glass substrates in a manner that the pattern member is contacting inner sides of both of th

1. A laser cutting method for cutting a laminated glass substrate that is formed by laminating at least a pair of glass substrates, comprising the steps of: providing a pattern member between the pair of the glass substrates in a manner that the pattern member is contacting inner sides of both of the glass substrates and along a cutting position of the laminated glass substrate, the pattern member having a characteristic of absorbing light of a wavelength that transmits through either of the glass substrates;cooling the laminated glass substrate;while cooling the laminated glass substrate, generating heat in the pattern member by irradiating a surface side of a first one of the glass substrates of the laminated glass substrate with a laser beam of the wavelength that transmits through the glass substrates and letting the laser beam transmit through the first one glass substrate to irradiate the pattern member, wherein in irradiating of the surface side of the first one glass substrate with the laser beam, the laser beam irradiates the laminated glass substrate only through an exterior surface of the surface side of the first one glass substrate from one side; andcutting both of the pair of glass substrates at once by generating cracking from and at an inner part of each of the glass substrates in contact with the pattern member by using the heat transferred from the pattern member to both of the glass substrates forming the laminated glass substrate, whereby the laminated glass substrate is cut along the pattern member along a generated crack. 2. The laser cutting method as claimed in claim 1, wherein the pattern member is formed with a gap retaining member that is provided between the pair of glass substrates. 3. The laser cutting method as claimed in claim 2, wherein one of the pair of glass substrates is a driving glass substrate and the other one is a counter glass substrate that is equipped with a display part, the method further comprising the step of, before laminating each of the glass substrates: forming a flattening film on the driving glass substrate and an overcoat layer on the counter glass substrate, respectively, except for a part where the gap retaining member is provided. 4. The laser cutting method as claimed in claim 3, wherein: a plurality of external connecting terminals are provided at an edge part of the driving glass substrate; and a black matrix that is a black straight line for performing laser cutting is provided to the counter glass substrate at an area opposing to the external connecting terminals, before laminating the glass substrates. 5. The laser cutting method as claimed in claim 2, wherein the gap retaining member is formed with a member that has thermal conductivity as well as a characteristic of absorbing the light of the wavelength that transmits through the glass substrates. 6. A manufacturing method of a display apparatus, comprising the steps of: providing a formed laminated glass substrate comprised of a pair of glass substrates and pattern member; andusing the cutting method of claim 1, cutting a plurality of display apparatus parts from the formed laminated glass substrates;wherein one of the pair of glass substrates is equipped with a plurality of display driving devices, and the other glass substrate comprises a plurality of display devices which correspond to the display driving devices and are driven by the display driving devices. 7. The manufacturing method of a display apparatus as claimed in claim 6, wherein the display devices are liquid crystal display devices formed by a liquid crystal dropping injection method. 8. The laser cutting method as claimed in claim 1, wherein the step of cooling the laminated glass substrate comprises the laminated glass substrate being supported by a stand, and the step of cooling the laminated glass substrate occurs during cutting by the stand providing a function of cooling the laminated glass substrate to thereby increase a thermal stress influence. 9. The laser cutting method as claimed in claim 1, wherein the step of cooling the laminated glass substrate comprises the laminated glass substrate being supported by a stand, and the step of cooling the laminated glass substrate occurs during cutting by the stand providing a function of cooling a surface side of a second one of the glass substrates of the laminated glass substrate to thereby increase a thermal stress influence of the heat transferred from the pattern member to both of the glass substrates forming the laminated glass substrate. 10. The laser cutting method as claimed in claim 1, wherein, the first one glass substrate is a counter glass substrate equipped with a display part, andthe second one glass substrate is a driving glass substrate constituted with pixel-driving polycrystalline silicon thin-film transistors and driving circuits. 11. The laser cutting method as claimed in claim 8, wherein, the first one glass substrate is a counter glass substrate equipped with a display part, andthe second one glass substrate is a driving glass substrate constituted with pixel-driving polycrystalline silicon thin-film transistors and driving circuits. 12. The laser cutting method as claimed in claim 9, wherein, the first one glass substrate is a counter glass substrate equipped with a display part, andthe second one glass substrate is a driving glass substrate constituted with pixel-driving polycrystalline silicon thin-film transistors and driving circuits.