IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0407798
(2012-02-29)
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등록번호 |
US-8847137
(2014-09-30)
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발명자
/ 주소 |
|
출원인 / 주소 |
|
대리인 / 주소 |
Bereskin & Parr LLP/S.E.N.C.R.L., s.r.l.
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인용정보 |
피인용 횟수 :
2 인용 특허 :
2 |
초록
▼
Apparatus and methods of manufacturing an image sensor and inertial navigation sensors encapsulated within a single package. The single package may encapsulate one integrated circuit die comprising the imaging sensor and the inertial navigation sensors. Alternatively, the single package may encapsul
Apparatus and methods of manufacturing an image sensor and inertial navigation sensors encapsulated within a single package. The single package may encapsulate one integrated circuit die comprising the imaging sensor and the inertial navigation sensors. Alternatively, the single package may encapsulate a plurality of integrated circuit dice comprising the imaging sensor and the inertial navigation sensors.
대표청구항
▼
1. A mobile device comprising: a sensor apparatus for use in the mobile device, the sensor apparatus comprising:an image sensor;at least one navigation sensor, the at least one navigation sensor comprising at least a magnetometer; andan integrated circuit package, wherein the integrated circuit pack
1. A mobile device comprising: a sensor apparatus for use in the mobile device, the sensor apparatus comprising:an image sensor;at least one navigation sensor, the at least one navigation sensor comprising at least a magnetometer; andan integrated circuit package, wherein the integrated circuit package encapsulates the image sensor and the at least one navigation sensor; anda memory, the memory storing a translation table, wherein the translation table comprises a mapping of output value axes between the image sensor, the at least one navigation sensor and the mobile device. 2. The mobile device of claim 1, wherein the image sensor is fabricated on a first integrated circuit die. 3. The mobile device of claim 2, wherein the first integrated circuit die is attached to the integrated circuit package. 4. The mobile device of claim 2, wherein the at least one navigation sensor is fabricated on the first integrated circuit die. 5. The mobile device of claim 2, wherein the at least one navigation sensor is fabricated on at least one additional integrated circuit die that is separate from the first integrated circuit die. 6. The mobile device of claim 5, wherein the at least one additional integrated circuit die is stacked with the first integrated circuit die. 7. The mobile device of claim 1, wherein the at least one navigation sensor comprises two or more navigation sensors. 8. The mobile device of claim 1, wherein the at least one navigation sensor comprises at least one additional sensor selected from the group consisting of: a gyroscope, an accelerometer, and an altimeter. 9. A method of manufacturing a sensor apparatus for use in a mobile device, the method comprising: fabricating an image sensor;fabricating at least one navigation sensor, the at least one navigation sensor comprising at least a magnetometer;encapsulating the image sensor and the at least one navigation sensor in an integrated circuit package; andcomputing a translation table wherein the translation table comprises a mapping of output value axes between the image sensor the at least one navigation sensor and the mobile device. 10. The method of claim 9, wherein the image sensor is fabricated on a first integrated circuit die. 11. The method of claim 10, further comprising attaching the first integrated circuit die to the integrated circuit package. 12. The method of claim 10, wherein the at least one navigation sensor is fabricated on the first integrated circuit die. 13. The method of claim 10, wherein the at least one navigation sensor is fabricated on at least one additional integrated circuit die that is separate from the first integrated circuit die. 14. The method of claim 13, wherein the at least one additional integrated circuit die is stacked with the first integrated circuit die. 15. The method of claim 9, wherein the at least one navigation sensor comprises two or more navigation sensors. 16. The method of claim 9, wherein the at least one navigation sensor comprises at least one additional sensor selected from the group consisting of: a gyroscope, an accelerometer, and an altimeter. 17. Use of a sensor apparatus in a mobile device to provide output data to an augmented reality application executed by a processor of the mobile device, the sensor apparatus comprising: an image sensor;at least one navigation sensor; andan integrated circuit package, wherein the integrated circuit package encapsulates the image sensor and the at least one navigation sensor, wherein the mobile device comprises a memory storing a translation table, wherein the translation table comprises a mapping of output value axes between the image sensor, the at least one navigation sensor and the mobile device. 18. The use of claim 17, wherein the image sensor and the at least one navigation sensor provide the output data. 19. The use of claim 17, wherein the at least one navigation sensor comprises at least one additional sensor selected from the group consisting of: a gyroscope, an accelerometer, a magnetometer and an altimeter.
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