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Substrate processing apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/677
  • H01L-021/67
출원번호 US-0764373 (2013-02-11)
등록번호 US-8827617 (2014-09-09)
발명자 / 주소
  • Hofmeister, Christopher
  • Caveney, Robert T.
출원인 / 주소
  • Brooks Automation Inc.
대리인 / 주소
    Perman & Green, LLP
인용정보 피인용 횟수 : 3  인용 특허 : 108

초록

A substrate processing apparatus including a transport chamber having an end and defining more than one substantially linear substrate transport zone where each transport zone extends longitudinally along the transport chamber between opposing walls of the transport chamber and at least one of the m

대표청구항

1. A substrate processing apparatus comprising: a first end configured for loading a substrate into the substrate processing apparatus;an apparatus module, connected to the first end to allow the substrate to be moved between the first end and the apparatus module, the apparatus module including a t

이 특허에 인용된 특허 (108)

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이 특허를 인용한 특허 (3)

  1. Fukasawa, Takayuki; Moon, Yeon-Keon; Sohn, Sang-woo; Kishimoto, Katsushi; Shin, Sang-Won, Apparatus for transferring substrate.
  2. Stone, Kevin, Rotatable snowplow blade apparatus, systems and methods of using the same.
  3. Hosek, Martin, Wafer transport system.
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