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An apparatus and method for controlling an application of power to power a plasma chamber. A detector detects actual power out from the power stage to the plasma chamber during a sampling interval. A compare module compares the actual power out during the sampling interval to a present power setting

An apparatus and method for controlling an application of power to power a plasma chamber. A detector detects actual power out from the power stage to the plasma chamber during a sampling interval. A compare module compares the actual power out during the sampling interval to a present power setting during the sampling interval and generates a compensation value. An adjust module updates the present power setting for the power stage with the compensation value to provide a new power setting for the power stage to control the power out from power stage to the plasma chamber during the deposition process whereby power losses occurring during the deposition process are compensated during the deposition process. If there is a fixed time period for the deposition process, the compensation method and apparatus may be used to compensate the deposition process for energy losses without extending the duration of the deposition process.

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1. A method for controlling a power supply configured to supply a power to a plasma chamber during a deposition process within the plasma chamber, comprising: acquiring a user power setting of the power supply, where the user power setting is a starting point for an internal power setting of the pow

1. A method for controlling a power supply configured to supply a power to a plasma chamber during a deposition process within the plasma chamber, comprising: acquiring a user power setting of the power supply, where the user power setting is a starting point for an internal power setting of the power supply;detecting at least one arc within the plasma chamber during the deposition process;reducing the internal power setting in response to the detecting;detecting a substantial absence of arcs within the plasma chamber after the reducing; andincreasing the internal power setting, in response to the detecting the substantial absence of arcs, such that an average power supplied to the plasma chamber during the deposition process is equal to an average power that would have been supplied to the plasma chamber had the internal power setting remained at the user power setting for a preset duration of the deposition process. 2. The method of claim 1, wherein the increasing includes: taking a difference in power between the average power supplied to the plasma chamber during a period spanning the start of the deposition process to a moment of the increasing, and the user power setting; andadjusting the internal power setting based on the difference. 3. The method of claim 1, wherein the internal power setting of the increasing has a fixed upper limit that is independent of the power supplied to the plasma chamber. 4. The method of claim 1, wherein reductions in power resulting from the reducing the internal power setting are compensated during the deposition process without extending a duration of the deposition process past the preset duration of the deposition process. 5. The method of claim 1 wherein the increasing further comprises: subtracting a time elapsed since the deposition process began from the preset duration of the deposition process to generate a remaining time value;subtracting energy delivered since the deposition process began from a total energy to be delivered to the plasma chamber during the preset duration of the deposition process to generate a remaining energy value; andmodifying the internal power setting to equal the remaining energy value divided by the remaining time value. 6. The method of claim 1 further comprising: detecting arcs in the plasma chamber;counting a number of arcs occurring during a sampling interval; andgenerating a compensation value from the number of arcs occurring during the sampling interval and an estimated average duration of one arc. 7. The method of claim 6 wherein the increasing further comprises: subtracting a time elapsed since the deposition process began from the preset duration of the deposition process to generate a remaining time value for the deposition process;subtracting energy delivered since the deposition process began from a total energy to be delivered to the plasma chamber during the preset duration of the deposition process to generate a remaining energy value;generating a compensation coefficient based on analyzing the compensation value, the remaining time value, and the remaining energy value; andmodifying the internal power setting based on at least the compensation coefficient. 8. The method of claim 7, wherein the modifying the internal power setting is based on the compensation coefficient and an accelerate scalar, the accelerate scalar selected so that the internal power setting is modified such that energy is delivered to the plasma chamber, equal to the remaining energy value, within a time equal to the remaining time value. 9. The method of claim 1, further comprising: determining a compensation coefficient as: 1+(ESET−EOUT)/ESET where ESET is the internal power setting and EOUT is the power applied to the plasma chamber; andmultiplying the internal power setting times the compensation coefficient. 10. The method of claim 1, wherein the increasing the internal power setting to a value greater than the user power setting. 11. A method for controlling a supply configured to supply an average power to a plasma chamber during a first and second interval of a deposition process within the plasma chamber, said method comprising: acquiring a user power setting of the power supply, where the user power setting is a starting point for an internal power setting of the power supply;setting the internal power setting of the power supply equal to the user power setting plus a first power adjustment at a start of a first interval of the deposition process;detecting at least one arc within the plasma chamber during the first interval of the deposition process;reducing the internal power setting in response to the first detecting during the first interval;detecting a first substantial absence of arcs within the plasma chamber after the first reducing;adjusting the internal power setting, in response to the second detecting of the first substantial absence of arcs, such that a first average power supplied to the plasma chamber during the first interval is equal to a first reference average power that would have been supplied to the plasma chamber had the internal power setting remained at the user power setting plus the first power adjustment for a preset duration of the first interval; thensetting the internal power setting of the power supply equal to the user power setting minus a second power adjustment at the start of a second interval of the deposition process;detecting at least one arc within the plasma chamber during the second interval of the deposition process;reducing the internal power setting in response to the third detecting during the second intervaldetecting a second substantial absence of arcs within the plasma chamber after the second reducing; andadjusting the internal power setting, in response to the fourth detecting of the second substantial absence of arcs, such that a second average power supplied to the plasma chamber over the combined first and second intervals is equal to a second reference average power that would have been supplied to the plasma chamber had the internal power setting remained at the user power setting for a preset duration of a sum of the first and second intervals.