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Crosstalk reduction 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-013/648
  • H01R-013/6471
  • H01R-013/6587
출원번호 US-0561522 (2012-07-30)
등록번호 US-8827746 (2014-09-09)
발명자 / 주소
  • Lemke, Timothy A.
  • Byer, Charles C.
출원인 / 주소
  • Z-Plane, Inc.
대리인 / 주소
    Thompson Hine LLP
인용정보 피인용 횟수 : 0  인용 특허 : 40

초록

An apparatus includes a backplane having a ground plane. Conductor through holes extend through the backplane in rows and columns for conductors to project through the backplane in orthogonal arrays. Each row and column of the conductor through holes includes ground holes, each of which is sized to

대표청구항

1. An apparatus comprising: a backplane having a ground plane and conductor through holes arranged in rows and columns for conductors to project through the backplane in orthogonal arrays;each row and column of conductor through holes including ground holes, each of which is sized to receive only a

이 특허에 인용된 특허 (40)

  1. Ishibashi Kenichi,JPX ; Hayashi Takehisa,JPX ; Goto Tsutomu,JPX ; Yamagiwa Akira,JPX ; Watanabe Tsuyoshi,JPX, Apparatus for interconnecting logic boards.
  2. Wagener Hans (Rittershuser Str. 14 6344 Dietzhlztal-Rittershausen DEX), Assembly kit for a busbar system.
  3. Gallagher Brian ; Markovich Nikolai, Backplane having strip transmission line ethernet bus.
  4. Gallagher Brian ; Markovich Nikolai, Backplane having strip transmission line ethernet bus.
  5. Goergen,Joel R., Backplane with power plane having a digital ground structure in signal regions.
  6. Goergen,Joel R., Backplane with power plane having a digital ground structure in signal regions.
  7. Swengel ; Sr. Robert Charles (York PA) Lemke Timothy Allen (Mechanicsburg PA) Villiard Frederick Phillip (Mechanicsburg PA), Bonded wire interconnection system.
  8. Steele Douglas S. (West Chester OH), Cable assembly for an electrical signal transmission system.
  9. Le Bao G. (Orange CA), Computer system backplane having ground tabs for interconnecting the backplane ground to the computer system chassis.
  10. Preputnick George ; Fedder James Lee ; Mickievicz Scott Keith ; Whyne Richard Nicholas, Connector assembly with shielded modules and method of making same.
  11. Perino Donald ; Nguyen David, Connector with staggered contact design.
  12. Takami Masayuki (Yamato JPX) Atsumi Takehiko (Ichikawa JPX), Digital signal time-division multiplex apparatus.
  13. Strange Andrew, Elastomeric shielded connector.
  14. Volstorf, James R., Electrical connection system for two printed circuit boards mounted on opposite sides of a mid-plane printed circuit board at angles to each other.
  15. Yu Jen Kuo TW, Electrical connector adapter assembly.
  16. Glover, Douglas W.; Helster, David W.; Minnick, Timothy R.; Morgan, Chad W.; Wickes, Evan C., Electrical connector system.
  17. Rothermel, Brent Ryan; Morgan, Chad William, Electrical connector with crosstalk canceling features.
  18. Ward Bobby G. (King NC), Electrical connector with printed circuit board programmable filter.
  19. Hutson Maurice Leron ; Kuchta Douglas Allan ; Severson Paul Steven, Electronic circuit card having transient-tolerant distribution planes.
  20. Koga,Tsutomu; Inoue,Mitsuru; Minowa,Nobuyuki, Fitting substrate for connection and fitting substrate for connection for use in disk array control apparatus.
  21. Hart Frank P. ; Nagaraj Raviprakash ; Turner Leonard O. ; Spurrell Arthur L., High speed bus contact system.
  22. Dola Frank P. (Hudson FL) Lauterbach John H. (Hudson FL), High speed modular connector for printed circuit boards.
  23. Goergen, Joel R., High-speed electrical router backplane with noise-isolated power distribution.
  24. Lemke, Timothy A., Interconnection assembly for printed circuit boards.
  25. Lemke, Timothy A., Interconnection assembly for printed circuit boards.
  26. Lemke, Timothy A.; Byer, Charles C., Interconnection assembly for printed circuit boards.
  27. Morlion, Danny L. C.; Sercu, Stefaan; Heyvaert, Winnie; DeGeest, Jan, Matched-impedance connector footprints.
  28. AbuGhazaleh,Shadi A.; Baxter,Robert C.; Mahmood,Rehan; Miller,Alan C.; O'Connor,Michael R., Midspan patch panel with compensation circuit for data terminal equipment, power insertion and data collection.
  29. Stark William H. (West St. Paul MN), Mother-board interconnection system.
  30. Mullen Urban E. (4014 Cody Rd. Sherman Oaks CA 91403), Multi-layered printed circuit board with transmission line capabilities.
  31. Hehl, Karl, Multi-pin plug connection system for electronic control unit.
  32. Siwinski Paul P. (Seminole FL), Multiconductor flat cable connector, apparatus and method.
  33. Brandt, David D.; Wielebski, Wayne H.; Gollhardt, Neil, On-machine backplane mounted modular power and data distribution system.
  34. Clark, Gordon P.; Coffey, Joseph; Mattson, Loren J., Patch panel module and chassis.
  35. Coffey,Joseph C.; Schmidt,John D., Patch panel with modules.
  36. Bibee,Matthew L., Printed circuit board and method of reducing crosstalk in a printed circuit board.
  37. Bibee,Matthew L., Printed circuit board and method of reducing crosstalk in a printed circuit board.
  38. Keeth Brent (Penn Valley CA) Deering Michael (Oroville CA) Bryars Ray (Nevada City CA) VanDusen Charles (Cedar Ridge CA), Printed circuit board assembly.
  39. Gottlieb,Gary, Printed circuit board with void between pins.
  40. Wang,William; Cheng,Hengju; Lo,WeiZen, Transponder assembly for use with parallel optics modules in fiber optic communications systems.
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