A coil-type electronic component has a coil inside or on the surface of its base material and is characterized in that: the base material is constituted by a group of grains of a soft magnetic alloy containing iron, silicon and other element that oxidizes more easily than iron; the surface of each s
A coil-type electronic component has a coil inside or on the surface of its base material and is characterized in that: the base material is constituted by a group of grains of a soft magnetic alloy containing iron, silicon and other element that oxidizes more easily than iron; the surface of each soft magnetic alloy grain has an oxide layer formed on its surface as a result of oxidization of the grain; this oxide layer contains the other element that oxidizes more easily than iron by a quantity larger than that in the soft magnetic alloy grain; and grains are bonded with one another via this oxide layer.
대표청구항▼
1. A method for manufacturing a coil-type electronic component having a coil provided in or around its base material, comprising: providing soft magnetic alloy grains having no oxide layer on their surfaces formed by oxidation greater than natural oxidation of the grains, said soft magnetic alloy gr
1. A method for manufacturing a coil-type electronic component having a coil provided in or around its base material, comprising: providing soft magnetic alloy grains having no oxide layer on their surfaces formed by oxidation greater than natural oxidation of the grains, said soft magnetic alloy grains containing iron, silicon and another element that oxidizes more easily than iron;pressing a mixture of binder and soft magnetic alloy grains to obtain a molded product;heat-treating the molded product in an oxidizing atmosphere containing oxygen to oxidize surfaces of the soft magnetic alloy grains so as to form an oxide layer on the surfaces of the soft magnetic alloy grains and bond the soft magnetic alloy grains with one another via the oxide layer, thereby obtaining a base material, wherein the oxide layer contains the other element that oxidizes more easily than iron in a quantity larger than that in the soft magnetic alloy grains; andproviding a coil in or around the base material and electrodes extending from the base material,wherein the oxide layer is a film covering the surface of the grains and has a partially discontinued portion on the surface. 2. The method according to claim 1, wherein the oxide layer on at least some of the soft magnetic alloy grains has a thickness of at least 50 nanometers. 3. The method according to claim 1, wherein the other element that oxidizes more easily than iron is chromium. 4. The method according to claim 1, wherein the other element that oxidizes more easily than iron is aluminum. 5. The method according to claim 1, wherein the heat treatment is conducted at a temperature of 600 to 800° C. 6. The method according to claim 1, wherein an average size of the soft magnetic grains based on arithmetic mean is 30 micrometers or less. 7. The method according to claim 1, wherein the heat treatment continues until the oxide layer includes in this order a first oxide layer where the content of the iron component decreases while the content of the element that oxidizes easily increases, and a second oxide layer where the content of the iron component increases and the content of the element that oxidizes easily decreases, as viewed outwardly from the alloy grain. 8. The method according to claim 7, wherein the first oxide layer, as viewed outwardly from the alloy grain, has an inflection point with respect to the content of the element that oxidizes easily. 9. The method according to claim 1, wherein the pressing step comprises forming the mixture of binder and soft magnetic alloy grains into sheets, forming coil conductive patterns on the sheets, and stacking the sheets on top of each other to obtain the molded product. 10. A method for manufacturing a coil-type electronic component having a coil provided in or around its base material, comprising: providing soft magnetic alloy grains having no oxide layer on their surfaces formed by oxidation greater than natural oxidation of the grains, said soft magnetic alloy grains containing iron, silicon and another element that oxidizes more easily than iron;pressing a mixture of binder and soft magnetic alloy grains to obtain a molded product;heat-treating the molded product in an oxidizing atmosphere containing oxygen to oxidize surfaces of the soft magnetic alloy grains so as to form an oxide layer on the surfaces of the soft magnetic alloy grains and bond the soft magnetic alloy grains with one another via the oxide layer, thereby obtaining a base material, wherein the oxide layer contains the other element that oxidizes more easily than iron in a quantity larger than that in the soft magnetic alloy grains; andproviding a coil in or around the base material and electrodes extending from the base material,wherein the oxide layer is constituted by a single phase wherein identical crystals are bonded continuously together, and the soft magnetic alloy grains are bonded by the heat treatment via the single phase oxide layer. 11. A method for manufacturing a coil-type electronic component having a coil provided in or around its base material, comprising: providing soft magnetic alloy grains having no oxide layer on their surfaces formed by oxidation greater than natural oxidation of the grains, said soft magnetic alloy grains containing iron, silicon and another element that oxidizes more easily than iron;pressing a mixture of binder and soft magnetic alloy grains to obtain a molded product;heat-treating the molded product in an oxidizing atmosphere containing oxygen to oxidize surfaces of the soft magnetic alloy grains so as to form an oxide layer on the surfaces of the soft magnetic alloy grains and bond the soft magnetic alloy grains with one another via the oxide layer, thereby obtaining a base material, wherein the oxide layer contains the other element that oxidizes more easily than iron in a quantity larger than that in the soft magnetic alloy grains; andproviding a coil in or around the base material and electrodes extending from the base material,wherein as the coil, a coil conductor is formed in the base material by forming conductive patterns and being sintered simultaneously with the base material.
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이 특허에 인용된 특허 (10)
Tomita Hiroshi (Kanagawa JPX) Inoue Tetsuo (Kanagawa JPX) Fuke Hiromi (Kanagawa JPX) Sato Toshiro (Kanagawa JPX) Mizoguchi Tetsuhiko (Kanagawa JPX), Amorphous magnetic thin film and plane magnetic element using same.
Inoue, Osamu; Kato, Junichi; Matsutani, Nobuya; Fujii, Hiroshi; Takahashi, Takeshi, Composite magnetic body, and magnetic element and method of manufacturing the same.
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