Jacketed LED assemblies and light strings containing same
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F21V-003/00
F21V-005/00
H05B-033/08
F21V-015/01
F21V-031/04
F21S-004/00
F21W-121/00
H01L-033/58
F21V-019/00
F21W-121/04
F21Y-101/02
출원번호
US-0490140
(2012-06-06)
등록번호
US-8840279
(2014-09-23)
발명자
/ 주소
Allen, David
Allen, Mark R.
출원인 / 주소
Fiber Optic Designs, Inc.
대리인 / 주소
Berenato & White, LLC
인용정보
피인용 횟수 :
1인용 특허 :
133
초록▼
A jacketed light emitting diode assembly is provided, which includes a light emitting diode including a set of positive and negative contacts, and a lens body containing a semiconductor chip and end portions of the contacts. An electrical wire set of first and second electrical wires are connected t
A jacketed light emitting diode assembly is provided, which includes a light emitting diode including a set of positive and negative contacts, and a lens body containing a semiconductor chip and end portions of the contacts. An electrical wire set of first and second electrical wires are connected to the positive contact and the negative contact, respectively. A light transmissive cover receives the lens body, and has an opening through which at least one of the contact set and the electrical wire set passes. An integrally molded plastic jacket at the opening of the light transmissive cover provides a seal at the opening against moisture and airborne contaminants. A waterproof light string including one or more of the jacketed light emitting diode assemblies is also provided, as are related methods.
대표청구항▼
1. A jacketed light emitting diode assembly, comprising: a light emitting diode comprising a contact set comprising a positive contact and a negative contact, the positive and negative contacts each having a first end portion and a second end portion; anda lens body containing a semiconductor chip a
1. A jacketed light emitting diode assembly, comprising: a light emitting diode comprising a contact set comprising a positive contact and a negative contact, the positive and negative contacts each having a first end portion and a second end portion; anda lens body containing a semiconductor chip and the first end portions of the positive and negative contacts;an electrical wire set comprising a first electrical wire and a second electrical wire electrically connected to the second end portions of the positive contact and the negative contact, respectively;a light transmissive cover having a cavity with an opening, the cavity receiving the lens body, the opening having at least one of the contact set and the electrical wire set passing therethrough; andan integrally molded plastic jacket molded directly onto the contact set, the lens body, and electrical connections between the second end portions and the first and second electrical wires. 2. A jacketed light emitting diode assembly according to claim 1, wherein the integrally molded plastic jacket encases the electrical connections to provide a seal against moisture and airborne contaminants. 3. A jacketed light emitting diode assembly according to claim 1, wherein the electrical wire set passes through the opening, and wherein the integrally molded plastic jacket encases respective regions of the electrical wire set passing through the opening. 4. A jacketed light emitting diode assembly according to claim 1, wherein the contact set passes through the opening, and wherein the integrally molded plastic jacket encases the electrical connections between the contact set and the electrical wire set. 5. A jacketed light emitting diode assembly according to claim 1, wherein the integrally molded plastic jacket comprises at least one member selected from the group consisting of polycarbonate, polystyrene, and other moldable plastic material. 6. A jacketed light emitting diode assembly according to claim 1, wherein the integrally molded plastic jacket comprises poly(vinyl chloride). 7. A jacketed light emitting diode assembly according to claim 1, wherein the integrally molded plastic jacket comprises polypropylene. 8. A jacketed light emitting diode assembly according to claim 1, wherein the integrally molded plastic jacket is molded onto and at least partially encases the light transmissive cover. 9. A jacketed light emitting diode assembly of claim 1, wherein the integrally molded plastic jacket is directly molded onto a portion of the electrical wire set. 10. A jacketed light emitting diode assembly, comprising: a light emitting diode comprising a contact set comprising a positive contact and a negative contact, the positive and negative contacts each having a first end portion and a second end portion; anda lens body containing a semiconductor chip and the first end portions of the positive and negative contacts;an electrical wire set comprising a first electrical wire and a second electrical wire electrically connected to the second end portions of the positive contact and the negative contact, respectively; andan integrally molded plastic jacket molded directly onto the contact set, the lens body, and electrical connections between the second end portions and the first and second electrical wires. 11. A jacketed light emitting diode assembly according to claim 10, wherein the integrally molded plastic jacket encases the electrical connections to provide a seal against moisture and airborne contaminants. 12. A jacketed light emitting diode assembly according to claim 10, wherein the integrally molded plastic jacket comprises polycarbonate. 13. A jacketed light emitting diode assembly according to claim 10, wherein the integrally molded plastic jacket comprises poly(vinyl chloride). 14. A jacketed light emitting diode assembly according to claim 10, wherein the integrally molded plastic jacket comprises polypropylene. 15. A jacketed light emitting diode assembly according to claim 10, wherein the integrally molded plastic jacket is molded directly onto a portion of the first and second electrical wires. 16. A jacketed light emitting diode assembly, comprising: a light emitting diode comprising a contact set comprising a positive contact and a negative contact, the positive and negative contacts each having a first end portion and a second end portion; anda lens body containing a semiconductor chip and the first end portions of the positive and negative contacts;an electrical wire set comprising a first electrical wire and a second electrical wire electrically connected to the second end portions of the positive contact and the negative contact, respectively; andan integrally molded thermoplastic jacket injection molded directly onto the contact set, the lens body, and electrical connections between the second end portions and the first and second electrical wires. 17. A jacketed light emitting diode assembly according to claim 16, wherein the integrally molded thermoplastic jacket encases the electrical connections to provide a seal against moisture and airborne contaminants. 18. A jacketed light emitting diode assembly according to claim 16, wherein the integrally molded plastic jacket is injection molded directly onto a portion of the first and second electrical wires. 19. A jacketed light emitting diode assembly according to claim 16, further comprising a light transmissive cover having a cavity receiving the lens body. 20. A jacketed light emitting diode assembly of claim 19, wherein the integrally molded thermoplastic jacket is injection molded directly onto at least a portion of the light transmissive cover.
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