A cleaning method of removing a vapor-deposition material adhering to equipments without exposure to the atmosphere is provided. A vapor-deposition material adhering to equipments (components of a film-forming apparatus) such as a substrate holder, a vapor-deposition mask, a mask holder, or an adhes
A cleaning method of removing a vapor-deposition material adhering to equipments without exposure to the atmosphere is provided. A vapor-deposition material adhering to equipments (components of a film-forming apparatus) such as a substrate holder, a vapor-deposition mask, a mask holder, or an adhesion preventing shield provided in a film-forming chamber are subjected to heat treatment. Because of this, the adhering vapor-deposition material is re-sublimated, and removed by exhaust through a vacuum pump. By including such a cleaning method in the steps of manufacturing an electro-optical device, the manufacturing steps are shortened, and an electro-optical device with high reliability can be realized.
대표청구항▼
1. A method of manufacturing a device, comprising the steps of: disposing a substrate in a film formation chamber, wherein an adhesion preventing shield is provided in the film formation chamber to surround the substrate;disposing a holder in the film formation chamber, the holder having a longitudi
1. A method of manufacturing a device, comprising the steps of: disposing a substrate in a film formation chamber, wherein an adhesion preventing shield is provided in the film formation chamber to surround the substrate;disposing a holder in the film formation chamber, the holder having a longitudinal direction, wherein a plurality of vapor-deposition sources are arranged along the longitudinal direction on the holder, and wherein each of the plurality of vapor-deposition sources has a plurality of first nozzles and a plurality of second nozzles surrounded by the plurality of first nozzles;forming an EL layer comprising an organic material including a host material and a guest material over the substrate by vapor-depositing the host material and the guest material by using the plurality of first nozzles and the plurality of second nozzles, respectively, wherein a relative position of the substrate with respect to the holder is changed in a direction orthogonal to the longitudinal direction during the formation of the EL layer;removing the substrate from the film formation chamber after the EL layer is formed;cleaning the adhesion preventing shield by removing the organic material deposited on the adhesion preventing shield in the film formation chamber after the substrate is removed; andexhausting the organic material from the film formation chamber during cleaning. 2. The method for manufacturing a device according to claim 1, wherein the organic material is removed by sublimating the organic material deposited on the adhesion preventing shield. 3. The method for manufacturing a device according to claim 1, wherein the organic material is removed by sublimating the organic material deposited on the adhesion preventing shield by heating. 4. The method according to claim 1, wherein the holder moves in the direction orthogonal to the longitudinal direction during the formation of the EL layer. 5. The method according to claim 1, wherein a plasma is formed in an exhaust treatment chamber during the exhausting of the sublimated organic material, andwherein the exhaust treatment chamber is connected with the film formation chamber. 6. The method according to claim 1, wherein the movement speed of the plurality of vapor-deposition sources are controlled by a control unit during the formation of the EL layer. 7. A method of manufacturing a device, comprising the steps of: disposing a substrate in a film formation chamber, wherein an adhesion preventing shield is provided in the film formation chamber to surround the substrate;disposing a holder in the film formation chamber, the holder having a longitudinal direction, wherein a plurality of vapor-deposition sources are arranged along the longitudinal direction on the holder, and wherein each of the plurality of vapor-deposition sources has a plurality of first nozzles and a plurality of second nozzles surrounded by the plurality of first nozzles;forming an EL layer comprising an organic material including a host material and a guest material over the substrate by vapor-depositing the host material and the guest material by using the plurality of first nozzles and the plurality of second nozzles, respectively, wherein a relative position of the substrate with respect to the holder is changed in a direction orthogonal to the longitudinal direction during the formation of the EL layer;removing the substrate from the film formation chamber after the EL layer is formed;cleaning the adhesion preventing shield by removing the organic material deposited on the adhesion preventing shield in the film formation chamber after the substrate is removed; andexhausting the organic material from the film formation chamber during cleaning,wherein an edge of the substrate is parallel with the longitudinal direction of the holder. 8. The method for manufacturing a device according to claim 7, wherein the organic material is removed by sublimating the organic material deposited on the adhesion preventing shield. 9. The method for manufacturing a device according to claim 7, wherein the organic material is removed by sublimating the organic material deposited on the adhesion preventing shield by heating. 10. The method according to claim 7, wherein the holder moves in the direction orthogonal to the longitudinal direction during the formation of the EL layer. 11. The method according to claim 7, wherein a plasma is formed in an exhaust treatment chamber during the exhausting of the sublimated organic material, andwherein the exhaust treatment chamber is connected with the film formation chamber. 12. A method of manufacturing a device, comprising the steps of: disposing a substrate in a film formation chamber, wherein an adhesion preventing shield is provided in the film formation chamber to surround the substrate;arranging a plurality of vapor-deposition sources along one direction in the film formation chamber, and wherein each of the plurality of vapor-deposition sources has a plurality of first nozzles with and a plurality of second nozzles surrounded by the plurality of first nozzles;forming an EL layer comprising an organic material including a host material and a guest material over the substrate by vapor-depositing the host material and the guest material by using the plurality of first nozzles and the plurality of second nozzles, respectively, wherein a relative position of the substrate with respect to the plurality of vapor-deposition sources is changed in a direction orthogonal to the one direction during the formation of the EL layer;removing the substrate from the film formation chamber after the EL layer is formed;cleaning the adhesion preventing shield by removing the organic material deposited on the adhesion preventing shield in the film formation chamber after the substrate is removed; andexhausting the organic material from the film formation chamber during cleaning. 13. The method for manufacturing a device according to claim 12, wherein the organic material is removed by sublimating the organic material deposited on the adhesion preventing shield. 14. The method for manufacturing a device according to claim 12, wherein the organic material is removed by sublimating the organic material deposited on the adhesion preventing shield by heating. 15. The method according to claim 12, wherein the plurality of vapor-deposition sources move in the direction orthogonal to the one direction during the formation of the EL layer. 16. The method according to claim 12, wherein a plasma is formed in an exhaust treatment chamber during the exhausting of the sublimated organic material, andwherein the exhaust treatment chamber is connected with the film formation chamber. 17. A method of manufacturing a device, comprising the steps of: disposing a substrate in a film formation chamber, wherein an adhesion preventing shield is provided in the film formation chamber to surround the substrate;arranging a plurality of vapor-deposition sources along one direction in the film formation chamber, and wherein each of the plurality of vapor-deposition sources has a plurality of first nozzles and a plurality of second nozzles surrounded by the plurality of first nozzles;forming an EL layer comprising an organic material including a host material and a guest material over the substrate by vapor-depositing the host material and the guest material by using the plurality of first nozzles and the plurality of second nozzles, respectively, wherein a relative position of the substrate with respect to the plurality of vapor-deposition sources is changed in a direction orthogonal to the one direction during the formation of the EL layer;removing the substrate from the film formation chamber after the EL layer is formed;cleaning the adhesion preventing shield by removing the organic material deposited on the adhesion preventing shield in the film formation chamber after the substrate is removed; andexhausting the organic material from the film formation chamber during cleaning,wherein an edge of the substrate is parallel with the one direction. 18. The method for manufacturing a device according to claim 17, wherein the organic material is removed by sublimating the organic material deposited on the adhesion preventing shield. 19. The method for manufacturing a device according to claim 17, wherein the organic material is removed by sublimating the organic material deposited on the adhesion preventing shield by heating. 20. The method according to claim 17, wherein the plurality of vapor-deposition sources move in the direction orthogonal to the one direction during the formation of the EL layer. 21. The method according to claim 17, wherein a plasma is formed in an exhaust treatment chamber during the exhausting of the sublimated organic material, andwherein the exhaust treatment chamber is connected with the film formation chamber.
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