Micro-electro-mechanical system having movable element integrated into leadframe-based package
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H04R-023/00
B81B-003/00
B81C-001/00
출원번호
US-0709295
(2012-12-10)
등록번호
US-8796792
(2014-08-05)
발명자
/ 주소
Zuniga-Ortiz, Edgar Rolando
Krenik, William R.
출원인 / 주소
Texas Instruments Incorporated
대리인 / 주소
Franz, Warren L.
인용정보
피인용 횟수 :
0인용 특허 :
1
초록▼
A MEMS may integrate movable MEMS parts, such as mechanical elements, flexible membranes, and sensors, with the low-cost device package, leaving the electronics and signal-processing parts in the integrated circuitry of the semiconductor chip. The package may be a leadframe-based plastic molded body
A MEMS may integrate movable MEMS parts, such as mechanical elements, flexible membranes, and sensors, with the low-cost device package, leaving the electronics and signal-processing parts in the integrated circuitry of the semiconductor chip. The package may be a leadframe-based plastic molded body having an opening through the thickness of the body. The movable part may be anchored in the body and extend at least partially across the opening. The chip may be flip-assembled to the leads to span across the foil, and may be separated from the foil by a gap. The leadframe may be a prefabricated piece part, or may be fabricated in a process flow with metal deposition on a sacrificial carrier and patterning of the metal layer. The resulting leadframe may be flat or may have an offset structure useful for stacked package-on-package devices.
대표청구항▼
1. A microelectromechanical system (MEMS) device, comprising: a body having a thickness, a first surface and an opposite second surface;an opening through the thickness of the body, the opening extending from the first to the second surface;metal leads embedded in the first surface of the body;a met
1. A microelectromechanical system (MEMS) device, comprising: a body having a thickness, a first surface and an opposite second surface;an opening through the thickness of the body, the opening extending from the first to the second surface;metal leads embedded in the first surface of the body;a metal foil anchored in the body and extending at least partially across the opening at the first surface; andan integrated circuit chip flip-assembled to the leads on the first surface, the chip spanning at least partially across the foil, separated from the foil by a gap;wherein the metal leads include a first set and a second set, the leads of the first set enabling electrical interconnection between the foil and the integrated circuit, the leads of the second set enabling solder contacts to external parts;wherein the leads of the first set, together with the foil, are positioned in a first plane and the leads of the second set are positioned in a second plane offset from the first plane; andwherein the metal leads further include a third set positioned in the first plane, the third set configured as a metal seal ring encircling the opening. 2. The MEMS device of claim 1, wherein the foil is movable normal to the first surface in the space of the opening and of the gap. 3. The MEMS device of claim 1, wherein the foil has the configuration of a membrane sealing the opening at the first surface. 4. The MEMS device of claim 1, wherein the foil has the configuration of a movable suspension beam anchored on the first surface, the beam extending to a plate remote from the anchor and operable to move the plate normal to the first surface. 5. The MEMS device of claim 4, further including an additional mass attached to the plate. 6. The MEMS device of claim 1, further including a metal plate on the chip, the plate facing the first surface and forming a capacitor with the metal foil. 7. The MEMS device of claim 1, wherein the chip includes a first set and a second set of contacts, the first set in locations matching the first set leads, and the second set matching the third set leads encircling the opening. 8. A microelectromechanical system (MEMS) device, comprising: a leadframe having a first surface, the leadframe defining a plurality of leads and a segment;a polymeric compound deposited over the leadframe first surface including at the leads and a peripheral portion of the segment, leaving the first surface at another portion of the segment unencapsulated at a bottom of an opening through the polymeric compound, the unencapsulated portion defining a movable part of the MEMS device; anda semiconductor chip having electronic circuitry on a first chip surface connected at the leads to a second surface of the leadframe, so that the first chip surface spans across the movable part, separated from the movable part by a gap. 9. The device of claim 8, wherein the leadframe is a patterned metal sheet. 10. The device of claim 9, wherein the metal sheet has a thickness which is thinner at the unencapsulated portion. 11. The device of claim 10, wherein the leads comprise first and second leads; the semiconductor chip is connected at the first leads; and solder balls are attached to the second leads for connection to external parts. 12. The device of claim 8, wherein the leadframe has a thickness which is thinner at the unencapsulated portion. 13. A microelectromechanical system (MEMS) device, comprising: a leadframe having first and second surfaces, the leadframe defining a plurality of leads and a segment;a polymeric compound having a thickness, the polymeric compound encapsulating the second leadframe surface, leaving a portion of the second leadframe surface at the segment unencapsulated at an opening through the thickness;a foil suitable as a movable part of the MEMS device defined by a thinning of the segment at the location of the unencapsulated portion; anda semiconductor chip having electronic circuitry on a first chip surface connected to the leads at the first leadframe surface so that the first chip surface with the electronic circuitry faces and spans the foil, separated from the foil by a gap. 14. The device of claim 13, further comprising a solderable metallurgical configuration formed on the first leadframe surface. 15. The device of claim 13, wherein the leadframe is a preformed metal part of uniform thickness except for thinning at the segment. 16. The device of claim 13, wherein the leadframe is configured with the segment and first ones of the leads in a first plane, and second ones of the leads in a second plane offset from the first plane. 17. The device of claim 13, wherein the circuitry of the chip includes a metal plate aligned with the leadframe segment.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (1)
O'Boyle John, Micro-electronic assembly including a flip-chip mounted micro-device and method.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.