초록 ▼

A layer system that can be annealed comprises a transparent substrate, preferably a glass substrate, and a first layer sequence which is applied directly to the substrate or to one or more bottom layers that are deposited onto the substrate. The layer sequence includes a substrate-proximal blocking

A layer system that can be annealed comprises a transparent substrate, preferably a glass substrate, and a first layer sequence which is applied directly to the substrate or to one or more bottom layers that are deposited onto the substrate. The layer sequence includes a substrate-proximal blocking layer, a selective layer and a substrate-distal blocking layer. Also provided is a method for producing a layer system that can be annealed and has a sufficient quality even under critical climatic conditions and/or undefined conditions of the substrate. During the heat treatment (annealing, bending), the color location of the layer system is maintained substantially stable and the color location can be widely varied at a low emissivity of the layer system. For this purpose, a first dielectric intermediate layer is interposed between the substrate-proximal blocking layer and the selective layer and is configured as a substoichiometric gradient layer.

대표청구항 ▼

1. Method for producing an annealable layer system wherein said method comprises: depositing a first layer sequence comprising a substrate-proximal blocking layer comprising NiCrOx, a first selective layer and a substrate-distal blocking layer comprising NiCrOx, either directly on a transparent subs

1. Method for producing an annealable layer system wherein said method comprises: depositing a first layer sequence comprising a substrate-proximal blocking layer comprising NiCrOx, a first selective layer and a substrate-distal blocking layer comprising NiCrOx, either directly on a transparent substrate or on one or more bottom layers which are deposited on the substrate, wherein said depositing of said first layer sequence comprises:depositing a substrate-proximal blocking layer comprising NiCrOx directly on said substrate or on one or more bottom layers which are deposited on the substrate,depositing a first dielectric intermediate layer of ZnAlOx a gradient layer with a gradient that passes from a stoichiometric part of ZnAlO to a substoichiometric part of ZnAlOx and where the gradient points in a direction of the first selective layer, such that the substoichiometric part of the gradient layer lies on a side of the first selective layer,depositing a first selective layer on said first dielectric intermediate layer; anddepositing a substrate-distal blocking layer comprising NiCrOx on said first selective layer. 2. Method according to claim 1, wherein the layer deposition of the gradient layer is stabilized by active process control, including photoemission monitoring (PEM), reactive gas partial pressure regulation, or lambda probe methods. 3. Method according to claim 1, wherein the deposition of the gradient layer is done by physical vacuum deposition (PVD) of at least two targets on two magnetron cathodes, each with a same target material, within a coating compartment or within a recipient under a suitable coating atmosphere, in so doing the substrate is moved relative to a coating source, and parameters of power supply of the magnetron cathodes differ from one another in such a manner that the coating is done by the two magnetron cathodes, each carrying a target, wherein a first partial layer is deposited by the first target, in a transitional area between the first and the second target a mixed layer is deposited, and simultaneously a second partial layer is deposited by the second target, and power regulation for each magnetron cathode is done independently. 4. Method according to claim 3, wherein shieldings between the targets and the substrate are provided by two separate screens with screen openings set independently of one another. 5. Method according to 1, wherein depositing of the gradient layer is done in two partial compartments formed by subdividing a compartment, each partial compartment comprising a magnetron cathode equipped with a target. 6. Method according to claim 5, wherein process gas supplies for each magnetron cathode are operated independently of one another. 7. Method according to claim 3, wherein an additional inert or reactive gas is supplied to at least one magnetron cathode independently of process gas supply. 8. Method according to claim 3, wherein distances between the targets and the substrate are set independently of one another. 9. Method according to claim 1, wherein the transparent substrate comprises a glass substrate. 10. Method according to claim 3, wherein energy supply of the magnetron cathodes is provided by an asymmetrically pulsed, bipolar power supply and pulsings of the magnetron cathodes are varied independently of one another.