초록 ▼

Aspects of the invention support simultaneous operation of a cooling side and a heating side of an apparatus to change the temperatures of a cooling serving surface and a heating serving surface, respectively. A cooling semiconductor device (which may comprise one or more Peltier devices) transfers

Aspects of the invention support simultaneous operation of a cooling side and a heating side of an apparatus to change the temperatures of a cooling serving surface and a heating serving surface, respectively. A cooling semiconductor device (which may comprise one or more Peltier devices) transfers heat from its top to its bottom while a heating semiconductor device (which may similarly comprise one or more Peltier devices) transfers heat from its bottom to its top. A heat pipe transfers waste heat from the cooling semiconductor device's bottom to the heating semiconductor device's bottom and waste cold from the heating semiconductor device's bottom to the cooling semiconductor device's bottom.

대표청구항 ▼

1. An apparatus having a cooling side for changing a first measured temperature of a cooling serving surface and a heating side for changing a second measured temperature of a heating serving surface, the apparatus comprising: a cooling semiconductor device transferring heat from a first top to a fi

1. An apparatus having a cooling side for changing a first measured temperature of a cooling serving surface and a heating side for changing a second measured temperature of a heating serving surface, the apparatus comprising: a cooling semiconductor device transferring heat from a first top to a first bottom of the cooling semiconductor device;a heating semiconductor device transferring heat from a second bottom to a second top of the heating semiconductor device;the cooling serving surface thermally coupled with the first top of the cooling semiconductor device;the heating serving surface thermally coupled with the second top of the heating semiconductor device; anda heat pipe comprising a first portion and a second portion, the first portion thermally coupled with the first bottom of the cooling semiconductor device, the second portion thermally coupled with the second bottom of the heating semiconductor device, the heat pipe transferring waste heat from the first bottom of the cooling semiconductor device and transferring waste cold from the second bottom of the heating semiconductor device. 2. The apparatus of claim 1, further comprising: a thermal barrier thermally isolating the heating side and the cooling side. 3. The apparatus of claim 1, wherein the heating semiconductor device comprises at least one Peltier device. 4. The apparatus of claim 1, wherein the cooling semiconductor device comprises at least one Peltier device. 5. The apparatus of claim 1, the apparatus further comprising: a heat exchange device; andthe heat pipe routing through the heat exchange device. 6. The apparatus of claim 1, wherein the heat pipe is directly coupled to the cooling semiconductor device and the heating semiconductor device. 7. The apparatus of claim 1, wherein the heating semiconductor device comprises a heating Peltier device, the cooling semiconductor device comprises a cooling Peltier device, and the heat pipe is thermally coupled to ambient air adjacent to a bottom of the cooling Peltier device and a bottom of the heating Peltier device. 8. An apparatus having a cooling side for changing a first measured temperature of a cooling serving surface and a heating side for changing a second measured temperature of a heating serving surface, the apparatus comprising: a cooling Peltier device transferring heat from a first top to a first bottom side of the cooling Peltier device;a heating Peltier device transferring heat from a second bottom to a second top of the heating Peltier device;the cooling serving surface thermally coupled with the first top of the cooling Peltier device;the heating serving surface thermally coupled with the second top of the heating Peltier device;a heat pipe comprising a first portion and a second portion, the first portion thermally coupled with the first bottom of the cooling Peltier device, the second portion thermally coupled with the second bottom of the heating Peltier device, the heat pipe transferring waste heat from the first bottom of the cooling Peltier device and transferring waste cold from the second bottom of the heating Peltier device; anda thermal barrier thermally isolating the heating side from the cooling side. 9. A serving apparatus comprising: a first portable serving tray having: at least one serving surface;at least one Peltier device configured to change a temperature of the at least one serving surface; anda portable electrical source providing electrical power to the at least one Peltier device, wherein the first portable serving tray is operable when positioned at different locations; anda rack configured to hold the first portable serving tray within the rack, wherein the first portable serving tray is removable from the rack. 10. The serving apparatus of claim 9, further comprising: a second portable serving tray; andthe rack separately holding the second portable serving tray, wherein a plurality of portable serving trays can be stacked within the rack.