초록 ▼

A technique for joining porous foam material, such as graphite, metal or ceramic foam, to a substrate is described. The substrate can be metal, a thermoset plastic or a composite material. The substrate has a melting point below that of the foam material. The two are joined together by using the foa

A technique for joining porous foam material, such as graphite, metal or ceramic foam, to a substrate is described. The substrate can be metal, a thermoset plastic or a composite material. The substrate has a melting point below that of the foam material. The two are joined together by using the foam to apply heat locally at the surface of the substrate. Some or all of the foam is heated to the appropriate temperature at or above the melting point of the substrate material. The foam and the substrate are then brought together, with the heat from the foam melting or softening the substrate material so that the substrate material infuses into the pores of the foam. As the foam cools below the melting point temperature, the substrate material solidifies to create a mechanical bond between the foam and the substrate.

대표청구항 ▼

1. A method of direct bonding a porous foam to a substrate, comprising: heating a portion of the porous foam that is intended to be in contact with the substrate to a temperature at or above the melting point temperature of the substrate; andbringing the heated portion of the porous foam and the sub

1. A method of direct bonding a porous foam to a substrate, comprising: heating a portion of the porous foam that is intended to be in contact with the substrate to a temperature at or above the melting point temperature of the substrate; andbringing the heated portion of the porous foam and the substrate together so that a portion of the substrate is heated sufficiently to melt or soften enough to infuse into pores of the foam and a remaining portion of the substrate structure is unchanged; andwhile holding the heated portion of the porous foam and the substrate together, allowing the heated portion of the foam to cool below the melting point temperature so that the heated portion of the substrate material solidifies, thereby creating a mechanical bond between the substrate and the foam. 2. The method of claim 1, wherein the substrate is a metal substrate, a thermoset conductive plastic substrate, or a composite substrate. 3. The method of claim 1, wherein the foam is graphite foam, metal foam, or ceramic foam. 4. The method of claim 1, wherein the substrate is made of aluminum and the porous foam is graphite foam. 5. The method of claim 1, wherein the porous foam is heated in a furnace, heated locally in an in-situ type process, or resistively heated. 6. The method of claim 1, further comprising applying a material between the porous foam and the substrate prior to pressing. 7. The method of claim 1, further comprising modifying the porous foam to mold into the substrate when brought together, or modifying the porous foam and the substrate to have engaging lock and key structures. 8. The method of claim 1, comprising pressing the heated portion of the porous foam against the portion of the substrate.