Semiconductor device including power semiconductor element, branch line, and thermoelectric conversion element, and electrically powered vehicle
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-031/058
H02H-003/22
출원번호
US-0532120
(2008-03-12)
등록번호
US-8803275
(2014-08-12)
우선권정보
JP-2007-077471 (2007-03-23)
국제출원번호
PCT/JP2008/055025
(2008-03-12)
§371/§102 date
20090918
(20090918)
국제공개번호
WO2008/123083
(2008-10-16)
발명자
/ 주소
Yoshida, Tadafumi
Osada, Hiroshi
Yokoi, Yutaka
출원인 / 주소
Toyota Jidosha Kabushiki Kaisha
대리인 / 주소
Sughrue Mion, PLLC
인용정보
피인용 횟수 :
0인용 특허 :
9
초록▼
A Peltier element is provided so that an electrically conductive plate forming a heat absorbing portion is in close proximity to an insulating layer and an electrically conductive plate forming a heat radiating portion is provided in close proximity to an insulating layer. The Peltier element has on
A Peltier element is provided so that an electrically conductive plate forming a heat absorbing portion is in close proximity to an insulating layer and an electrically conductive plate forming a heat radiating portion is provided in close proximity to an insulating layer. The Peltier element has one end connected to a branch line branched from a power line, and has the other end electrically connected to an electrode plate. Further, the Peltier element receives from the branch line a portion of electric power supplied to a power transistor, and outputs it to the electrode plate. In other words, the Peltier element uses the portion of the electric power supplied to the power transistor, to absorb heat generated by the power transistor and radiate it toward a heat radiating plate.
대표청구항▼
1. A semiconductor device comprising: a power semiconductor element brought into an on state or an off state in accordance with a given command;a power line connected to said power semiconductor element;a branch line branched from the power line such that the branch line is electrically parallel to
1. A semiconductor device comprising: a power semiconductor element brought into an on state or an off state in accordance with a given command;a power line connected to said power semiconductor element;a branch line branched from the power line such that the branch line is electrically parallel to a part of the power line; anda thermoelectric conversion element electrically connected between a location where said branch line is connected to the power line and a terminal of said power semiconductor element to which said power line is connected, so as to cool said power semiconductor element using a portion of current supplied to said power semiconductor element. 2. The semiconductor device according to claim 1, further comprising a sealing material integrally sealing said power semiconductor element and said thermoelectric conversion element. 3. The semiconductor device according to claim 1, further comprising a thermally conductive electrode plate provided in close proximity to said power semiconductor element, wherein: said power line is electrically connected to said electrode plate, andsaid thermoelectric conversion element is provided in close proximity to said electrode plate with an insulating layer interposed therebetween and is electrically connected between said branch line and said electrode plate. 4. The semiconductor device according to claim 1, further comprising a diode provided at said branch line to prevent reverse current from flowing into said thermoelectric conversion element. 5. An electrically powered vehicle comprising: a power storage device;a driving device receiving electric power supplied from said power storage device; anda motor driven by said driving device to drive the vehicle,said driving device including a plurality of semiconductor devices for converting the electric power between said power storage device and said motor,each of said plurality of semiconductor devices including power semiconductor element brought into an on state or an off state in accordance with a given command,a power line connected to said power semiconductor element;a branch line branched from the power line such that the branch line is electrically parallel to a part of the power line, anda thermoelectric conversion element electrically connected between a location where said branch line is connected to the power line and a terminal of said power semiconductor element to which said power line is connected, so as to cool said power semiconductor element using a portion of current supplied to said power semiconductor element. 6. The electrically powered vehicle according to claim 5, wherein each of said plurality of semiconductor devices further includes a diode provided at said branch line to prevent regenerative current from flowing into said thermoelectric conversion element upon regenerative braking of the electrically powered vehicle. 7. The semiconductor device according to claim 1, further comprising a diode connected, in anti-parallel, to a circuit constituted by the power semiconductor element and the thermoelectric conversion element to prevent reverse current from flowing into said thermoelectric conversion element. 8. The electrically powered vehicle according to claim 5, wherein each of said plurality of semiconductor devices further includes a diode connected in anti-parallel, to a circuit constituted by the power semiconductor element and the thermoelectric conversion element to prevent reverse current from flowing into said thermoelectric conversion element. 9. The electrically powered vehicle according to claim 1, wherein said power semiconductor element constitutes an inverter.
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이 특허에 인용된 특허 (9)
Ishida Kenzo,JPX ; Inoue Shuji,JPX, Cooling unit for an integrated circuit package.
DeVilbiss Roger S. (Dallas TX) Quisenberry Tony M. (Highland Village TX) Powell Harry C. (Shipman VA), Current control circuit for improved power application and control of thermoelectric devices.
Lewis David A. (Carmel NY) Narayan Chandrasekhar (Hopewell Junction NY), Device to monitor and control the temperature of electronic chips to enhance reliability.
Schmidt William L. (Acton MA) Olson Richard E. (Rindge NH) Solley Dennis J. (Windham NH), Localized cooling apparatus for cooling integrated circuit devices.
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