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Bonding an optical element to a light emitting device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
  • H05B-033/08
  • H01L-033/58
  • H01L-025/075
출원번호 US-0936850 (2013-07-08)
등록번호 US-8846423 (2014-09-30)
발명자 / 주소
  • Camras, Michael D.
  • Imler, William R.
  • Wall, Jr., Franklin J.
  • Steranka, Frank M.
  • Krames, Michael R.
  • Ticha, Helena
  • Tichy, Ladislav
  • Alferink, Robertus G.
출원인 / 주소
  • Philips Lumileds Lighting Company LLC
인용정보 피인용 횟수 : 2  인용 특허 : 79

초록

A device is provided with at least one light emitting device (LED) die mounted on a submount with an optical element subsequently thermally bonded to the LED die. The LED die is electrically coupled to the submount through contact bumps that have a higher temperature melting point than is used to th

대표청구항

1. A method comprising: providing at least one phosphor converted light emitting device that produces light with a broad spectrum;providing a plurality of color light emitting devices, each of which produces light with a narrow spectrum;mixing the light produced by the at least one phosphor converte

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이 특허를 인용한 특허 (2)

  1. Yoshida, Norio; Uemi, Hirotaka, Method and apparatus for fabricating light emitting apparatus.
  2. Baumgartner, Alexander; Richter, Markus; Gallmeier, Hans-Christoph; Albrecht, Tony, Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component.
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