로그인시 본인확인과정이 필요할 수 있습니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
DataON 바로가기
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
Edison 바로가기
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
Kafe 바로가기
| 국가/구분 | United States(US) Patent 등록 |
|---|---|
| 국제특허분류(IPC7판) |
|
| 출원번호 | US-0637446 (2006-12-11) |
| 등록번호 | US-8814863 (2014-08-26) |
| 발명자 / 주소 |
|
| 출원인 / 주소 |
|
| 대리인 / 주소 |
|
| 인용정보 | 피인용 횟수 : 0 인용 특허 : 644 |
An electrosurgical device coated with powder coatings including a silicone resin and siloxane additive without fluoropolymers. In the powder coatings, the silicone resin is methyl phenyl silicone or phenyl silicone or methyl polysiloxane or phenyl alkyl polysiloxane resin and the additive is either
An electrosurgical device coated with powder coatings including a silicone resin and siloxane additive without fluoropolymers. In the powder coatings, the silicone resin is methyl phenyl silicone or phenyl silicone or methyl polysiloxane or phenyl alkyl polysiloxane resin and the additive is either methyl alkyl polysiloxane or dimethyl polysiloxane. This coating is applied to the surfaces of an electrosurgical device minimize the build-up of charred tissue on the surfaces of the electrosurgical device.
1. An electrosurgical electrode connectable to a handle, said electrosurgical electrode comprising: a conductive substrate including a surface; andat least one epoxy modified rigid silicone powder coating applied to at least a first portion of the surface of said substrate, said at least one epoxy m
1. An electrosurgical electrode connectable to a handle, said electrosurgical electrode comprising: a conductive substrate including a surface; andat least one epoxy modified rigid silicone powder coating applied to at least a first portion of the surface of said substrate, said at least one epoxy modified rigid silicone powder coating including a plurality of epoxy modified rigid silicone powder particles each having a size of no greater than one-hundred-fifty microns. 2. The electrosurgical electrode of claim 1, wherein each of the epoxy modified rigid silicone powder particles includes a rigid silicone resin and a polysiloxane additive. 3. The electrosurgical electrode of claim 2, wherein the silicone resin is selected from the group consisting of: a phenyl polysiloxane powder resin, a methyl polysiloxane powder resin, a methyl phenyl siloxane powder resin, a phenyl silicone powder, a methyl phenyl silicone, a methyl phenyl polysiloxane powder resin and a phenyl alkyl polysiloxane powder resin. 4. The electrosurgical electrode of claim 2, wherein the polysiloxane additive is selected from the group consisting of: a methyl alkyl polysiloxane, a dimethyl polysiloxane and a methyl phenyl siloxane. 5. The electrosurgical electrode of claim 1, wherein each of the epoxy modified rigid silicone powder particles includes a rigid silicone resin. 6. The electrosurgical electrode of claim 5, wherein the silicone resin is selected from the group consisting of: a phenyl polysiloxane powder resin, a methyl polysiloxane powder resin, a methyl phenyl siloxane powder resin, a phenyl silicone powder, a methyl phenyl silicone, a methyl phenyl polysiloxane powder resin and a phenyl alkyl polysiloxane powder resin. 7. The electrosurgical electrode of claim 1, wherein each of the epoxy modified rigid silicone powder particles includes a polysiloxane additive. 8. The electrosurgical electrode of claim 7, wherein the polysiloxane additive is selected from the group consisting of: a methyl alkyl polysiloxane, a dimethyl polysiloxane and a methyl phenyl siloxane. 9. The electrosurgical electrode of claim 1, wherein the conductive substrate includes a metal. 10. The electrosurgical electrode of claim 9, wherein the metal includes stainless steel. 11. The electrosurgical electrode of claim 1, which includes an electrically insulative material applied to at least a second portion of the surface of the conductive substrate. 12. The electrosurgical electrode of claim 11, wherein the second portion of the surface of the conductive substrate underneath the electrically insulative material includes the epoxy modified rigid silicone powder coating. 13. The electrosurgical electrode of claim 1, wherein a plurality of anti-microbial particles are interspersed in said epoxy modified rigid silicone powder coating. 14. The electrosurgical electrode of claim 13, wherein the anti-microbial particles include at least one of the group consisting of: silver particles and ceramic particles. 15. The electrosurgical electrode of claim 1, which includes a single substantially uniform layer of the epoxy modified rigid silicone powder particles applied to at least the first portion of the surface of the substrate. 16. The electrosurgical electrode of claim 1, wherein the plurality of the epoxy modified rigid silicone powder particles include a plurality of different sized epoxy modified rigid silicone powder particles. 17. The electrosurgical electrode of claim 1, which includes a top coat selected from the group consisting of: an abrasive resistant coating, a non-stick coating, an anti-microbial coating and an electrically conductive coating. 18. The electrosurgical electrode of claim 1, wherein at least part of the conductive substrate forms a shape selected from the group consisting of: a blade, a knife, a wire and a ball. 19. An electrosurgical electrode connectable to a handle, said electrosurgical electrode comprising: a conductive substrate including a surface; andat least one epoxy modified rigid silicone powder coating applied to at least a first portion of the surface of said substrate, wherein the epoxy modified rigid silicone powder coating includes: (i) at least one electrically conductive particle, and (ii) a plurality of epoxy modified rigid silicone powder particles each having a size of no greater than one-hundred-fifty microns. 20. An electrosurgical electrode connectable to a handle, said handle including at least one electrical transfer member configured to transfer electrical energy from an electrical source, said electrosurgical electrode comprising: a conductive substrate configured to receive said electrical energy; andat least one layer of epoxy modified rigid silicone powder applied to at least a first portion of a surface of the substrate, said epoxy modified rigid silicone powder including a plurality of epoxy modified rigid silicone powder particles each having a size of no greater than one-hundred-fifty microns. 21. The electrosurgical electrode of claim 20, wherein each of the epoxy modified rigid silicone powder particles includes a rigid silicone resin and a polysiloxane additive. 22. The electrosurgical electrode of claim 21, wherein the silicone resin is selected from the group consisting of: a phenyl polysiloxane powder resin, a methyl polysiloxane powder resin, a methyl phenyl siloxane powder resin, a phenyl silicone powder, a methyl phenyl silicone, a methyl phenyl polysiloxane powder resin and a phenyl alkyl polysiloxane powder resin. 23. The electrosurgical electrode of claim 21, wherein the polysiloxane additive is selected from the group consisting of: a methyl alkyl polysiloxane, a dimethyl polysiloxane and a methyl phenyl siloxane. 24. The electrosurgical electrode of claim 20, wherein each of the epoxy modified rigid silicone powder particles includes a rigid silicone resin. 25. The electrosurgical electrode of claim 24, wherein the silicone resin is selected from the group consisting of: a phenyl polysiloxane powder resin, a methyl polysiloxane powder resin, a methyl phenyl siloxane powder resin, a phenyl silicone powder, a methyl phenyl silicone, a methyl phenyl polysiloxane powder resin and a phenyl alkyl polysiloxane powder resin. 26. The electrosurgical electrode of claim 20, wherein each of the epoxy modified rigid silicone powder particles includes a polysiloxane additive. 27. The electrosurgical electrode of claim 26, wherein the polysiloxane additive is selected from the group consisting of: a methyl alkyl polysiloxane, a dimethyl polysiloxane and a methyl phenyl siloxane. 28. The electrosurgical electrode of claim 20, wherein the conductive substrate includes a metal. 29. The electrosurgical electrode of claim 28, wherein the metal includes stainless steel. 30. The electrosurgical electrode of claim 20, wherein the epoxy modified rigid silicone powder includes a plurality of anti-microbial particles. 31. The electrosurgical electrode of claim 30, wherein the anti-microbial particles include at least one of the group consisting of: silver particles and ceramic particles. 32. The electrosurgical electrode of claim 20, which includes an electrically insulative material applied to at least a second portion of the surface of the conductive substrate. 33. The electrosurgical electrode of claim 32, wherein the second portion of the surface of the conductive substrate underneath the electrically insulative material is coated with the epoxy modified rigid silicone powder. 34. The electrosurgical electrode of claim 20, which includes a single substantially uniform layer of the epoxy modified rigid silicone powder particles applied to at least the first portion of the surface of the substrate. 35. The electrosurgical electrode of claim 20, wherein the epoxy modified rigid silicone powder includes at least one electrically conductive pigment. 36. The electrosurgical electrode of claim 20, wherein the plurality of the epoxy modified rigid silicone powder particles include a plurality of different sized epoxy modified rigid silicone powder particles. 37. The electrosurgical electrode of claim 20, which includes a top coat selected from the group consisting of: an abrasive resistant coating, a non-stick coating, an anti-microbial coating and an electrically conductive coating. 38. The electrosurgical electrode of claim 20, wherein at least part of the conductive substrate forms a shape selected from the group consisting of: a blade, a knife, a wire and a ball. 39. The electrosurgical electrode of claim 20, wherein said conductive substrate includes a proximal end connectable to the handle. 40. A method of coating an electrosurgical electrode including a conductive substrate, said method comprising: (a) grounding the conductive substrate;(b) charging a plurality of epoxy modified rigid silicone powder particles;(c) electrostatically applying a coating of the charged epoxy modified rigid silicone powder particles to at least a first portion of a surface of the grounded conductive substrate; and(d) at least partially curing the applied coating of the epoxy modified rigid silicone powder particles. 41. The method of claim 40, which includes repeating (b) to (d) until a desired thickness is achieved. 42. The method of claim 40, wherein the epoxy modified rigid silicone powder coating includes a plurality of anti-microbial particles. 43. The method of claim 42, wherein the anti-microbial particles include at least one of the group consisting of: silver particles and ceramic particles. 44. The method of claim 40, which includes applying an electrically insulative material to at least a second portion of the surface of the conductive substrate. 45. The method of claim 44, which includes applying the epoxy modified rigid silicone powder coating to the second portion of the surface of the conductive substrate which is underneath the insulative material. 46. The method of claim 40, wherein the epoxy modified rigid silicone powder coating includes a rigid silicone resin and a polysiloxane additive. 47. The method of claim 46, wherein the silicone resin is selected from the group consisting of: a phenyl polysiloxane powder resin, a methyl polysiloxane powder resin, a methyl phenyl siloxane powder resin, a phenyl silicone powder, a methyl phenyl silicone, a methyl phenyl polysiloxane powder resin and a phenyl alkyl polysiloxane powder resin. 48. The method of claim 46, wherein the polysiloxane additive is selected from the group consisting of: a methyl alkyl polysiloxane, a dimethyl polysiloxane and a methyl phenyl siloxane. 49. The method of claim 40, wherein the epoxy modified rigid silicone powder coating includes a rigid silicone resin. 50. The method of claim 49, wherein the silicone resin is selected from the group consisting of: a phenyl polysiloxane powder resin, a methyl polysiloxane powder resin, a methyl phenyl siloxane powder resin, a phenyl silicone powder, a methyl phenyl silicone, a methyl phenyl polysiloxane powder resin and a phenyl alkyl polysiloxane powder resin. 51. The method of claim 40, wherein the epoxy modified rigid silicone powder coating includes a polysiloxane additive. 52. The method of claim 51, wherein the polysiloxane additive is selected from the group consisting of: a methyl alkyl polysiloxane, a dimethyl polysiloxane and a methyl phenyl siloxane. 53. The method of claim 40, wherein the epoxy modified rigid silicone powder coating includes a plurality of different sized epoxy modified rigid silicone powder particles. 54. The method of claim 40, which includes applying a top coat to the epoxy modified rigid silicone powder coating, said top coat selected from the group consisting of: an abrasive resistant coating, a non-stick coating, an anti-microbial coating and an electrically conductive coating. 55. A method of coating an electrosurgical electrode including a conductive substrate, said method comprising: (a) grounding the conductive substrate;(b) charging a plurality of epoxy modified rigid silicone powder particles, wherein the epoxy modified rigid silicone powder particles includes at least one electrically conductive particle;(c) electrostatically applying a coating of the charged epoxy modified rigid silicone powder particles to at least a first portion of a surface of the grounded conductive substrate; and(d) at least partially curing the applied coating of the epoxy modified rigid silicone powder particles.
Copyright KISTI. All Rights Reserved.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.