IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0523435
(2012-06-14)
|
등록번호 |
US-8816336
(2014-08-26)
|
우선권정보 |
JP-2011-133957 (2011-06-16) |
발명자
/ 주소 |
|
출원인 / 주소 |
- Semiconductor Energy Laboratory Co., Ltd.
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
3 인용 특허 :
22 |
초록
▼
A highly productive method for sealing substrates with the use of glass frit is provided. A method for sealing substrates with the use of glass frit, which can be used for a substrate provided with a material having low heat resistance, is provided. A highly airtight sealed body which is manufacture
A highly productive method for sealing substrates with the use of glass frit is provided. A method for sealing substrates with the use of glass frit, which can be used for a substrate provided with a material having low heat resistance, is provided. A highly airtight sealed body which is manufactured by such a method is provided. A light-emitting device having high productivity and high reliability and a manufacturing method thereof are provided. A heat generation layer containing a conductive material which generates heat by induction heating is formed to overlap with a region where a paste including a frit material and a binder is applied. Alternatively, a conductive material which generates heat by induction heating is added to the paste itself. The paste is locally heated by induction heating to remove the binder included in the paste.
대표청구항
▼
1. A method for manufacturing a sealed body, comprising the steps of: forming a heat generation layer over a first substrate;forming a frit paste comprising a frit material and a binder over the heat generation layer;heating the heat generation layer by induction heating to remove the binder and to
1. A method for manufacturing a sealed body, comprising the steps of: forming a heat generation layer over a first substrate;forming a frit paste comprising a frit material and a binder over the heat generation layer;heating the heat generation layer by induction heating to remove the binder and to fuse the frit material so that a glass frit is formed;arranging the first substrate and a second substrate to interpose the glass frit therebetween; andirradiating the glass frit with laser light to bond the glass frit to the second substrate. 2. The method for manufacturing a sealed body, according to claim 1, wherein a closed space surrounded by the first substrate, the second substrate, the glass frit, and the heat generation layer is formed. 3. The method for manufacturing a sealed body, according to claim 1, further comprising the step of forming a light-emitting unit comprising an EL element over a surface of the second substrate between the step of heating the heat generation layer and the step of arranging the first substrate and the second substrate. 4. The method for manufacturing a sealed body, according to claim 1, further comprising the step of forming a color filter over the first substrate between the step of forming the heat generation layer and the step of forming the frit paste. 5. The method for manufacturing a sealed body, according to claim 1, wherein the heat generation layer has a shape of a closed curve. 6. The method for manufacturing a sealed body, according to claim 1, wherein the heat generation layer comprises any one of iron, tungsten, and molybdenum. 7. The method for manufacturing a sealed body, according to claim 1, wherein the frit material comprises one or more compounds selected from magnesium oxide, calcium oxide, barium oxide, lithium oxide, sodium oxide, potassium oxide, boron oxide, vanadium oxide, zinc oxide, tellurium oxide, aluminum oxide, silicon dioxide, lead oxide, tin oxide, phosphorus oxide, ruthenium oxide, rhodium oxide, iron oxide, copper oxide, titanium oxide, tungsten oxide, bismuth oxide, and antimony oxide. 8. A method for manufacturing a sealed body, comprising the steps of: forming a frit paste comprising a frit material, a binder, and a conductive material over a first substrate;heating the fit paste by induction heating to remove the binder and to fuse the fit material so that a glass fit is formed;arranging the first substrate and a second substrate to interpose the glass frit therebetween; andirradiating the glass frit with laser light to bond the glass frit to the second substrate. 9. The method for manufacturing a sealed body, according to claim 8, wherein a closed space surrounded by the first substrate, the second substrate, and the glass frit is formed. 10. The method for manufacturing a sealed body, according to claim 8, further comprising the step of forming a light-emitting unit comprising an EL element over a surface of the second substrate between the step of heating the frit paste and the step of arranging the first substrate and the second substrate. 11. The method for manufacturing a sealed body, according to claim 8, further comprising the step of forming a color filter over the first substrate before the step of forming the frit paste. 12. The method for manufacturing a sealed body, according to claim 8, wherein the conductive material comprises any one of iron, tungsten, and molybdenum. 13. The method for manufacturing a sealed body, according to claim 8, wherein the conductive material is a powder material. 14. The method for manufacturing a sealed body, according to claim 13, wherein a diameter of the powder material is larger than or equal to 1 nm and smaller than or equal to 100 μm. 15. The method for manufacturing a sealed body, according to claim 8, wherein the frit material comprises one or more compounds selected from magnesium oxide, calcium oxide, barium oxide, lithium oxide, sodium oxide, potassium oxide, boron oxide, vanadium oxide, zinc oxide, tellurium oxide, aluminum oxide, silicon dioxide, lead oxide, tin oxide, phosphorus oxide, ruthenium oxide, rhodium oxide, iron oxide, copper oxide, titanium oxide, tungsten oxide, bismuth oxide, and antimony oxide. 16. A method for manufacturing a light-emitting device, comprising the steps of: forming a heat generation layer over a first substrate;forming a frit paste comprising a frit material and a binder over the heat generation layer;heating the heat generation layer by induction heating to remove the binder and to fuse the frit material so that a glass frit is formed;forming a sealant over the first substrate;arranging the first substrate and a second substrate to interpose the glass frit and the sealant therebetween; andirradiating the glass frit with laser light to bond the glass frit to the second substrate. 17. The method for manufacturing a light-emitting device, according to claim 16, wherein a closed space surrounded by the first substrate, the second substrate, the glass frit, and the heat generation layer is formed. 18. The method for manufacturing a light-emitting device, according to claim 16, further comprising the step of forming a light-emitting unit comprising an EL element over a surface of the second substrate between the step of heating the heat generation layer and the step of arranging the first substrate and the second substrate. 19. The method for manufacturing a light-emitting device, according to claim 16, further comprising the step of forming a color filter over the first substrate between the step of forming the heat generation layer and the step of forming the frit paste. 20. The method for manufacturing a light-emitting device, according to claim 16, wherein the heat generation layer has a shape of a closed curve. 21. The method for manufacturing a light-emitting device, according to claim 16, wherein the heat generation layer comprises any one of iron, tungsten, and molybdenum. 22. The method for manufacturing a light-emitting device, according to claim 16, wherein the second substrate is provided with a light-emitting unit.
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