Molded light guide for concentrated photovoltaic receiver module
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-031/042
G02B-005/10
G02B-005/09
출원번호
US-0830138
(2010-07-02)
등록번호
US-8809677
(2014-08-19)
발명자
/ 주소
Kuo, Bob Shih-Wei
출원인 / 주소
Amkor Technology, Inc.
대리인 / 주소
Jackson, Kevin B.
인용정보
피인용 횟수 :
1인용 특허 :
9
초록▼
In accordance with the present invention, there is provided multiple embodiments of a concentrated photovoltaic (CPV) module. In each embodiment of the present invention, the CPV module includes a light guide having a molded, cast or machined hollow funnel with a highly reflective internal surface f
In accordance with the present invention, there is provided multiple embodiments of a concentrated photovoltaic (CPV) module. In each embodiment of the present invention, the CPV module includes a light guide having a molded, cast or machined hollow funnel with a highly reflective internal surface for use in guiding focused solar rays to the active, front surface of the receiver die of the CPV module.
대표청구항▼
1. A CPV module, comprising: a substrate including a conductive pattern;a receiver die mounted to the substrate and electrically connected to the conductive pattern; anda light guide attached to the substrate and including a base portion that covers at least a portion of the substrate, wherein the b
1. A CPV module, comprising: a substrate including a conductive pattern;a receiver die mounted to the substrate and electrically connected to the conductive pattern; anda light guide attached to the substrate and including a base portion that covers at least a portion of the substrate, wherein the base portion includes a horizontal top wall disposed above the receiver die and a side wall extending from the top wall to the substrate, and a hollow funnel portion joining the horizontal top wall of the base portion disposed inward from the side wall and at an acute angle, wherein the horizontal top wall extends laterally outward with respect to a central axis of the hollow funnel portion and extends laterally outside of a widest dimension of the hollow funnel portion, and wherein the base portion and the hollow funnel portion are a single integrated structure comprising a molded reflective material, and wherein the hollow funnel portion is configured to focus solar rays onto the receiver die, and wherein the hollow funnel portion includes a first section that extends from the base portion and transitions to a second section that defines a distal rim, the first section having a quadrangular cross-sectional configuration and the second section having a circular cross-sectional configuration, and wherein the first section has increasing length and width dimensions from an opening in the horizontal top wall to the second section, and the second section has an increasing diameter from the first section to the distal rim. 2. The CPV module of claim 1, wherein the length and width dimensions of the first section where the first section meets the base portion are equal to the length and width dimensions of the receiver die. 3. The CPV module of claim 1 wherein the receiver die is electrically connected to the conductive pattern by bond wires which are at least partially shielded by the base portion of the light guide. 4. The CPV module of claim 1 wherein the receiver die is electrically connected to the conductive pattern by bond wires, and wherein the base portion physically contacts the bond wires. 5. The CPV module of claim 4, wherein the base portion defines an opening which is aligned with the receiver die, and the hollow funnel portion is in alignment with the opening. 6. The CPV module of claim 1 wherein a distal edge of the side wall is secured to a peripheral portion of the substrate. 7. The CPV module of claim 1 wherein the base portion is in physical contact with a peripheral portion of the receiver die. 8. The CPV module of claim 1 wherein the first and second sections collectively define an inner surface of the hollow funnel portion which is textured to spread reflected solar rays in a prescribed manner. 9. A CPV module, comprising: a substrate including a conductive pattern;a receiver die mounted to the substrate;a means for electrically connecting the receiver die to the conductive pattern; anda light guide attached to the substrate and including:a base portion that at least partially covers the substrate and the electrical connection means, wherein the base portion includes a horizontal top wall disposed above the receiver die and having an opening therein, a side wall extending from the top wall to the substrate, and a recessed portion defining a shoulder that adjoins the opening at the horizontal top wall and is spaced apart from the receiver die; anda hollow funnel portion abutting the shoulder and joining the top surface of the base portion disposed inward from the side wall and at an acute angle, wherein the horizontal top wall extends laterally outward with respect to a central axis of the hollow funnel portion and extends laterally outside of a widest dimension of the hollow funnel portion, and wherein the hollow funnel portion overlies the receiver die and is sized and configured to focus solar rays onto the receiver die, the hollow funnel portion including a first section that extends from the base portion, and transitions to a second section that defines a distal rim, the first section having a square cross-sectional configuration and the second section having a circular cross-sectional configuration, wherein the first section has increasing length and width dimensions from the base portion to the second section, and wherein the second section has an increasing diameter from the first section to the distal rim. 10. The CPV module of claim 9 wherein the base portion is in physical contact with the electrical connection means. 11. The CPV module of claim 9, wherein the base portion is in physical contact with a peripheral portion of the receiver die. 12. A CPV module, comprising: a substrate;a receiver die mounted to the substrate; anda light guide attached to the substrate and including:a base portion that covers portions of the substrate and contacts peripheral portions of the receiver die, wherein the base portion includes a horizontal top wall disposed above the receiver die, a side wall extending towards the substrate and an opening that overlies the receiver die; anda hollow funnel portion joining the top wall of the base portion disposed inward from the side wall and at an acute angle to a top surface of the horizontal top wall, and wherein the hollow funnel portion protrudes outward from the top wall and is sized and configured to focus solar rays onto the receiver die, and wherein the base portion and the hollow funnel portion are a single integrated structure comprising a molded reflective material, and wherein the horizontal top wall extends laterally outward with respect to a central axis of the hollow funnel portion and extends laterally outside of a widest dimension of the hollow funnel portion. 13. The CPV module of claim 12, wherein the base portion is in physical contact with a peripheral portion of the receiver die. 14. The CPV module of claim 12 further comprising a conductive connective structure electrically connecting the receiver die to the substrate. 15. The CPV module of claim 14, wherein the base portion is in physical contact with the conductive connective structure. 16. The CPV module of claim 12, wherein: the hollow funnel portion includes a first section that extends from the base portion and transitions to a second section that defines a distal rim, the first section having a quadrangular cross-sectional configuration and the second section having a circular cross-sectional configuration; andthe first section has increasing length and width dimensions from the opening to the second section, and the second section has an increasing diameter from the first section to the distal rim.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (9)
Edwards, Keith M.; Gillett, Blake A., Leadframe package for semiconductor devices.
Böttner, Harald; Schubert, Axel; Nurnus, Joachim; Künzel, Christa, Methods for producing a thermoelectric layer structure and components with a thermoelectric layer structure.
Kim Jin-Sung (Chungcheongbuk-do KRX) Huh Gi-Rok (Chungcheongbuk-do KRX), Process for manufacturing a resin molded image pick-up semiconductor chip having a window.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.